The invention discloses a high-activity chemical
copper plating solution and a chemical
copper plating method, and relates to the technical field of chemical
copper plating, and the chemical
copper plating solution comprises the following components: a copper
ion source, a biological
enzyme, a natural
polymer complexing agent, a pH
regulator and a stabilizer; according to the method, the specific bio-
enzyme is adopted as the chemical
copper plating catalyst, the remarkable
catalytic effect is shown, the bio-
enzyme has efficient selectivity and catalytic activity, reduction and deposition of copper ions can be accelerated under the mild condition, and therefore
reaction energy consumption and equipment requirements are reduced, meanwhile, use of chemical reagents is reduced, and the cost is reduced. In addition, natural
polymer complexing agents such as
chitosan and
sodium alginate have good
biocompatibility and degradability and can form a stable complex with copper ions, the stability and the
copper plating effect of the plating solution are enhanced, and by designing the natural
polymer complexing agent with a specific structure such as a hyperbranched structure, the copper plating effect of the plating solution is improved. And the complexing ability and the performance of the copper plating solution are further improved.