Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide

a technology of curable composition and forming method, which is applied in the direction of optical waveguide light guide, photomechanical apparatus, instruments, etc., can solve the problems of complex steps requiring humidification treatment, light exposure dose, and difficulty in dipping in purified water after exposure, so as to improve pattern precision and improve pattern precision. , the effect of rapid timing

Inactive Publication Date: 2005-10-27
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0039] When a curing acceleration catalyst is further included as an additive, the effect described above is exhibited more prominently. This is attributed to the fact that the radiation curable composition can be more thoroughly cured at a lower exposure dose.
[0040] The improvement in pattern precision is assumed to result because the curing reaction of the radiation curable composition occurs before diffusion of the acid when an aprotic solvent is used as the curing acceleration solvent. Addition of a curing acceleration catalyst as an additive also further improves the pattern precision. This is attributed to the fact that the curing reaction occurs at a more rapid timing. This mechanism differ

Problems solved by technology

However, when the present inventors conducted a detailed investigation of patterning using such conventional insulating film materials imparted with photosensitive properties, it was found that when employing the photosensitive resin compositions comprising an alkali-soluble siloxane polymer, a photoacid generator and a solvent, from which the water and catalyst have been removed as disclosed in Patent documents 1 and 2, for example, a large light exposure dose is required in both cases, and therefore mass production cannot be advantageously accomplished.
In addition, when using the photosensitive polysilazane compositions comprising polysilazane and a photoacid generator, as disclosed in Patent documents 3 and 4, the light exposure dose is low but the steps of dipping in purified water after exposure or steps requiring humidification treatment are obviously complicated, making it difficult to obtain high pattern precision.
Nevertheless, since the acid diffusion controller inactivates (neutralizes) the acid, the curing property is impaired in cases with

Method used

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  • Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide
  • Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide
  • Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide

Examples

Experimental program
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Effect test

example 1

[0145] To a solution of 317.9 g of tetraethoxysilane and 247.9 g of methyltriethoxysilane in 1116.7 g of diethyleneglycol dimethyl ether there was added dropwise 167.5 g of nitric acid, prepared to 0.644 wt %, over a period of 30 minutes while stirring. After completion of the dropwise addition, reaction was conducted for 3 hours and then a portion of the produced ethanol and the diethyleneglycol dimethyl ether were distilled off under reduced pressure in a warm bath to obtain 1077.0 g of a polysiloxane solution. To 525.1 g of the polysiloxane solution there was added 74.9 g of diethyleneglycol dimethyl ether, and the mixture was dissolved by 30 minutes of stirring at room temperature (25° C.) to obtain a polysiloxane solution for a radiation curable composition. The weight-average molecular weight of the polysiloxane was 870 as measured by GPC. Next, 0.150 g of a photoacid generator (PAI-1001, product of Midori Kagaku) was added to 10.0 g of the radiation curable composition polysi...

example 2

[0147] To a solution of 317.9 g of tetraethoxysilane and 247.9 g of methyltriethoxysilane in 1116.7 g of diethyleneglycol dimethyl ether there was added dropwise 167.5 g of nitric acid, prepared to 0.644 wt %, over a period of 30 minutes while stirring. After completion of the dropwise addition, reaction was conducted for 3 hours and then a portion of the produced ethanol and the diethyleneglycol dimethyl ether were distilled off under reduced pressure in a warm bath to obtain 1077.0 g of a polysiloxane solution. To 525.1 g of the polysiloxane solution there was added 53.0 g of diethyleneglycol dimethyl ether, a tetramethylammonium nitrate aqueous solution prepared to 2.38 wt % (pH 3.6) and 3.0 g of water, and the mixture was dissolved by 30 minutes of stirring at room temperature (25° C.) to obtain a polysiloxane solution for a radiation curable composition. The weight-average molecular weight of the polysiloxane was 830 as measured by GPC. Next, 0.193 g of a photoacid generator (P...

example 3

[0149] To a solution of 74.77 g of tetraethoxysilane and 128.68 g of methyltriethoxysilane in 437.86 g of cyclohexanone there was added dropwise 58.71 g of nitric acid, prepared to 0.644 wt %, over a period of 10 minutes while stirring. After completion of the dropwise addition, reaction was conducted for 3 hours and then a portion of the produced ethanol and the cyclohexanone were distilled off under reduced pressure in a warm bath to obtain 343.62 g of a polysiloxane solution for a radiation curable composition. The weight-average molecular weight of the polysiloxane was 1020 as measured by GPC. Next, 0.042 g of a photoacid generator (PAI-101, product of Midori Kagaku) was added to 5.0 g of the radiation curable composition polysiloxane solution to prepare a radiation curable composition. The amount of component (a) used was 20 wt % with respect to the total radiation curable composition, and the amount of component (b) used was 0.8 wt % with respect to the total radiation curable...

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Abstract

The present invention provides a radiation curing composition comprising (a): a siloxane resin, (b): a photoacid generator or photobase generator, and (c): a solvent capable of dissolving component (a) and containing an aprotic solvent.

Description

RELATED APPLICATIONS [0001] This is a continuation-in-part application of application Ser. no. PCT / JP2004 / 14850 filed on Oct. 7, 2004, now pending.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a radiation curable composition, a storing method thereof, a forming method of a cured film, a patterning method, an use of a pattern, electronic components and an optical waveguide. [0004] 2. Related Background of the Invention [0005] As insulating films for use in LSIs and PDPs there have conventionally been used SiO2 films formed by CVD methods, and organic SOG (Spin On Glass) or inorganic SOG films formed by coating methods, because of their excellent heat resistance and electrical reliability. With insulating films of the prior art, however, it is impossible to directly form wiring grooves or contact holes, and usually a photoresist is patterned on the insulating film, followed by either dry etching with plasma or wet etching with a c...

Claims

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Application Information

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IPC IPC(8): C08G77/04C08L83/00G02B6/12G03F7/004G03F7/038G03F7/075H01L21/027
CPCG03F7/0045G03F7/0757G03F7/0048G03F7/004G03F7/0041G03F7/0042G03F7/0043G03F7/0047G03F7/075
Inventor SAKURAI, HARUAKIABE, KOICHI
Owner HITACHI CHEM CO LTD
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