Method for manufacturing polishing pad

a polishing pad and manufacturing method technology, applied in the direction of manufacturing tools, grinding devices, chemistry apparatus and processes, etc., can solve the problems of low productivity, large number of production steps, low productivity, etc., and achieve high productivity, high productivity, and manufacture a polishing pad
US20090093202A1Inactive Publication Date: 2009-04-09TOYO TIRE & RUBBER CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
TOYO TIRE & RUBBER CO LTD
Publication Date
2009-04-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.
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Description

REFERENCE TO RELATED APPLICATIONS

[0001] This application is a national stage application under 35 USC 371 of International Application No. PCT / JP2007 / 058493, filed Apr. 19, 2007, which claims the priority of Japanese Patent Application Nos. 2006-115890, filed Apr. 19, 2006, 2006-115897, filed Apr. 19, 2006, 2006-115904, filed Apr. 19, 2006, 2006-115907, filed Apr. 19, 2006, and 2007-0088388, filed Mar. 29, 2007, the contents of all of which prior applications are incorporated herein by reference.FIELD OF THE INVENTION

[0002] The present invention relates to a method for production of a (laminated) polishing pad by which the planarizing processing of optical materials such as lenses, reflecting mirrors and the like, silicon wafers, glass substrates for hard disks, aluminum substrates, and materials requiring a high degree of surface planarity such as those in general metal polishing processing can be carried out stably with high polishing efficiency. The (laminated) polishing pad obtain...

Claims

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