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Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern

A resin composition, inorganic particle technology, applied in photosensitive materials for optomechanical equipment, microlithography exposure equipment, optics, etc., can solve the problem of poor thermal decomposition of photosensitive compositions, large shrinkage, screen printing Incompatibility and other problems, to achieve the effect of excellent thermal decomposition and less shrinkage

Active Publication Date: 2007-10-24
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the above-mentioned screen printing method, as the panel becomes larger and more precise, the demand for pattern accuracy becomes very strict, and there is a problem that it is not compatible with the usual screen printing.
In addition, in the above-mentioned photocopying method, although the accuracy of the pattern is excellent, there are problems such as poor thermal decomposition and large shrinkage of the photosensitive composition observed in the firing process.

Method used

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  • Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern
  • Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern
  • Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern

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Embodiment

[0205] Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not limited at all by these Examples.

[0206] First, the measurement methods of the weight average molecular weight (Mw), the measurement method of the glass transition temperature, the weight loss analysis, the evaluation of the pattern after development, and the evaluation of the pattern after firing will be described. In addition, the density|concentration (%) in an Example and a comparative example is "weight%" unless otherwise indicated, and "part" means a "weight part".

[0207] (Measurement method of weight average molecular weight (Mw))

[0208] Mw is the polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography (GPC) ("HLC-8220GPC" by Tosoh Corporation). In addition, the GPC measurement was carried out using "TSK guardcolumn SuperHZM-M" manufactured by Tosoh Corporation as a GPC column, using THF (tetrahydrofuran) ...

Synthetic example 1

[0218] Methyl methacrylate (MMA), benzyl methacrylate (BzMA), 2-hydroxyethyl methacrylate (HEMA), methacrylic acid (MAA), azobisisobutyronitrile (AIBN) as The weight ratios shown in Table 1 were metered and mixed, and the resulting solution was put into an autoclave equipped with a stirrer, and stirred in 150 parts of propylene glycol monomethyl ether (PGME) until uniform under a nitrogen atmosphere. Then, after superposition|polymerization was carried out at 80 degreeC for 4 hours, and further 1 hour of polymerization reaction was continued at 100 degreeC, it cooled to room temperature, and alkali-soluble resin (A1) was obtained. Table 2 shows the yield, weight average molecular weight, glass transition temperature, temperature of 10% weight loss rate and weight loss rate of 450° C. of the alkali-soluble resin (A1).

Synthetic example 2

[0220] Except having changed the ratio of an acrylic monomer as shown in Table 1, it reacted similarly to the synthesis example 1, and obtained alkali-soluble resin (A2). Table 2 shows the yield, weight-average molecular weight, glass transition temperature, temperature of 10% weight loss rate and weight loss rate of 450° C. of the obtained alkali-soluble resin (A2). In addition, the weight loss analysis graph of the alkali-soluble resin (A2) is shown in FIG. 3 .

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Abstract

The invention relates to a photosensitive resin composition containing inorganic particles, a photosensitive film, and a method for forming an inorganic pattern. A photosensitive compound is provided which is capable of forming a high precision pattern, has an organic component with good heat resolvability, is shrinked after bing baked, and contains inorganic particles. The photosensitive resin composition containing inorganic particles in the invention, is characterised by containing inorganic particles, alkali-soluble resin, at least two (methyl) acryl in a molecule, photo curative and photopolymerization initiator having at least a bond selected from acetal bond, hemiacetal ester bond and monosulfur acetal bond.

Description

technical field [0001] The present invention relates to a photosensitive resin composition containing inorganic particles, a photosensitive film and a method for forming an inorganic pattern. More specifically, in a display panel having dielectrics, electrodes, resistors, phosphors, spacers, color filters, and black matrices constituting each display cell of a flat panel display, organic components are excellent in thermal decomposition and can be suitably used. A photosensitive composition containing inorganic particles for forming high-precision patterns, a photosensitive film having a photosensitive resin layer made of the composition, and a method for forming an inorganic pattern using the composition or the photosensitive film. Background technique [0002] In recent years, there has been an increasing demand for higher density and higher definition of pattern processing in circuit boards and displays. Among the displays that have increased such requirements, especiall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/20G03F7/26G02B5/20G03F7/004G03F7/027G03F7/033H01J9/02H01J9/227H01J11/22H01J11/34H01J11/36H01J11/38H01J11/42H01J11/44
CPCG03F7/0007G03F7/0047G03F7/027G03F7/028
Inventor 工藤和生增子英明
Owner JSR CORPORATIOON
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