Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same

a silver nanoparticle and silver powder technology, applied in the direction of printed circuit aspects, semiconductor/solid-state device details, transportation and packaging, etc., can solve the problem of difficult to meet the size-refinement of powder particles and the dispersibility meant by powder particles nearly in a mono-disperse state, and the low-temperature sintering performance of silver nanoparticles cannot be used to the full, so as to reduce the amount of impurities contained, improve the effect of low-temperature sintering
US20050183543A1Inactive Publication Date: 2005-08-25MITSUI MINING & SMELTING CO LTD
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Patent Information

Authority / Receiving Office
US ยท United States
Patent Type
Applications(United States)
Current Assignee / Owner
MITSUI MINING & SMELTING CO LTD
Publication Date
2005-08-25
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

This invention is a silver powder having a low-temperature sintering performance and dispersibility, which allows the powder particles to be agglomerated to a small degree and be nearly in the monodisperse state. Employed is silver powder of fine silver particles each to which fine silver particles adhere, wherein fine silver particles of nano-order particle size are adhered to the surface of each silver powder particle. The powder particles of the silver powder of fine silver particles each to which fine silver particles adhere have excellent dispersibility. In the production of the silver powder of fine silver particles each to which fine silver particles adhere, a process of including the steps of: adding a silver nitrate and a neutralizing agent into a slurry of silver powder in a dispersing medium; dissolving the mixture while stirring to allow fine silver oxide particles to be precipitated on the surface of each silver powder particle; washing the resultant silver powder; and exposing the fine silver oxide particles to UV rays to reduce the same to fine silver particles.
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Description

TECHNICAL FIELD

[0001] The present invention relates to a silver powder made of silver particles, each to which fine silver particles adhere and a process of producing the same. BACKGROUND ART

[0002] Silver ink (silver paste) has been conventionally used not only for forming circuit boards by co-firing it with a ceramic substrate at a relatively high temperature but also for forming a wiring circuit on a printed wiring board, via-hole-fillers through such a board and adhesives for mounting electrical parts thereon by mixing and curing the silver ink (silver paste) with various types of resin ingredients, as described in the Patent Document 1. In the latter application, in general, an electrical conductivity has been obtained simply by mutually having the particles of silver powder touched, as a conductive filler without mutually sintering the particles.

[0003] However, there have been a demand in recent years for lowering an electrical resistance for conductor portions formed using ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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