6results about How to "Eliminate separation" patented technology

The invention discloses a methylamine formamidino perovskite single crystal, a preparation method thereof and an X-ray detector, and belongs to the technical field of perovskite single crystal X-ray detectors. Methyl iodide amine, formamidino hydriodate and lead iodide are used as raw materials, anhydrous acetic acid is used as an additive, growth is carried out in a solvent through a seed crystal method, and the methylamine formamidino perovskite single crystal is obtained. Anhydrous acetic acid and formamidine generate hydrogen-bond interaction, formamidine is pulled to enter crystal lattices, so that phase separation is eliminated, acetate and Pb coordinate to delay formation of a lead-iodine framework, the speed of methylamine and formamidine entering the crystal lattices is balanced, meanwhile, the stability of a methylamine formamidine perovskite precursor solution is improved, stable growth of methylamine formamidine perovskite single crystals is achieved, and the methylamine formamidine perovskite single crystals are obtained. The single crystal has the advantages of high crystallinity, low defect density, large size and favorable X-ray response performance. The methylamine formamidine perovskite single crystal is high in controllability in the growth process, and the preparation method is high in operability, simple and easy to implement, short in preparation period, low in equipment requirement and low in cost.

This invention relates to the field of polymer materials technology, and discloses a high-elasticity rubber-plastic insulated cable composite material and its preparation method. The high-elasticity rubber-plastic insulation material comprises, by weight, 40-50 parts of EPDM rubber, 20-25 parts of polyolefin elastomer, 30-35 parts of modified calcined kaolin, 3-5 parts of composite antioxidant, 2-3 parts of silane coupling agent, and 1.5-2 parts of vulcanizing agent. During preparation, EPDM rubber and polyolefin elastomer are kneaded for 5-8 minutes, then modified calcined kaolin and silane coupling agent are added and kneaded for another 8-12 minutes, followed by the addition of composite antioxidant and vulcanizing agent and kneading for 3-5 minutes. Finally, the mixture is vulcanized in stages. The first stage vulcanization temperature is 155-160℃, and the second stage vulcanization temperature is 165-170℃. The insulating material prepared by this invention has excellent elasticity, outstanding resistance to flexural fatigue, stable insulation performance, high volume resistivity, excellent aging resistance, and tight interfacial bonding. It is suitable for use in high-voltage cable insulation layers, effectively extending the service life and stability of the cable.

The present application belongs to the technical field of food baking, and provides a mousse cake layering forming method, comprising: activating the upper surface of the Nth layer of mousse layer which has been solidified, removing the surface condensate frost and forming micro roughness; adjusting the temperature of the N+1th layer of mousse paste to be filled to be within ±3℃ of the surface temperature of the Nth layer of mousse layer; using a low shear force mode, filling the N+1th layer of mousse paste after temperature adjustment into the Nth layer of mousse layer along the inner wall of the mold or through a flow guide device to obtain a multi-layer mousse assembly; precooling the multi-layer mousse assembly at 4-8℃ for 10-20min, and then freezing and shaping at 18-25℃.

The application discloses a kind of multi-layer board-daily ceramic board strip tray automatic felt production process.The technical scheme of the application includes: large-area wooden multi-layer plywood (such as area 1.22m*1.22m and 2.44m*1.22m, etc.) is placed on automatic glue spreader, and cold pressure glue with thickness of 0.1-0.2mm is uniformly applied on single side; the same size felt piece is automatically laid on the glue-coated surface by using a mechanical tension hand system equipped with 6 independent clamping points; 0.5-1.0MPa segmented rolling is carried out by 8 groups of rotating columns to form a preliminary felt board; 90 preliminary felt boards are cold-pressed for about 6 hours under 5 or so standard atmospheric pressure to completely solidify; and finally, the required size strips are divided by an electric saw cutting platform. The application significantly improves production efficiency by about 20 times, reduces labor cost from 2.5-3 yuan per strip to 0.3 yuan, achieves 95% or more uniformity of glue application, stabilizes product quality, completely eliminates felt separation and cracking problems, significantly improves the protection effect of ceramic body, and provides an efficient and economical technical solution for the automation transformation of the ceramic industry.

The invention relates to the technical field of MOS semiconductors, and discloses a heterogeneous integration-based adaptive sensing, storage and calculation integrated chip and a preparation method thereof, the heterogeneous integration-based adaptive sensing, storage and calculation integrated chip comprises an IGCdO transistor and a TaOx memristor, the IGCdO transistor comprises a substrate, a hafnium aluminum oxide layer, a grid electrode, a source metal layer, drain electrode metal, an indium gallium cadmium oxide layer and a color-changing film; the grid electrode is in direct contact with the substrate, and the grid electrode is located under the indium gallium cadmium oxide layer; and the color-changing film covers the surface of the indium gallium cadmium oxide layer. According to the invention, by integrating the color-changing film with light adaptive capability, the wide bandgap oxide semiconductor phototransistor and the threshold switch memristor in a single chip, on-chip closed-loop processing of illumination perception, signal conversion and pulse coding is realized; physical separation and data migration among the sensing unit, the storage unit and the computing unit in a traditional visual system are eliminated, so that real sensing, storage and computing integrated collaboration is achieved on the device level, and system power consumption and processing delay are greatly reduced.