High temperature copper alloy for lead frame and its making process

A lead frame and manufacturing method technology, applied in metal rolling, manufacturing tools, metal rolling and other directions, can solve the problems of low softening temperature, uneven alloy structure, unsatisfactory comprehensive performance of copper alloy for lead frame, etc. The effect of high temperature, fine dispersion of precipitates, and excellent hot workability

Active Publication Date: 2007-03-21
CHINA NON-FERROUS METALS PROCESSING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a copper alloy for high temperature resistant softening lead frame and its manufacturing method, aiming to effectively solve the problems of copper alloy for lead frame that the comprehensive performance does not meet the production requirements, the structure of the alloy is uneven, and the precipitates are finely dispersed. Especially the problem of low softening temperature

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment

[0048] The copper alloy No. 1~6 of composition (wt%) shown in table 1,

[0049] Reality

[0050] During the smelting process of the alloy, each element has different degrees of burning loss, and the burning loss rate is Fe: 1-2%, Zn: 1-3%, P: 2-5%, Cr: 15-25%, Re : 30-50%, the burning loss of each element should be supplemented in the process of batching; it is worth noting that, because the Cr element is easy to oxidize, the atmosphere protection should be carried out during the smelting process, and the protective gas is argon. At the beginning of smelting, first add electrolytic copper, copper-iron master alloy and copper-chromium master alloy, and start heating. After it melts, add 1 / 3 of copper-phosphorus master alloy and keep it warm for 1-3 minutes; then add zinc and rare earth, and wait for it to melt After holding it for 3-5 minutes, add the remaining 2 / 3 of the copper-phosphorus intermediate alloy, heat it for 10 minutes after full melting and cast; use a ...

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PUM

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Abstract

The present invention provides one kind of copper alloy for high temperature softening resistant lead frame and its making process. The copper alloy contains Fe 2.0-2.6wt %, Zn 0.05-0.1wt %, P 0.01-0.03wt %, Cr 0.01- 0.1wt %, and Re 0.01-1.5wt % except Cu. The making process includes the following steps: smelting in protecting atmosphere, casting and cooling at the speed of 80 deg.c/min between the liquid phase temperature and 400 deg.c; hot rolling the cast blank at 1000 deg.c, repeated cold rolling and double continuous annealing at 400-600 deg.c; cold rolling to reach thickness change over 50 % and final low temperature annealing at temperature below 450 deg.c. The copper alloy has excellent high temperature softening tolerance, high tensile strength, high elongation, high electric conductivity and other features and is excellent material for producing lead frame.

Description

technical field [0001] The invention relates to a copper alloy, in particular to a copper alloy for a high-temperature-resistant softening lead frame and a manufacturing method thereof, belonging to the technical field of nonferrous metals. Background technique [0002] In today's information age, the information industry represented by the Internet is sweeping the world, and the development of the electronic information industry plays a decisive role. In China, the electronic information industry has become a pillar industry, semiconductor devices are the cornerstone of this pillar industry, and the integrated circuit (IC) chip is the inner body, and the package is the outer body; IC is composed of chips, leads and lead frames, bonding materials , packaging materials and other parts. Among them, the main function of the lead frame is to provide a mechanical support carrier for the chip, and as a conductive medium to connect the external circuit of the IC, transmit electric...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/02B22D21/00B21B1/46B21B37/00C22C1/03C22F1/08H01L23/495H01L39/12H01B1/02
CPCH01L2924/0002
Inventor 杨春秀向朝建郭富安曹兴民慕思国汤玉琼
Owner CHINA NON-FERROUS METALS PROCESSING TECH CO LTD
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