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High temperature self-restoring epoxy resin material and preparation method thereof

A technology of epoxy resin and epoxy resin matrix, which is applied in the field of high-temperature self-repairing epoxy resin material and its preparation, which can solve the research lag of self-repair, the decline of self-repair performance, and the inability to repair microcracks of epoxy resin materials, etc. problem, to achieve the effect of simple technical process, good self-repair performance, and improved repair effect

Inactive Publication Date: 2008-07-09
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the activity of the Grubbs catalyst is easily attenuated, and its self-healing performance will be greatly reduced after long-term use; on the other hand, DCPD is easy to volatilize and self-polymerize at high temperature, so it is not suitable as a repair agent for high-temperature curing epoxy resin; in addition, As an unsaturated polyester, DCPD has poor interfacial bonding between its crosslinked product and epoxy resin matrix
[0006] To sum up, the traditional repair cannot repair the microcracks inside the epoxy resin material, while the self-healing epoxy resin material based on DCPD microcapsules and Grubbs catalyst has poor repair effect, easy attenuation, and is not suitable for high temperature curing. Disadvantages such as epoxy resin system
In fact, most of the currently widely used high-performance epoxy resin materials are high-temperature curing epoxy resin materials, and the research on their self-healing is relatively lagging behind.

Method used

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  • High temperature self-restoring epoxy resin material and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] A high-temperature self-healing epoxy resin material, the preparation method of which is as follows:

[0027] With 5g of microcapsules (the capsule core is bisphenol F diglycidyl ether epoxy resin, the capsule wall is polyurea formaldehyde, the average particle diameter of the microcapsules is 37 μm, and the content of the capsule core epoxy resin is 64% of the total weight of the microcapsules; ) and 1g of catalyst (complex of copper bromide and 2-methylimidazole) were added to 100g of epoxy resin matrix (bisphenol A diglycidyl ether epoxy resin), and after mixing evenly, 2g of epoxy resin matrix was added Curing agent (2-ethyl-4-methylimidazole), and then mix it evenly and cast it into a mold, and then cure and post-cure the mixture to get it. The curing and post-curing process is 80°C for 2h, 120°C for 2h, and 140°C 2h.

[0028] The self-healing process of the high-temperature self-healing epoxy resin material in this embodiment is shown in Figure 1. The microcapsul...

Embodiment 2

[0030] A high-temperature self-healing epoxy resin material, the preparation method of which is as follows:

[0031] With 10g of microcapsules (capsule core is bisphenol A diglycidyl ether epoxy resin, capsule wall is polyurea formaldehyde, microcapsule average particle diameter is 37 μ m, and the content of capsule core epoxy resin is 64% of microcapsule gross weight; ) and 2g of catalyst (complex of copper bromide and 2-methylimidazole) were added to 100g of epoxy resin matrix (bisphenol A diglycidyl ether epoxy resin), and after mixing evenly, 2g of epoxy resin matrix was added Curing agent (2-ethyl-4-methylimidazole), and then mix it evenly and cast it into a mold, and then cure and post-cure the mixture to get it. The curing and post-curing process is 80°C for 2h, 120°C for 2h, and 140°C 2h.

[0032] The self-healing process of the high-temperature self-healing epoxy resin material of this embodiment is shown in FIG. 1 .

Embodiment 3

[0034] A high-temperature self-healing epoxy resin material, the preparation method of which is as follows:

[0035] With the microcapsule (capsule core is epoxy resin 711 of 15g, capsule wall is the copolymer of epoxy acrylate and sodium methacrylate hydroxypropyl sulfonate, microcapsule average particle diameter is 10 μ m, the content of capsule core epoxy resin is 60% of the total weight of microcapsules;) and 2g catalyst (complex of copper bromide and 2-methylimidazole) are added in 100g epoxy resin matrix (bisphenol A diglycidyl ether epoxy resin), mix well Then add 2g of matrix curing agent for epoxy resin (2-ethyl-4-methylimidazole), mix it evenly and cast it into a mold, and then cure and post-cure the mixture to get it. The curing and post-curing process is 80°C 2h, 120°C 2h, 140°C 2h.

[0036] The self-healing process of the high-temperature self-healing epoxy resin material of this embodiment is shown in FIG. 1 .

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Abstract

The invention discloses a high-temperature self-repair-type epoxide resin material and a process for preparation, the process comprises adding microcapsule and accelerating agent which are evenly mixed into the basal body of epoxide resin, adding curing agent into the basal body of epoxide resin to evenly mix, finally, curing molding and getting high-temperature self-repair-type epoxide resin material. When cracks are produced on the high-temperature self-repair-type epoxide resin material of the invention because of forcing in the process of processing and employing, the cracks are extended to the built-in microcapsule, and the microcapsule wall is led to crack, liquid-state epoxide resin in the microcapsule is immediately released to fill into the cracks, the accelerating agent which is built in the basal body leads the liquid-state epoxide resin to be solidified under high temperature, thereby rebinding the cracks together, and the damage of the material is repaired, thereby keeping the mechanical properties of the epoxy composite material and prolonging the life span.

Description

technical field [0001] The invention relates to an epoxy resin material, in particular to a high-temperature self-repairing epoxy resin material with self-repairing performance and a preparation method thereof. Background technique [0002] Epoxy resin is a class of polymer compounds containing two or more epoxy groups in the molecule. Since the 1940s, it has gradually developed into a class that includes many types of thermosetting resins, such as glycidyl ethers, glycidyl amines, glycidyl esters, and aliphatic cyclophatic epoxy resins. Due to its excellent process performance, mechanical properties and physical properties, and low price, epoxy resin has been widely used in machinery, electricity, electronics, aviation, aerospace, chemical industry, etc. , transportation, construction and other fields. [0003] General-purpose epoxy resins, such as bisphenol A epoxy resin and its modified resins, are relatively brittle after being cured with common curing agents, and micr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/3445
Inventor 殷陶容敏智章明秋
Owner SUN YAT SEN UNIV
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