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Method for Electrochemically Depositing a Metal on a Substrate

Inactive Publication Date: 2011-06-09
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0033]A further great advantage of the present invention is the commercial availability of a huge number of different types of silica. Silica particles having a porosity and size in a wide range are available and can easily be provided with the silicon containing organic moieties as desired.

Problems solved by technology

Any corrosive attack takes place through these holes and will first cause dissolution of the less noble second (bright) nickel layer.
Corrosion gets visible when the produced holes are growing bigger, or when the protective action of the third nickel and chromium layers collapse if there is no supporting bright nickel anymore.
Without ensuring that the tiny pores in the last two metal layers are uniformly distributed, corrosion takes place less uniformly, rather soon producing only few but big holes easily visible with bare eyes which soon are able to even destroy the semi-bright nickel layer and attack the base material.
There are substantial disadvantages of the inorganic particles used to be incorporated into the third nickel layer: Particles from finely ground inorganic material have a greater specific density than water or than the nickel electrolyte and therefore have a strong tendency to sediment at the bottom of a plating tank.
To avoid sedimentation, strong air agitation is used which in turn is disadvantageous as all particles coming into contact with the surface of the part to be plated are immediately blown away though they should remain there in order to be incorporated into the nickel layer.
A disadvantage of SiO2 particles has been established of having the risk of clogging the anode bags.

Method used

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  • Method for Electrochemically Depositing a Metal on a Substrate

Examples

Experimental program
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Effect test

example 2

Preparation of Silica Particles Modified by Bonding an Aminosilane to the Surface Thereof

[0070]Syloid 244FP (Grace, peak volume 15.2% at 3.3 μm) was dried at 110° C. in an oven for two hours. The silica powder lost 4.2% weight. 5.0 ml (3-aminopropyl)triethoxysilane were dissolved in 100 ml chloroform (HPLC grade, water <0.001%) and poured over 15 g of the silica powder in a PP bottle which then was tightly closed. The opaque gel after short reaction time turned to a slurry. After one hour, the suspension was poured over a filter paper in a Büchner funnel, the chloroform was sucked off by vacuum and the remaining material was carefully washed with chloroform. The resulting material was again dried at 110° C. until its weight did not change anymore. The weight gain after the reaction was 9.5%.

example 2.1

[0071]The trial of example 2 was repeated with SD-530.

Initial weightOven temperatureDrying durationWeight loss[g][° C.][min][%]20.3000110604.8823.6294110905.40

Initial weight Reaction duration Weight gain [g][min][%]14.69482408.1716.3673 306.90

[0072]At different concentrations of the aminosilane, the weight gain obtained was only slightly different:

Amount of silane [ml]Weight gain [%]1.004.062.005.513.006.90

example 3

Preparation of Silica Particles Modified by Bonding an Aminosilane to the Surface Thereof and Use Thereof in a Nickel Electroplating Bath

[0073]Two kinds of particles were compared: a modified SD-530 as described in example 1—but with 5 ml aminosilane for 15 g powder, and a commercially used alumina-modified silica. From a stock of 5 l Watts nickel electrolyte, one liter was adjusted with saccharine, surfactant and brightener as is already described in example 1. In a 250 ml Hull cell, the adjusted electrolyte was used to plate micro-porous nickel within three minutes at 2 A cell current. The amount of pores versus current was then calculated. FIG. 1 shows the relationship obtained of the pore count vs. current density for the electrolyte solution according to the invention (A) and for a prior art electrolyte solution containing alumina and silica particles which are not modified with an organic moiety according to the invention. While pore count made by the alumina-containing materi...

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Abstract

To electroplate a metal layer which has silica particles dispersed therein, a method for electrochemically depositing a metal on a substrate, more specifically a method of forming a corrosion-resistant nickel multilayer on a substrate, are provided, wherein the method comprises the following method steps: (a) depositing a first nickel layer having a first electric potential, (b) depositing a second nickel layer having a second electric potential which is more negative than the first electric potential over the first nickel layer and (c) depositing a third nickel layer over the second nickel layer using a solution for electrochemically depositing a metal on a substrate, said solution containing ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles, said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with said solution.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method of forming a corrosion-resistant nickel multilayer on a substrate. Such corrosion-resistant nickel multilayer systems are used, e.g., in automotive industry, sanitary industry, furniture fitting industry, spectacles industry and for jewelry.BACKGROUND ART[0002]It is meanwhile state of the art to achieve corrosion resistance of plated articles mainly for the automotive industry by plating a multilayer nickel system on a substrate followed by a thin chromium layer. The last nickel layer in such a system produces tiny (micro-) pores in the chromium layer which are invisible for the bare eye but which are able to distribute a corrosive attack.[0003]The nickel multilayer normally consists of two or three nickel layers: an optional first layer having a rather noble (positive) electric potential, a second nickel layer which is a bright nickel layer and which is less noble than the first nickel layer and a third nickel la...

Claims

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Application Information

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IPC IPC(8): C25D15/00
CPCC25D15/02C25D5/14C25D5/627C25D5/623C25D13/02
Inventor MIDDEKE, HERMANN JOSEF
Owner ATOTECH DEUT GMBH
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