Semi-Bright Nickel Plating Bath and Method of Using Same

Inactive Publication Date: 2011-06-30
MACDERMID ACUMEN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018]It is an object of the present invention to provide a highly levele

Problems solved by technology

Highly compressed deposits can result in blisters, warping or cause the deposit to separate from the substrate, while deposits with high tensile stress can also cause warping in addition to cracking and reduction in fatigue strength.
However, such characteristics are short-lived, because such high coumarin concentrations also result in a high rate of formation of detrimental breakdown or degradation products.
These degradation products are objectionable in that they can cause uneven, dull gray areas that are not easily brightened by a subsequent bright nickel deposit, they can reduce the leveling obtained from a given concentration of coumarin in the plating bath, and they can reduce the beneficial physical properties of the nickel deposits.
It has also been suggested to reduce the concentration of coumarin in the bath in order to reduce degradation products and thus increase bath life, but such reduction in coumarin concentration is often accompanied by a loss of leveling and also makes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0066]A stock semi-bright nickel bath was prepared having 40 oz / gal nickel sulfate hexahydrate, 4.5 oz / gal nickel chloride hexahydrate and 5.5 oz / gal of boric acid. The solution was carbon and peroxide treated and filtered and the pH adjusted to 3.8 to 4.0. Thereafter, 0.3% v / v of a solution of 6% by weight di-hexylsulfosuccinate was added to prevent pitting in the subsequent deposits.

[0067]330 cm3 of this solution was added to a hull cell equipped with air agitation and heated to 135° F. 2 g / l of sodium acetate was added to the bath and a brass panel was plated at 2 amps for 15 minutes. The resulting deposit was overall gray with lustrous recesses. 0.1% of a 70 / 30 mixture of hexyne diol and butyne diol was added such that the aggregate concentration was 0.15 g / l. The resulting deposit was lustrous to semi-bright from about 0 to 40 ASF and dull above 40 ASF and very dull near the high current density (HCD) edge.

[0068]Another 0.1% of the mixture of hexyne diol and butyne diol was add...

example 2

[0071]A fresh semi-bright stock solution was added to the air agitated hull cell. Thereafter, 2.0 g / l of sodium mono chloroacetate was added to the bath and 0.2% of the mixture of hexyne diol and butyne diol was added such that the aggregate concentration was 0.30 g / l. A scratched brass panel was plated at 2 amps for 15 minutes. The resulting deposit was overall lustrous semi-bright with some slight dullness in the extreme HCD edge of the panel. The panel was over-plated with 5 minutes of bright as described above in Example 1 and the leveling was about 65% of a commercial coumarin bath.

example 3

[0072]Example 2 was repeated but the bath pH was increased to 4.6. The resulting deposit was a little brighter than that in Example 2. It was over-plated with bright nickel as above and leveling evaluated. The leveling of the deposit was almost equal to one plated from a full coumarin bath. The concentration of the mixture of hexyne diol and butyne diol was increased such that the aggregate concentration was 0.45 The leveling of the deposit was now equal to one plated from a commercial coumarin bath.

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Abstract

A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacefic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarin and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation-in-part of U.S. application Ser. No. 12 / 620,746, filed on Nov. 18, 2009, the subject matter of which is herein incorporated by reference in its entirety.FIELD OF THE INVENTION[0002]The present invention relates generally to semi-bright nickel plating baths that provide good properties with respect to leveling, ductility and stress and that are virtually sulfur-free.BACKGROUND OF THE INVENTION[0003]Bright nickel plating baths are used in the automotive, electrical, appliance, hardware and other industries. The most important functions of bright nickel plating are as an undercoating for chromium plating, helping finishers achieve a smooth bright finish and providing a significant amount of corrosion protection.[0004]For decorative plated parts that need a high level of basis metal corrosion protection, semi-bright nickel deposits are almost always used in conjunction with subsequent deposits of brig...

Claims

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Application Information

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IPC IPC(8): C25D3/12
CPCC25D3/16
Inventor TREMMEL, ROBERT A.
Owner MACDERMID ACUMEN INC
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