High temperature self-restoring epoxy resin material and preparation method thereof

Abstract

The invention discloses a high-temperature self-repair-type epoxide resin material and a process for preparation, the process comprises adding microcapsule and accelerating agent which are evenly mixed into the basal body of epoxide resin, adding curing agent into the basal body of epoxide resin to evenly mix, finally, curing molding and getting high-temperature self-repair-type epoxide resin material. When cracks are produced on the high-temperature self-repair-type epoxide resin material of the invention because of forcing in the process of processing and employing, the cracks are extended to the built-in microcapsule, and the microcapsule wall is led to crack, liquid-state epoxide resin in the microcapsule is immediately released to fill into the cracks, the accelerating agent which is built in the basal body leads the liquid-state epoxide resin to be solidified under high temperature, thereby rebinding the cracks together, and the damage of the material is repaired, thereby keeping the mechanical properties of the epoxy composite material and prolonging the life span.

Description

technical field

[0001] The invention relates to an epoxy resin material, in particular to a high-temperature self-repairing epoxy resin material with self-repairing performance and a preparation method thereof. Background technique

[0002] Epoxy resin is a class of polymer compounds containing two or more epoxy groups in the molecule. Since the 1940s, it has gradually developed into a class that includes many types of thermosetting resins, such as glycidyl ethers, glycidyl amines, glycidyl esters, and aliphatic cyclophatic epoxy resins. Due to its excellent process performance, mechanical properties and physical properties, and low price, epoxy resin has been widely used in machinery, electricity, electronics, aviation, aerospace, chemical industry, etc. , transportation, construction and other fields.

[0003] General-purpose epoxy resins, such as bisphenol A epoxy resin and its modified resins, are relatively brittle after being cured with common curing agents, and micr...

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