Dielectric material with low dielectric constant and low loss for microwave functional module and its prepn process

Abstract

The present invention relates to the dielectric material with low dielectric constant and low loss for microwave functional module and its preparation process. The preparation process includes mixing material including MgO, Al2O3, SiO2, ZnO and B2O3 and founding glass; quenching glass to obtain transparent vitreous body without recrystallization; wet ball grinding, adding TiO2 as temperature coefficient regulating agent, mixing, ball milling, drying, pressing into disc and sintering to obtain the material of the present invention. The MgO-Al2O3-SiO2-ZnO-B2O3 system with TiO2 temperature coefficient regulating agent has low dielectric constant, low loss, low temperature coefficient of frequency, low thermal expansion coefficient and other advantages, and may be used in producing various microwave modules.

Description

technical field [0001] The invention relates to a low dielectric and low loss dielectric material for a microwave functional module and a preparation method thereof, belonging to the technical field of material science. Background technique [0002] Micro-assembly technology is a new generation of electronic assembly technology developed on the basis of semiconductor integrated circuit technology, hybrid integrated circuit technology and surface mount technology (SMT) since the 1990s. Micro-assembly technology is to assemble various miniaturized chip components and semiconductor integrated circuit chips on high-density multi-layer interconnection substrates by using micro-welding and packaging technology to form a high-density, high-speed, high-reliability three-dimensional structure. technology of microelectronic components. Multi-chip module (MCM) is the representative product of micro-assembly technology at present. [0003] Multi-chip component is an advanced microelec...

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Problems solved by technology

Now such as commercialized LTCC materials are duPont951[ε=7.8, tanσ=1.5×10 -2 (1KHz)], Ferro A6 [ε=5.9, tanσ=2×10 -2 (10KHz)], HeraeusCT700 [ε=7.0, tanσ=2×10 -3 (1KHz)], Motorola T2000 [ε=9.1, tanσ=1×10 -3 (2GHz)], but the dielectric constant of these materials is relatively high, and the dielectric loss of the material is large at high frequencies, and it has gradually become difficult to meet the special requirements of microwave functional modules for high-frequency (above 5.8GHz) use.