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Photosensitive composition, method for forming pattern, and permanent pattern

A technology of photosensitive composition and polymerizable compound, which is applied in the field of photosensitive composition, pattern forming method and permanent pattern, and can solve the problem of insufficient solder heat resistance and retort resistance, deterioration of coating film and substrate adhesion, etc. problem, to achieve the effect of excellent pressure cooking resistance and improved flexibility

Inactive Publication Date: 2008-01-30
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at this time, although the solder resist ink composition based on the novolak type epoxy resin has excellent heat resistance in its structure, it has the disadvantages that the cured film is hard and brittle, and the gap between the film and the substrate Adhesion deterioration
[0007] According to these photosensitive resin compositions, a flexible film can be obtained, but the current status is that other properties required for resist ink compositions, such as dilute alkali developability, solder heat resistance, and reliability as a substrate The pressure retort property of the important performance is not yet sufficient, and it is desired to provide a photo-soldering resist ink composition for circuit boards widely having these characteristics as soon as possible

Method used

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  • Photosensitive composition, method for forming pattern, and permanent pattern
  • Photosensitive composition, method for forming pattern, and permanent pattern
  • Photosensitive composition, method for forming pattern, and permanent pattern

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0459] -Synthesis of polyurethane resin having carboxyl group-

[0460] Dissolve 125 g of 4,4'-diphenylmethane diisocyanate represented by the following structural formula (1) and 67 g of 2,2-di(hydroxymethyl)propionic acid represented by the following structural formula (2) in a 500 ml three-necked flask In 290ml of dioxane. Then, 1 g of N,N-diethylaniline was put into this solution, and after stirring for 6 hours under reflux of dioxane to react it, 4 L of water and 40 mL of acetic acid were gradually added to the obtained solution. solution to precipitate the polymer. 185 g of polyurethane resin (A) was synthesized by subjecting the obtained solid to vacuum drying. The acid value of this polyurethane resin (A) was 138 mgKOH / g. The weight average molecular weight (polystyrene conversion) measured by GPC was 28,000.

[0461] [chemical 4]

[0462] Structural formula (1)

[0463] Structural formula (2)

Synthetic example 2

[0465] -Synthesis of polyurethane resin having carboxyl group-

[0466] In Synthesis Example 1, a polyurethane resin (B) was synthesized in the same manner as in Synthesis Example 1 except that a diisocyanate compound represented by the following structural formula (3) was used instead of 4,4'-diphenylmethane diisocyanate. The acid value of this polyurethane resin (B) was 137 mgKOH / g.

[0467] [chemical 5]

[0468] Structural formula (3)

Synthetic example 3

[0470] -Synthesis of polyurethane resin having carboxyl group-

[0471] In Synthesis Example 1, a polyurethane resin (C) was synthesized in the same manner as in Synthesis Example 1 except that a diisocyanate compound represented by the following structural formula (4) was used instead of 4,4'-diphenylmethane diisocyanate. The acid value of this polyurethane resin (C) was 126 mgKOH / g.

[0472] [chemical 6]

[0473] Structural formula (4)

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Abstract

The object of the present invention is to provide a photosensitive composition, a method for forming a pattern, and a permanent pattern. The flexibility is greatly improved, and it is suitable for the manufacture of flexible printed circuit boards. Therefore, the photosensitive composition contains at least (A) a polyurethane resin having a carboxyl group, (B) a polymerizable compound, (C) a photopolymerization initiator, and (D) a thermal crosslinking agent, and the (A) polyurethane resin having a carboxyl group The resin is preferably a form obtained by reacting a diisocyanate compound represented by the following structural formula (I) and a diol compound represented by either the following structural formula (II) or the following structural formula (III).

Description

technical field [0001] The invention relates to a photosensitive composition, a pattern forming method and a permanent pattern. The photosensitive composition has excellent developability, solder heat resistance, folding resistance and moisture resistance, and the flexibility of the cured film is greatly improved. It is suitable for In the manufacture of flexible printed circuit boards. Background technique [0002] In recent years, solder resists in various printed circuit boards are shifting from thermosetting liquid resist resins for screen printing to liquid photo-solder resist inks for dilute alkaline development. For example, Patent Document 1 proposes a solder resist ink composition containing a photocurable resin obtained by reacting a saturated or unsaturated polybasic acid anhydride with a reactant of a novolak-type epoxy compound and an unsaturated monocarboxylic acid. , a photopolymerization initiator, a diluent, and an epoxy compound having two or more epoxy gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/035C08G18/32G03F7/004G03F7/20H01L21/027C08G18/08C09D175/16H05K3/28
CPCC08G18/0823C09D175/16G03F7/035H05K3/287
Inventor 岩崎政幸
Owner FUJIFILM CORP
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