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Solder resist composition of light-curing single liquid style and printing circuit board use same

A printed circuit board, photocurable technology, used in printed circuits, printed circuit manufacturing, photosensitive materials for opto-mechanical equipment, etc. Electrolytic tin plating is resistant to plating, has not yet reached practical use, etc., and achieves high reliability.

Active Publication Date: 2014-05-14
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this one-component type solder resist has excellent handling properties, but its heat resistance and electroless gold plating resistance are not stable compared with two-component type liquid solder resists, and has not yet been put into practical use.
In addition, of course, it does not have electroless tin plating resistance

Method used

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  • Solder resist composition of light-curing single liquid style and printing circuit board use same
  • Solder resist composition of light-curing single liquid style and printing circuit board use same

Examples

Experimental program
Comparison scheme
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Embodiment

[0039] Examples and comparative examples are given below to describe the present invention in detail, but the present invention is not limited to the following examples. In addition, the following "parts" mean "parts by weight" unless otherwise specified.

Synthetic example 1

[0041] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, 300.0 g of dipropylene glycol monomethyl ether as a solvent was heated to 100° C., and 172.0 g of methacrylic acid, 172.0 g of A mixture of ε-caprolactone-modified methacrylic acid (average molecular weight 344), 150.0 g of methyl methacrylate, 142.0 g of dipropylene glycol monomethyl ether, and 10.0 g of azobisisobutyronitrile as a polymerization catalyst, Then, it was stirred at 110° C. for 3 hours to deactivate the polymerization catalyst to obtain a copolymer resin solution. After cooling the resin solution, 170.0 g of 3,4-epoxycyclohexyl methacrylate (Cycroma-A400 produced by Daicel Chemical Industry Co., Ltd.), 3.0 g of triphenylphosphine, and 1.3 g of hydroquinone monomethacrylate were added. The base ether was heated up to 100°C and stirred to carry out the ring-opening addition reaction of epoxy. The obtained copolymer resin having two or more acryloyl groups and carb...

Synthetic example 2

[0043]In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, 276.0 g of dipropylene glycol monomethyl ether as a solvent and 8.0 g of azobisisobutyronitrile as a polymerization catalyst were added. Under a nitrogen atmosphere, heat to 80°C, add dropwise the monomers of 172.0g methacrylic acid, 100.0g methyl methacrylate and 114.0g ethyl methacrylate in about 3 hours, stir for another 1 hour, then heat up to At 115°C, the polymerization catalyst was deactivated to obtain a copolymer resin solution.

[0044] After lowering the temperature of the resin solution to 85-95°C, add 0.3g of methyl hydroquinone as a polymerization inhibitor and 2.0g of triphenylphosphine as a catalyst, slowly add 160.0g of glycerol methacrylate dropwise, and react for about 24 hours . A copolymer resin having two or more (meth)acryloyl groups and carboxyl groups in one molecule thus obtained has a weight-average molecular weight of 16,000, a non-volatile component...

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Abstract

To provide a photosetting / thermosetting one-liquid type solder resist composite which has excellent storage stability and workability and is superior in heat resistance, adhesiveness, electroless gold plating resistnace, electroless tin plating resistance, and electric characteristic, and which can be developed by alkali, and to provide a printed wiring board using the same. The photosetting / thermosetting one-liquid type solder resist composite contains a copolymer-based resin (A) having a carboxyl group which is made by adding a copolymer comprised of an unsaturated monobasic acid (a), and a compound (b) having one unsaturated group in one or more kinds of molecules, with a compound (c) which has an alicyclic epoxy group and an unsaturated group together within one molecular; a diluent (B); a photopolymerization initiator (C); a melamine (D) or its organic acid salt; and an inorganic filler (E).

Description

technical field [0001] The present invention relates to an alkali-developable photocurable / thermosetting one-component solder resist composition suitable for use as a permanent mask for a printed circuit board, which forms an image by developing with an aqueous alkali solution after exposure, and By heating and curing, a solder resist film excellent in heat resistance, adhesiveness, electroless gold plating resistance, electroless tin plating resistance, and electrical characteristics can be formed. The present invention also relates to a printed circuit board in which a solder resist pattern is formed using the above composition. Background technique [0002] At present, from the viewpoint of high precision and high density, almost all solder resists for printed circuit boards use liquid alkali-developing solder resists that form images by development after exposure, and then heat and cure to form a coating film. As such an alkali-developing type solder resist using a dilu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004H05K3/00
CPCB21J13/02B21J13/14
Inventor 椎名桃子岩佐爱子二田完永野琢
Owner TAIYO HLDG CO LTD