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Metal wiring method based on mask print

A metal wiring and mask technology, applied in the field of metal wiring based on mask printing, can solve the problems of poor metal deposition positioning selectivity, immature development of the full additive method, and difficult substrate processing, etc., and achieve uniform and stable body characteristics. Promotion, close effect

Inactive Publication Date: 2007-10-10
FUDAN UNIV
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Problems solved by technology

[0012] In view of the problems that metal wiring technology relies on mold making and photolithography, high fixed investment, long cycle time, high unit cost, etc., and the development of non-lithography full additive method is not mature enough, some substrates are difficult to process, and some metal deposition positioning is poor. , the present invention proposes a metal line distribution method based on mask printing

Method used

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  • Metal wiring method based on mask print
  • Metal wiring method based on mask print
  • Metal wiring method based on mask print

Examples

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Embodiment Construction

[0034] 1. PI resin surface processing copper circuit

[0035] Surface treatment: The PI resin substrate laminated with 50 micron copper foil is used as the substrate. First, use acetone to remove the copper surface grease, and then immerse it in dilute acid to remove the surface oxide layer. After rinsing with water, wipe the surface with a dry cloth for use.

[0036] Modifications to office printers: For HP laser printers, remove the toner cartridge and empty it before use. The mixed powder of thermosetting resin and activated carbon is used to replace the toner, and the mass ratio of the thermosetting resin powder is 10% to 90%. Install the toner cartridge, commission it, run the self-cleaning program, and remove excess toner.

[0037] Use Protel software to draw circuit graphics on the computer, and the toner flux is set to 10% to 100%. The paper type is "heavy paper", cancel the ink saving mode, adjust the fixed position of the PI resin sheet on the printing paper, print...

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Abstract

The invention is a mask-print based metal wiring method. It comprises: using a board coated with or pressed with a metal layer as the basal body, and using an etching resistance protectant as the print materials; using a printer as the apparatus for positioning and distributing the print materials; constructing a patterned protection layer on the metal layer; using chemical etching approach to form the metal lines and pattern on the basal body.

Description

technical field [0001] The invention belongs to the technical field of metal wiring and metal forming, and in particular relates to a metal wiring method based on mask printing. Background technique [0002] Metal wiring technology refers to the process technology of processing pre-set lines or patterns by chemical deposition or etching. It is mainly used in electronic processing (especially microelectronics). It is the basis for the interconnection of components on the substrate and the transmission of signals to construct a complete system. Shaped electrode) is an indispensable process step in the preparation process; as a metal patterning technology, it is also an important measure for surface decoration and surface modification. Therefore, metal wiring technology plays a very important role in practical applications. [0003] The most rapid development in the field of metal wiring technology is the circuit forming process of integrated circuits represented by the manuf...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K1/09
Inventor 王金意黄贝贝蔡文斌
Owner FUDAN UNIV
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