Cu-P-Ag solder containing Ga, In and Ce

A technology of silver solder and copper phosphorus, which is applied in the field of metal materials and brazing materials in the field of metallurgy, copper phosphorus and silver solder, to achieve the effect of improving wettability

Active Publication Date: 2007-07-11
CHANGSHU HUAYIN FILLER METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Currently used copper-phosphorus-silver solder, such as BCu80AgP, contains about 15% silver in its chemical composition. ℃, the tensile strength of the brazing seam is 188MPa (copper), the shear strength of the brazing seam is 163MPa (copper), and the elongation of the solder (processed state) is 15.0%, so it still cannot meet many special brazing structures, special shapes and Special size such as ultra-wide thin strip solder preparation needs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] 15.0% silver (Ag), 5.0% phosphorus (P), 0.1% gallium (Ga), 0.1% indium (In), 0.10% cerium (Ce), and the rest is copper (Cu). The elongation, solidus temperature, liquidus temperature, and brazing seam strength obtained by the above-mentioned composition ratio of the brazing base metal are all shown in Table 1. shows that the brazing joint tensile strength and brazing joint shear strength when brass-nickel base alloy is combined are σ b =325±25MPa and τ=270±30MPa).

Embodiment 2

[0010] 13.0% silver (Ag), 8.0% phosphorus (P), 0.1% gallium (Ga), 0.1% indium (In), 0.10% cerium (Ce), and the rest is copper (Cu). The elongation, solidus temperature, liquidus temperature, and brazing seam strength obtained by the above-mentioned composition ratio of the brazing base metal are all shown in Table 1. shows that the brazing joint tensile strength and brazing joint shear strength when brass-nickel base alloy is combined are σ b =325±25MPa and τ=270±30MPa).

Embodiment 3

[0012] 18.0% silver (Ag), 4.0% phosphorus (P), 0.001% gallium (Ga), 0.001% indium (In), 0.002% cerium (Ce), and the rest is copper (Cu). The elongation, solidus temperature, liquidus temperature, and brazing seam strength obtained by the above-mentioned composition ratio of the brazing base metal are all shown in Table 1. shows that the brazing joint tensile strength and brazing joint shear strength when brass-nickel base alloy is combined are σ b =325±25MPa and τ=270±30MPa).

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Abstract

The invention relates to a copper phosphor silver solder which contains gallium, indium and cerium, wherein it comprises that: 13. 0%-18. 0% silver, 4. 0%-8. 0% phosphor, 0.001%-0.1% gallium, 0.001%-0.1% indium, 0.002%-0.10% cerium, and copper. The invention has the advantages that: it has better anti-drawing strength and anti-shearing strength, etc. It can be used to prepare wires and band; it can reduce the fusion point of alloy (Ag-Cu-Zn alloy), improve its welding property; and it adds rare-earth cerium to particle the crystals, and improve the plasticity to 18. 7-34. 7%.

Description

technical field [0001] The invention relates to a silver solder, in particular to a copper-phosphorus-silver solder containing gallium, indium and cerium which is suitable for brazing metal materials such as red copper, brass and nickel-based alloys, and belongs to the field of metal materials and metallurgy brazing material. Background technique [0002] The currently used copper-phosphorus-silver solder, such as BCu80AgP, contains about 15% silver in its chemical composition. ℃, the tensile strength of the brazing seam is 188MPa (copper), the shear strength of the brazing seam is 163MPa (copper), and the elongation of the solder (processed state) is 15.0%, so it still cannot meet many special brazing structures, special shapes and Special dimensions such as ultra-wide thin strip solder preparation needs. Therefore, the research and development of copper-phosphorus-silver solder with better performance than BCu80AgP and equivalent or similar silver content to BCu80AgP to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
Inventor 顾文华薛松柏顾立勇顾建昌
Owner CHANGSHU HUAYIN FILLER METALS
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