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Resin composite copper foil, printed wiring board, and production process thereof

A printed circuit board, resin composite technology, applied in the manufacture of printed circuit boards, the field of printed circuit boards, can solve problems such as heat resistance problems

Active Publication Date: 2010-06-09
MITSUBISHI GAS CHEM CO INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper-clad laminates using such copper foil with adhesive have problems in adhesive strength or heat resistance after moisture absorption

Method used

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  • Resin composite copper foil, printed wiring board, and production process thereof
  • Resin composite copper foil, printed wiring board, and production process thereof
  • Resin composite copper foil, printed wiring board, and production process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0055] The present invention is specifically explained below with reference to Synthesis Examples, Comparative Synthesis Examples, Examples and Comparative Examples.

Synthetic example

[0057] In a 2-liter three-necked flask with an anchor-type stirring rod made of stainless steel, a trap equipped with a nitrogen introduction tube and a stopcock, and a reflux condenser with a cooling tube with a ball mounted on the trap, add 117.68 g (400 mmol) 3,4,3',4'-biphenyltetracarboxylic dianhydride, 87.7 g (300 mmol) 1,3-bis(3-aminophenoxy)benzene, 4.0 g (40 mmol) γ-valerolactone, 4.8 g (60 mmol) pyridine, 300 g N-methyl-2-pyrrolidone (hereinafter referred to as "NMP"), and 20 g toluene. The mixture was heated at 180°C for 1 hour, then cooled to about room temperature. Add 29.42 g (100 mmol) of 3,4,3',4'-biphenyltetracarboxylic dianhydride, 82.12 g (200 mmol) of 2,2-bis{4-(4-aminophenoxy) Phenyl}propane, 200 g of NMP and 40 g of toluene, and these components were mixed at room temperature for 1 hour, and then heated at 180° C. for 3 hours to obtain a block copolymer polyimide with a solid content of 38%. The block copolymer polyimide had a formula (1): formula (2) r...

Embodiment 1-4

[0061] The block copolymer polyimide solution obtained in the synthesis example was further diluted with NMP to prepare a block copolymer polyimide solution with a solid content of 10%. According to the solid content ratio shown in Table 1, this block copolymer polyimide solution and bis(4-maleimidophenyl) methane (BMI-H, provided by K I KASEI KK) at 60 ° C They were melted and mixed for 20 minutes, whereby resin solutions were respectively prepared. The thus-prepared resin solutions were respectively coated on the matte surface of an electrolytic copper foil having a thickness of 12 µm (F0-WS foil, Rz=1.5 µm, supplied by Furukawa circuit foil Co., Ltd.) with a reverse roll coater. ), and then dried at 120° C. for 3 minutes and 160° C. for 3 minutes under a nitrogen atmosphere, and finally heat-treated at 300° C. for 2 minutes, thereby preparing resin composite copper foils respectively. On the other hand, 400 g of 2,2-bis(4-cyanooxyphenyl)propane was melted at 150°C and allo...

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Abstract

A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring boardobtained by the above process.

Description

technical field [0001] The present invention relates to a resin composite copper foil for a printed wiring board, a method for producing the resin composite copper foil, a copper clad laminate using the resin composite copper foil, a printed wiring board using the copper clad laminate, and the printed wiring board manufacturing method. The resin-composite copper foil obtained by the present invention has excellent adhesive strength, so that a copper foil having an extremely small surface roughness can be used. Copper-clad laminates using the above-mentioned resin-clad copper foil are suitable as high-density printed wiring boards containing fine circuits. In addition, the printed wiring board obtained by the method of the present invention has excellent copper plating adhesion strength or heat resistance, so the printed wiring board is suitable as a high-density printed wiring board containing fine circuits. Background technique [0002] In recent years, it has been requir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/38H05K3/46B32B7/10
Inventor 野崎充岳杜夫田中泰夫永田英史菊地靖雄矢野真司
Owner MITSUBISHI GAS CHEM CO INC
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