This invention provides an integration method for self-
curling passive components. The
wafer-level front-end process for the self-
curling component begins with the deposition of
metal thin films on both the front and back of the substrate. Next, a dual-frequency
silicon nitride strain layer is deposited via
plasma chemical vapor deposition. A first positive
photolithography step followed by
inductively coupled plasma dry etching is used to pattern the mesa. Four negative
photolithography steps are then used to progressively pattern and deposit a
metal step layer, a
copper metal layer, a gold
electrode layer, and an
etching window layer. An oriented protective layer is deposited using atomic force deposition. Finally, a
xenon difluoride dry etching process is used to etch the sacrificial layer, releasing the film stress from the dual-frequency
silicon nitride strain layer and triggering
curling to obtain a self-curling
inductor. A modified layer consisting of voids, a high
dislocation density layer, and cracks is generated inside the
wafer using a specific
wavelength laser. The
wafer is then cleaved starting from this modified layer. Finally, UV desolventizing is used to obtain separable, micron-scale independent inductors.