Positive dry film photoresist and composition for preparing the same

Abstract

A positive type photoresist resin film contains a support film and a positive photoresist resin layer laminated over the support film. The photoresist layer may be formed from a composition containing a resin, a photosensitive compound, and a first solvent having a boiling point sufficiently high such that a second solvent can be removed from the composition by heating while the first solvent is substantially retained in the composition.

Description

technical field [0001] Positive dry film photoresist (photoresist) contains at least two solvents and has excellent physical properties, such as high film speed (or photosensitive speed), development contrast, sensitivity, resolution and / or adhesion to substrate attached. Background technique [0002] Photoresists and photoresist films are used to prepare highly integrated semiconductors such as integrated circuits (ICs); printed circuit boards (PCBs) and electronic display devices such as cathode ray tubes (CRTs), color liquid crystal displays (LCDs) and organic electroluminescent displays (EL or ELD). These devices are fabricated using photolithography and photofabrication techniques. The photoresist film requires a resolution sufficient to form a pattern with very thin lines and small spatial regions of not more than 7 μm. [0003] By chemically modifying the photoresist resin or the molecular structure of the photoresist, the physical properties of the photoresist can...

AI Technical Summary

Problems solved by technology

[0011] However, these liquid photoresist compositions often generate insoluble material (i.e., undergo sedimentation) during storage, resulting in reduced resolution and sensitivity

For example, as disclosed in Japanese Patent Laid-Open No. 3-249654, an alkali-soluble novolak resin and a 1,2-naphthoquinonediazido-4-sulfonate-containing and acid-decomposable Composition of free radical materials; and as disclosed in Japanese Patent Laid-Open No. 6-202320, comprising alkali-soluble novolak resin, 1,2-naphthoquinonediazido-4-sulfonic acid polyhydroxybenzophenone Both ester and acid-decomposable radical compositions have problems such as loss of resolution and sensitivity due to settling during storage, poor pattern design due to residues on the coated surface, etc.

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