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Cleaning fluid for removing surface particles of semiconductor material and cleaning method therefor

A technology of surface particles and semiconductors, applied in the field of cleaning agents, can solve the problems of easy damage repair rate, expensive equipment, short storage time, etc., and achieve the effect of improving uniform corrosion, good cleaning effect, and reducing surface tension

Inactive Publication Date: 2008-01-02
天津晶岭电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, companies such as SPEEDFAM and MEMC, which are more advanced in the United States, use a double-sided brushing machine to quickly scrub the semiconductor materials after polishing and before the particles form chemical bonding and adsorption, so as to obtain a relatively clean surface, but the storage time is short (it must be scrubbed within 2 hours) , otherwise the particles exceed the standard and are unqualified), the equipment is expensive (300,000 to 400,000 US dollars each), low in efficiency (scrub one by one, multiple sets per unit), easy to cause damage (high repair rate), and chemical bonding presence of adsorption

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: A cleaning solution for removing particles on the surface of semiconductor materials, which is characterized in that it is composed of an organic base, a nonionic surfactant and pure water. The cleaning agent mentioned above includes four components:

[0023] Component I: select triethanolamine in the organic base, (HOCH 2 CH 2 ) 3 ;

[0024] Component II: select the fatty alcohol polyoxyethylene (20) ether of the polyoxyethylene ether surfactant in the nonionic surfactant, RO(CH 2 CH 2 O) 20 H, R=C 12-18 h 25-37 ;

[0025] Component III: Select the condensation product of ethylene oxide and higher fatty alcohol (JFC) of polyoxyethylene ether penetrant in nonionic surfactants, R-O(C 2 h 4 O) n H;

[0026] Component IV: Pure H 2 O;

[0027] The ratio of the four components is: component I accounts for 30% of the total weight, component II accounts for 10% of the total weight, component III accounts for 5% of the total weight, and component IV ...

Embodiment 2

[0028] Embodiment 2: A cleaning solution for removing particles on the surface of semiconductor materials, which is characterized in that it is composed of an organic base, a nonionic surfactant and pure water. The cleaning agent mentioned above includes four components:

[0029] Component I: select tetramethylammonium hydroxide in the organic base;

[0030] Component II: Select polyoxyethylene sorbitan monooleate (Tween-80) as a polyoxyethylene ether surfactant in the nonionic surfactant;

[0031] Component III: select octanol polyoxyethylene ether of polyoxyethylene ether penetrating agent in non-ionic surfactant;

[0032] Component IV: Pure H 2 O;

[0033] The ratio of the four components is: component I accounts for 25% of the total weight, component II accounts for 8% of the total weight, component III accounts for 5% of the total weight, and component IV accounts for 62% of the total weight.

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PUM

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Abstract

The invention discloses a cleaning fluid to remove surface particle of the semiconductor material and cleaning method, which comprises the following parts: 22 %-40% organic base, 3%-15% surface activator and 45%-75% pure water. The cleaning method comprises the following steps: (1)cleaning through the cleaning fluid; (2)using deionized water ultrasound; (3)using deionized water ultrasound; (4)spraying; (5)drying. The invention improves the uniform corrosiveness of the cleaning fluid to ensure the consistency, which protects environment due to adopting the material without damaging the ozone layer.

Description

(1) Technical field: [0001] The invention relates to a cleaning agent, in particular to a cleaning solution for removing particles on the surface of semiconductor materials and a cleaning method thereof. (two) background technology: [0002] With the rapid increase in the integration level of integrated circuits, the feature size of devices in integrated circuits has been continuously reduced, and the requirements for surface contamination of semiconductor materials have become more stringent. In the preparation process of very large scale integrated circuits, the surface state and cleanliness of semiconductor materials are one of the most important factors affecting the quality and reliability of devices. Therefore any particle contamination on the surface of the semiconductor material will lead to serious consequences. For example: Particle pollution is the most common pollution during the operation of integrated circuit manufacturing, packaging and masking processes. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/66C11D3/30H01L21/304
Inventor 仲跻和李家荣周云昌吴亮
Owner 天津晶岭电子材料科技有限公司
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