Cu-P-Ag solder containing Ga, In and Ce
A technology of silver solder and copper phosphorus, which is applied in the field of metal materials and brazing materials in the field of metallurgy, copper phosphorus and silver solder, to achieve the effect of improving wettability
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Embodiment 1
[0008] 15.0% silver (Ag), 5.0% phosphorus (P), 0.1% gallium (Ga), 0.1% indium (In), 0.10% cerium (Ce), and the rest is copper (Cu). The elongation, solidus temperature, liquidus temperature, and brazing seam strength obtained by the above-mentioned composition ratio of the brazing base metal are all shown in Table 1. shows that the brazing joint tensile strength and brazing joint shear strength when brass-nickel base alloy is combined are σ b =325±25MPa and τ=270±30MPa).
Embodiment 2
[0010] 13.0% silver (Ag), 8.0% phosphorus (P), 0.1% gallium (Ga), 0.1% indium (In), 0.10% cerium (Ce), and the rest is copper (Cu). The elongation, solidus temperature, liquidus temperature, and brazing seam strength obtained by the above-mentioned composition ratio of the brazing base metal are all shown in Table 1. shows that the brazing joint tensile strength and brazing joint shear strength when brass-nickel base alloy is combined are σ b =325±25MPa and τ=270±30MPa).
Embodiment 3
[0012] 18.0% silver (Ag), 4.0% phosphorus (P), 0.001% gallium (Ga), 0.001% indium (In), 0.002% cerium (Ce), and the rest is copper (Cu). The elongation, solidus temperature, liquidus temperature, and brazing seam strength obtained by the above-mentioned composition ratio of the brazing base metal are all shown in Table 1. shows that the brazing joint tensile strength and brazing joint shear strength when brass-nickel base alloy is combined are σ b =325±25MPa and τ=270±30MPa).
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