Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photo-curing ink-jet resist for printing circuit board and preparation method thereof

A printed circuit board and resist technology, which is applied in the field of light-curing inkjet resist and its preparation, can solve the problems of unfavorable PCB board resolution, slow photo-curing speed of etching-resistant ink, etc., and achieves good etching resistance, The effect of good alkali solubility and simple production process

Inactive Publication Date: 2008-06-18
BEIJING UNIV OF CHEM TECH
View PDF2 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light curing speed of this anti-etching ink is slow, which is not conducive to improving the resolution of the PCB board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photo-curing ink-jet resist for printing circuit board and preparation method thereof
  • Photo-curing ink-jet resist for printing circuit board and preparation method thereof
  • Photo-curing ink-jet resist for printing circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10

[0038] See Table 1 for the mass percentage of each component of the new photocurable inkjet resist prepared for printed circuit board (PCB). First, mix carboxyl-containing acrylate oligomers, acrylate low-viscosity resins, acrylate active monomers, and vinyl ether active monomers evenly, then add a photoinitiator under yellow light conditions, and heat up to 50 ℃ to fully dissolve the photoinitiator, then lower it to room temperature and add the dye in proportion, use a stirring, sand milling, and dispersing multipurpose machine to stir for 2 hours until the mixture is uniform, add leveling agent, wetting and dispersing agent, polymerization inhibitor, defoaming agent The agent is mixed evenly and obtained by filtration.

[0039] Use an inkjet printer to spray on the surface of the substrate, and then perform photocuring to obtain an experimental sample.

[0040] Table 1 The components and dosage (mass percentage concentration) of the new photocurable inkjet resist for PCB bo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The invention relates to light-cured ink-jet resist for a print circuit board and a preparation method thereof. By adopting the solidification way of mixing acrylic oligomer containing carboxyl, acrylic low viscosity resin as well as free radical and cation, the resist has good film detachment, short solidification time and high resolving capability; the technology of ink-jet can be adopted to spray the ink-jet resist on the special area of a copper-clad plate and an anti-etching image can be formed after light-curing. The manufactured solidified film has high hardness and good flexibility as well as good anti-etching property.

Description

Technical field: [0001] The invention relates to a photocurable inkjet resist for printed circuit boards and a preparation method thereof. Background technique: [0002] Photoresist, also known as photoresist, is mainly used in the microfabrication process of integrated circuits and semiconductor discrete devices in the electronics industry. The first photoresist used by humans in the electronics industry was the polyvinyl alcohol cinnamate and its derivatives photoresist system synthesized by Eastman-Kodak Company in 1954. In 1958, the same company developed cyclized rubber—biazide photoresist, which made the industrialization of integrated circuit production a reality. [0003] The traditional manufacturing process of printed circuit board (PCB) includes substrate processing, gluing, pre-baking, exposure, middle-baking, developing, post-baking, and degumming. In the production process, multiple or even dozens of photolithography operations are often required, and the abo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/028G03F7/004
Inventor 魏杰王玥
Owner BEIJING UNIV OF CHEM TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com