Aryne modified resin containing silicon

Abstract

The invention relates to a modified resin with silicon aryne modified by aryne ethynylbenzene and oxazine compound, which is copolymerized by 50-95wt% aryne ethynylbenzene and 5-50wt% oxazine compound, wherein the silicon aryne polymeric compound has the structure as formula (1). The invention improves the modified resin including silicon aryne to be good thermostable property, which displays good dynamic property and fabric recombination property. R is hydrocarbyl group of fatty group or aromatic and R' is hydrocarbyl group of H or C1-C6 fatty group or aromatic in formula (1), n is 1-15.

Description

technical field [0001] The invention relates to a silicon-containing aryne-modified resin, in particular to a silicon-containing aryne-modified resin modified by an arylethynyl benzoxazine compound. Background technique [0002] Silicon-containing aryne resin is a new type of aryne-based thermosetting resin. In addition to the characteristics of aryne-based resins, it also has excellent electrical properties and high-temperature ceramic properties (that is, in this type of polymer at high temperature Can form stable ceramic structures such as SiC or / and SiO 2 Wait). [0003] So far, silicon-containing aryne resins with various structures have been reported. Such as: Luneva etc. utilize the reaction of acetylene Grignard reagent and alkyl, aryl silicon halide to prepare silicon-containing alkyne resin (L.K.Luneva, A.M.Sladkov, and V.V.Korshak, Vysokomolekulyamye Soedineniya, Seriya A, 1967, 9 (4) : 910-14.), its heat resistance can reach 450 ° C ~ 550 ° C; Itoh et al. used...

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Problems solved by technology

Such as: Luneva etc. utilize the reaction of acetylene Grignard reagent and alkyl, aryl silicon halide to prepare silicon-containing alkyne resin (L.K.Luneva, A.M.Sladkov, and V.V.Korshak, Vysokomolekulyamye Soedineniya, Seriya A, 1967, 9 (4) : 910-14.), its heat resistance can reach 450 ° C ~ 550 ° C; Itoh et al. used magnesium oxide as a catalyst to synthesize a silicon hydroaryne resin - MSP resin (a.M.Itoh, M.Mitsuzuka, K.Iwata , K.Inoue.Macromolecules, 1994, 27:7917-7917.b.M.Itoh, K.Inoue, et al., Journal of Materials Science, 2002, 37:3795.), has excellent thermal properties after curing, but due to the material The brittleness and shrinkage in the curing process lead to poor mechanical properties of the composite material; Ohshita et al. successfully synthesized a series of silicon-containing polymers whose side groups are aryne groups by metal lithium method (a.J.Ohshita, A.Yamashita, The class The polymer has excellent thermal stability, and the weight loss rate at 1000 ° C is 17%; Buvat et al. have synthesized a phenylacetylene-terminated silicon-hydroaryne resin (called BLJ resin) (Pierrick Buvat., et al., SAMPE Symp. , 2000, 46: 134-144), the cured resin does not have a glass transition below 450 ° C, and the residual rate of decomposition at 1000 ° C under argon is 80%; Huang Farong et al. have also prepared silicon-containing aryne resins with various structures ( CN 1709928)

[0004] In summary, although the existing silicon-containing aryne resins have their own characteristics, their common problems are: the brittleness of the silicon-containing aryne resin after curing is too high, and the adhesion to the fiber is not ideal

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