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Polishing liquid for chemical and mechanical polsihing of computer hard disc base sheet

A chemical mechanical and polishing liquid technology, applied in the direction of polishing compositions containing abrasives, water-based dispersants, etc., can solve the problems of unstable transmission of polishing liquid, difficult cleaning, environmental pollution, etc., to solve scratches and post-cleaning Difficult, low cost, less damaging effect

Inactive Publication Date: 2006-11-08
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As hard disk manufacturers improve the surface processing quality of memory hard disk substrates, the control of the final surface roughness, waviness and surface defects that can be obtained by existing chemical mechanical polishing solutions cannot meet the needs of the rapid development of memory hard disks. At present, the famous companies with the largest sales market in the world: the polishing solutions produced by Kao in Japan and Cabot in the United States are all strongly acidic, so in the polishing process, they cause corrosion to the machine, pollute the environment, and have certain harm to people. harm
In the prior art, Al2O3 is used as the abrasive, which is easy to cause scratches due to its high hardness; and its strong viscosity makes subsequent cleaning difficult
At the same time, the acidic polishing liquid is mainly mechanically based on chemical mechanical polishing. During the polishing process, due to the instability of the transmission of the polishing liquid, and the increase in the polishing rate and the increase in the flow rate of the polishing liquid, the polishing liquid is often enriched in the The edge of the substrate, which is prone to edge collapse

Method used

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Experimental program
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Effect test

Embodiment 1

[0035] The preparation process of polishing liquid of the present invention is briefly described with embodiment 1:

[0036] Take 40% concentration, 90kg of silica sol with a particle size of 25-30nm, 0.5kg of FA / O chelating agent, 0.5kg of organic base triethanolamine, 0.5kg of FA / O non-ionic active agent, 0.5kg of hydrogen peroxide, and 8kg of deionized water; In the silica sol under continuous stirring, slowly add the above-mentioned FA / O chelating agent, organic base triethanolamine, FA / O non-ionic active agent, hydrogen peroxide, and deionized water in sequence, and stir until it is uniform to obtain a computer hard disk base. Chip polish.

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PUM

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Abstract

The present invention discloses a kind of alkaline polishing liquid with nanometer silica aquasol as abrasive for polishing memory hard disc base wafer. The polishing liquid consists of silica sol 50-90 wt%, chelating agent 0.5-10 wt%, pH regulator 0.5-5 wt%, surfactant 0.5-5 wt%, oxidant 0.5-10 wt% and deionized water for the rest. The present invention has strong chelating effect under alkaline condition, abrasive of silica aquasol in small grain size, high concentration and high dispersivity, polishing process with chemical effect mainly, and chelating agent and activator the ensure the ultimate polishing quality.

Description

technical field [0001] The invention relates to the technical field of computer memory hard disk manufacture, and more specifically relates to a polishing liquid for computer hard disk substrates. Background technique [0002] In recent years, with the rapid development of computer technology, personal computers are constantly advancing in the direction of high performance and miniaturization. In order to adapt to this trend, the hard disk, which is the main component of computer data storage, is developing towards the direction of large capacity, high speed, small size and higher security, thus putting forward higher requirements for the hard disk substrate. Because the disk is directly related to the size of the hard disk capacity, increasing the capacity of a single disk, that is, increasing the storage density of the disk, has become the key to solving this problem. With the development of hard disk substrate technology, the flatness and roughness of the substrate surfa...

Claims

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Application Information

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IPC IPC(8): C09G1/02C09G1/04
Inventor 刘玉岭刘长宇牛新环康静业
Owner HEBEI UNIV OF TECH
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