Process for preparing tungsten-copper composite material with fine grain

A composite material and fine-grained technology, which is applied in the field of preparation of high-strength fully dense fine-grained tungsten-copper composite materials, can solve the problems of low density, no tensile strength, high tensile fracture strength, etc., to reduce powder inclusions and grain structure The effect of small size and simplification of the preparation process

Inactive Publication Date: 2005-01-19
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The W-Cu alloy material prepared by this method has a grain structure of 1-2 μm; a high tensile fracture strength of 700-800 MPa, an elongation of 3.5-5.0%; a density of more than 99%, overcoming the traditional W-Cu The shortcomings of composite materials such as low density and no mechanical properties such as tensile strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] ① Weigh 400g of tungsten powder and 100g of copper powder, mix the powder in a common ball mill for 12 hours to obtain the original mixed powder;

[0027] ②Put the original mixed powder into the ball mill cylinder of the high-energy ball mill, add 2500g tungsten balls, add 400ml liquid medium and 5g polyethylene glycol (PEG), seal it with a cover, vacuumize it to 1×10-2Pa, and then inject high Pure N 2 Protected atmosphere, ball milling for 20 hours to obtain powder liquid;

[0028] ③Dry the liquid powder to obtain ultrafine W-Cu composite powder with nanocrystalline structure; put the powder into a bag and seal it;

[0029] ④Compress the composite powder into a compact shape with a forming pressure of 300MPa to obtain a compact;

[0030] ⑤Put the compact into a sintering furnace for sintering, raise the temperature to 600°C at a rate of 10°C / min, keep it for 30 minutes, then raise it to 1200°C at a rate of 50°C / min, and keep it for 120 minutes; use H 2 As a protecti...

Embodiment 2

[0032] ①First weigh 350g of tungsten powder and 150g of copper powder, and mix the powder in an ordinary ball mill for 10 hours to obtain the original mixed powder;

[0033] ②Put the original mixed powder into the ball mill cylinder of the high-energy ball mill, add 2500g stainless steel balls, add 500ml liquid medium and 10g polyethylene glycol (PEG), seal with the cover, vacuumize to 1×10-2Pa, and then pass into high Protected by a pure Ar atmosphere, the ball milling time is 40 hours, and the powder liquid is obtained;

[0034] ③Dry the liquid powder to obtain ultrafine W-Cu composite powder with nanocrystalline structure; put the powder into a bag and seal it;

[0035] ④Compress the powder into a compact shape with a forming pressure of 500MPa to obtain a green compact;

[0036] ⑤Put the compact into the sintering furnace, raise the temperature to 600°C at a rate of 8°C / min, hold for 30 minutes, then raise the temperature to 1200°C at a rate of 30°C / min, and hold for 120 mi...

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Abstract

The invention relates to the field of powder metallurgy technology characterized in that, forming the powder with 200 MPa-500 MPa and feeding into sintering furnace, elevating the temperature to 400-700 deg. C. at the speed of 5-20 deg. C per minutes, heat preserving for 15-120 mins, elevating the temperature to sintering temperature of 1150-1350 deg. C. at the speed of 20-60 deg. C per minutes, heat preserving for 30-120 mins.

Description

technical field [0001] The invention relates to the field of manufacturing alloys by nano-material technology and powder metallurgy technology, especially the preparation of high-strength full-dense fine-grained tungsten-copper composite materials, which is to mix element powders and then add surfactants in liquid medium. High energy ball milling followed by sintering. Background technique [0002] W-Cu composite material has the advantages of W and Cu, its high density, low thermal expansion coefficient, good conductivity, good thermal conductivity, and is widely used as electrical contact material, electrode material and microwave power device substrate in modern microelectronic information industry. Chips, connectors, heat dissipation components and other electronic packaging materials and heat sink materials. The traditional methods of preparing W-Cu composite materials are generally high temperature liquid phase winding method and immersion method. The density of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/04C22C27/04
Inventor 范景莲黄伯云张兆森马运柱汪登龙吴恩熙
Owner CENT SOUTH UNIV
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