Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto
a technology for etching apparatus and semiconductor samples, which is applied in the direction of fluid pressure measurement, instruments, coatings, etc., can solve the problems of forming a rate-limiting step in the etching process, the etching system is pulsed, and the nature of the system is cycli
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second embodiment
[0049] an apparatus according to the present invention is shown in FIG. 5. The apparatus shown in FIG. 5 includes second variable volume expansion chamber 30. Alternatively, variable volume expansion chambers 26 and 30 may be replaced by fixed volume expansion chambers having the same or different fixed volumes. The configuration shown in FIG. 5, whether using fixed or variable volume expansion chambers, allows for increased and variable capacity in terms of the amount of gas that can be transferred to etching chamber 27 during each cycle. Furthermore, if the expansion chambers shown in FIG. 5, whether fixed or variable volume, are each provided with separate fluid connections to sources 24 and 25, and if a separate fluid connection from expansion chambers to etching chamber 27 is provided, as is the case with the embodiment shown in FIG. 10, throughput may be increased by allowing one expansion chamber to fill while the other is being used to etch. Furthermore, additional expansion...
third embodiment
[0050] Referring to FIG. 6, the present invention is shown that utilizes multiple fixed volume expansion chambers of different volumes. The embodiment shown in FIG. 6 includes three fixed volume expansion chambers 36A, 35B and 36C connected to the gas valving manifold through valves 33, 34 and 37. In addition, valves 31, 32 and 35 are provided to allow fixed volume expansion chambers 36A, 36B and 36C to be evacuated using roughing pump 23. Although three fixed volume expansion chambers are shown in FIG. 6, it is possible to use two fixed volume expansion chambers or four or more fixed volume expansion chambers. One very flexible combination of fixed volume expansion chambers is to have, for example, three fixed volume expansion chambers such as 36A, 36B and 36C, one of volume A, a second of volume 2 times A, and a third of volume 4 times A. This arrangement allows, through selecting different combinations of fixed volume expansion chambers, a range of total volume from A, 2A, 3A, 4A...
fourth embodiment
[0051] the apparatus configuration is shown in FIG. 7. The apparatus shown in FIG. 7 is similar to that shown in FIG. 3 except that load lock components 18, 28, and 13 have been removed. In many research applications, the ability to place the wafers directly into the etching chamber 27 is acceptable, and in some cases, preferred over the automated handling which accompanies a load lock system. Also, as shown in FIG. 7, an additional nitrogen source 24 and associated valve 40 are provided and are intended to be used for flushing the apparatus.
[0052] Referring to FIGS. 3, 5, 6 and 7, a residual gas analysis, or RGA, apparatus 22 may be used to determine when the etch process is complete. RGA apparatus 22 is connected to etching chamber 27 through variable inlet valve 16. RGA apparatuses are well known and generally comprise a mass spectrometer or quadrupole analyzer, vacuum valves, a real time calibration independent-type gas unit, a control valve, and an RGA control unit. The RGA con...
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