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Laminated freezing abrasive material polishing pad used for chemico-mechanical polishing and method of producing the same

A layered freezing and chemical mechanical technology, applied in the direction of wheels, abrasives, manufacturing tools, etc. of the working part with flexibility, can solve over-polishing, reduced ability to accommodate slurry and remove waste, and unstable processing and other problems, to achieve the effect of preventing thermal stress, superior planarization ability, and environmental protection

Inactive Publication Date: 2008-02-27
海安常科技术转移中心有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this traditional CMP technology is widely used in ultra-precision surface processing, it also shows certain shortcomings in practical applications: (1) The traditional CMP is based on three-body (free abrasive, polishing pad and silicon wafer) wear Mechanism, process parameters are many, the processing process is unstable, it is difficult to realize automatic control, and the production efficiency is low
(2) Since the polishing pad is an organic fabric with certain elasticity, the selectivity of material removal during polishing is not high, resulting in defects such as over polishing, dishing, and nitride erosion
(3) Part of the free abrasive will be embedded on the surface of the film layer after polishing, which is not easy to clean
Moreover, the composition of the slurry is complex, and the removal of the residual slurry on the polished surface is a difficult problem in post-CMP cleaning.
(4) Due to the uneven distribution of abrasive particles between the polishing pad and the workpiece, the material removal rate of each part of the workpiece is inconsistent, which affects the surface flatness
(5) During the polishing process, the polishing pad undergoes plastic deformation and gradually becomes smooth, or the microporous surface of the polishing pad surface is blocked, which reduces the ability to accommodate slurry and remove waste, resulting in a decrease in material removal rate over time
(7) Polishing slurry management and waste slurry treatment are also quite troublesome
(8) The rough polishing and fine polishing processes are separated, and the workpiece needs to be clamped multiple times, and the machining positioning reference of the workpiece will change, thus affecting the final machining accuracy and efficiency

Method used

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  • Laminated freezing abrasive material polishing pad used for chemico-mechanical polishing and method of producing the same

Examples

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Embodiment 1

[0041]A CMP frozen polishing pad for polishing ultra-thin materials. There are four layers from the bottom up: the first layer is a deionized water layer, the second layer is a nano-abrasive layer, the third layer is also a deionized water layer, and the fourth layer It is a micron abrasive layer. The first layer is composed of 100g of deionized water. First put the deionized water into the mold, then put the above mold into the low-temperature test box, freeze it at -30°C for 40 minutes and keep it warm for 10 minutes to freeze to form the second layer of the polishing pad. One layer; the second layer consists of 100g of SiO with a particle size of 20nm 2 (or CeO 2 ) abrasive, 14g of additives (it consists of polyhydroxydiamine 4g, alkyl alcohol polyoxyethylene ether 4g, ethylenediaminetetraacetic acid disodium salt 2g, cetyltrimethylammonium chloride or sodium hexametaphosphate (Dispersant) 4g and the balance of 86% water (or 45% water-containing ethanol). Before use, mix ...

Embodiment 2

[0043] A CMP frozen polishing pad for polishing ultra-soft materials. There are four layers from the bottom to the top: the first layer is a deionized water layer, the second layer is a nano-abrasive layer, the third layer is also a deionized water layer, and the fourth layer It is a micron abrasive layer. The first layer is composed of 200g of deionized water. First put the deionized water into the mold, then put the above mold into the low-temperature test box, freeze it at -30°C for 50 minutes and keep it warm for 10 minutes to freeze to form the second layer of the polishing pad. One layer; the second layer consists of 100g of SiO with a particle size of 50nm 2 (or nano-CeO 2 ) abrasive, 14g of additives (it consists of polyhydroxydiamine 4g, alkyl alcohol polyoxyethylene ether 4g, ethylenediaminetetraacetic acid disodium salt 2g, cetyltrimethylammonium chloride or sodium hexametaphosphate (Dispersant) 4g and the balance of 86% water (or 45% water-containing ethanol). Be...

Embodiment 3

[0045] A CMP frozen polishing pad for polishing superhard materials. There are four layers from the bottom up: the first layer is a deionized water layer, the second layer is a nano-abrasive layer, the third layer is also a deionized water layer, and the fourth layer is a deionized water layer. It is a micron abrasive layer. The first layer is composed of 150g of deionized water. First put the deionized water into the mold, then put the mold into the low-temperature test box, freeze it at -35°C for 45 minutes and keep it warm for 10 minutes to freeze to form the second layer of the polishing pad. One layer; the second layer consists of 210g of SiO with a particle size of 100nm 2 (or nano-CeO 2 ) Abrasives, 27g additives (which consist of polyhydroxydiamine 9g, alkyl alcohol polyoxyethylene ether 9g, ethylenediaminetetraacetic acid disodium salt 3g, cetyltrimethylammonium chloride or sodium hexametaphosphate (Dispersant) 6g and the balance of 63 water (or water-containing eth...

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Abstract

The invention discloses a laminated freezing abrasive polishing pad and making method through chemically mechanic polishing, which is characterized by the following: adopting liquid as adhesive; laminating to mix deionized water, nanometer grinding material and micrometer grinding to form the polishing pad; fitting for polishing each kind of thin typed working piece such as heat sensitivity material, soft material and crystal material. The invention has the advantages of simple preparation, low manufacturing cost, high manufacturing efficiency and precision, which improves the technical control ability and protects environment.

Description

technical field [0001] The invention relates to a layered frozen abrasive polishing pad for chemical mechanical polishing and a preparation method thereof, in particular to a method of using liquid as a binder to bond deionized water, nano-abrasives and micron-abrasives respectively through layered freezing The formed polishing pad and its preparation method are, in particular, a layered frozen abrasive polishing pad for chemical mechanical polishing and its preparation method. Background technique [0002] As we all know, the traditional CMP (Chemical Mechanical Polishing) system is composed of three parts: a rotating workpiece holding device, a workbench carrying a polishing pad, and a polishing liquid (slurry) supply system. During polishing, the rotating workpiece is pressed against the polishing pad that rotates with the worktable with a certain pressure, while the polishing liquid composed of submicron or nanometer abrasives and chemical liquid flows between the workpi...

Claims

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Application Information

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IPC IPC(8): B24D13/14B24D3/00B24D17/00B24D99/00
Inventor 左敦稳孙玉利卢文壮李军朱永伟
Owner 海安常科技术转移中心有限公司