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Multi-component multi-layer hard thin film material for minitype drill bit surface modification and preparation method thereof

A thin-film material, micro-drill technology, applied in metal material coating process, coating, layered products, etc., can solve the problems of hole position accuracy, hole wall roughness exceeding standard, low microhardness friction coefficient, etc. Wide controllable range, improve micro-roughness, and improve the effect of interface bonding force

Active Publication Date: 2008-07-02
GUANGDONG INST OF NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material has high microhardness, high film / substrate bonding force, low friction coefficient, good wear resistance, corrosion resistance and other properties, which improves the service life of micro drills and solves the problems of "hole position accuracy" and "hole wall roughness" during drilling. Degree", "nail head" and other performance indicators exceeding the standard

Method used

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  • Multi-component multi-layer hard thin film material for minitype drill bit surface modification and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Table 1 process flow table

[0030]

[0031] Three target materials of Cr, Ti and Al are used, and the gas is high-purity Ar and N 2 and C 2 h 2 , The substrate is a Φ0.4mm micro-drill. The thickness of multi-layer hard film Cr / CrN / CrTiAlCN / DLC deposited sequentially is 0.1, 0.25, 0.85, 0.6 μm; The coefficient of friction of the layer is 0.2. Use this coated micro-drill to drill a 6-layer PCB board with a thickness of 2.0mm, and the speed is 120,000 rpm. It reached 25500 (7000 / 6000 / 5000 / 4000 / 3500), while the average number of holes drilled by uncoated micro-drills was 10000 (3000 / 2000 / 2000 / 1500 / 1500).

Embodiment 2

[0033] Table 2 process flow table

[0034]

[0035]Three target materials of Cr, Ti and Al are used, and the gas is high-purity Ar and N 2 and C 2 h 2 , The substrate is a φ0.25mm micro-drill. The thickness of multi-layer hard film Cr / CrN / CrTiAlCN / DLC deposited sequentially is 0.1, 0.2, 0.6, 0.4 μm respectively; The coefficient of friction of the layer is 0.25. Use this coated micro-drill to drill an 8-layer PCB board with a thickness of 1.6mm, and the speed is 140,000 rpm. According to the use process of the micro-drill, and under the condition of meeting the processing quality standards of the PCB board, each coated micro-drill drills holes The average number reached 14500 (5000 / 4000 / 3000 / 2500 / 0), while the average number of holes drilled by the uncoated micro-drill was 6000 (2000 / 1500 / 1500 / 1000 / 0).

Embodiment 3

[0037] Table 3 process flow table

[0038]

steps

Background vacuum: 5.0×10 -3 Pa, temperature: 150°C, workpiece rack speed: 5rpm

Furnace

pressure

(Pa)

Airflow(sccm)

Magnetic control power (Kw)

source of ion

(Kw)

Bias

(V)

time

(min)

Ar

N 2

CH 4

Cr

Ti

Al

ion source bombardment

0.5

150

2.0

800

30

film

Floor

Shen

accumulate

the transition

Floor

Cr

0.4

150

6

0.5

100

5

CrN

0.5

130

50

6

0.5

100

15

Wear-resistant

Floor

CrTiAl

CN

0.6

120

120

80

4

5

4

1

85

70

...

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Abstract

The invention relates to a multi-component, multilayer hard thin film material for surface modification of a mini-type boring bit and a manufacture method thereof. The multi-component, multilayer hard thin film material sequentially comprises a base material, a metal transition layer Cr, a metal nitride transition layer CrN, a hard wear resistant layer CrTiAlCN, and a self-lubricating layer DLC. The preparation method comprises the following steps of: adopting Cr, Ti and Al metal target materials and Ar, N2, C2H2, or CH4 gas, sequentially bombarding and cleaning the mini-type boring bit, and depositing the Cr layer, the CrN layer, the CrTiAlCN layer and the DLC layer. The multi-component, multilayer hard thin film material provided by the invention has higher microhardness up to HV 2,500 to 3,500 and a film / base bonding force not less than 70N, and can be easily prepared at 100 to 200 DEG C and can be uniformly deposited on the surface of the entirety-type or solder-type hard alloy mini-type boring bit with a diameter Phi of 0.1 to 2.0 mm, thus significantly improving the service life of the mini-type boring bit as well as the quality and the production efficiency of printed circuit boards.

Description

technical field [0001] The invention relates to a multi-layer hard film material which can be deposited on the surface of a micro drill bit and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics industries such as computers and mobile phones towards miniaturization, the processing of microelectronic circuit boards (PCB: Printed Circuit Board), which is closely related to miniaturization, is becoming increasingly high-speed, automated, precise, and miniaturized. The special micro-drill for fine machining of electronic circuit boards can perform long-term, stable and high-speed cutting under harsh conditions such as high temperature, high speed, high wear, and strong corrosion. The material of the PCB board is mainly a copper-clad glass fiber reinforced layered composite material, generally several to a dozen layers. The general diameter of PCB micro-drills is 0.10-2.0mm. When processing PCB boards, its speed can reach 1...

Claims

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Application Information

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IPC IPC(8): C23C14/14C23C14/35B32B33/00B32B9/00
Inventor 代明江林松盛李洪武朱霞高侯惠君刘敏张忠诚林凯生况敏
Owner GUANGDONG INST OF NEW MATERIALS
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