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Preparing method of nickel based conductive slurry

A conductive paste, nickel-based technology, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of unmentioned conductive film resistance and can not meet the anti-oxidation temperature, etc. Achieving good economic benefits, good adsorption properties, and cost reduction

Active Publication Date: 2008-10-22
上海正银电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, Electronic Components and Materials, 2007, 26 (3): 15-17 reported that the anti-oxidation temperature of ultrafine nickel-silver bimetallic powder is 800 ° C; Journal of Inorganic Chemistry, 1997, 13 (1): 32 It was reported on ~36 that the anti-oxidation temperature of copper-silver bimetallic powder reached 700°C, which was much higher than that of pure base metals, but none of the above reports were developed for ohmic contact electrodes, and neither mentioned The resistance of the conductive film cannot meet the requirements of MLPTCR for the anti-oxidation temperature of the inner electrode up to 900°C

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1) Preparation of submicron nickel-chromium mixed metal powder:

[0033] (1) Preparation of precursor solution

[0034] Preparation of nickel salt solution: 23.76g NiCl 2 ·6H 2 O was dissolved in 125ml of deionized water, then 18.8ml of lactic acid was added, and mixed well to obtain a nickel salt solution.

[0035] Preparation of chromium salt solution: 6.65gCrCl 3 ·6H 2 O was dissolved in 32ml of deionized water, then 4.7ml of lactic acid was added, mixed well to obtain a chromium salt solution.

[0036] The above two aqueous solutions are mixed and fully stirred to obtain a mixed aqueous solution.

[0037] Preparation of sodium hypophosphite aqueous solution: 27.5 g of sodium hypophosphite was mixed with 208 ml of deionized water, and fully stirred to obtain an aqueous solution of sodium hypophosphite.

[0038] (2) Preparation of submicron nickel-chromium mixed metal powder

[0039] The mixed aqueous solution was heated and stirred in a water bath at 80° C., a...

Embodiment 2

[0051] 1) Preparation of submicron nickel-chromium mixed metal powder:

[0052] (1) Preparation of precursor solution

[0053] Preparation of nickel salt solution: 23.7g NiCl 2 ·6H 2 O was dissolved in 100ml of deionized water, then 22.5ml of lactic acid was added, mixed well to obtain a nickel salt solution.

[0054] Preparation of chromium salt solution: 11.4gCrCl 3 ·6H 2 O was dissolved in 43ml of deionized water, then 9.6ml of lactic acid was added, and mixed well to obtain a chromium salt solution.

[0055] The above two aqueous solutions are mixed and fully stirred to obtain a mixed aqueous solution.

[0056] Preparation of aqueous solution of sodium hypophosphite: mix 37.7 g of sodium hypophosphite with 215 ml of deionized water, and stir thoroughly to obtain an aqueous solution of sodium hypophosphite.

[0057] (2) Preparation of submicron nickel-chromium mixed metal powder

[0058] The mixed aqueous solution was heated and stirred in a water bath at 95° C., and...

Embodiment 3

[0070] 1) Preparation of submicron nickel-chromium mixed metal powder:

[0071] (1) Preparation of precursor solution

[0072] Preparation of nickel salt solution: 23.7g NiCl 2 ·6H 2 O was dissolved in 117ml of deionized water, then 19.5ml of lactic acid was added, and mixed well to obtain a nickel salt solution.

[0073] Preparation of chromium salt solution: 8.9gCrCl 3 ·6H 2 O was dissolved in 39ml of deionized water, then 6.4ml of lactic acid was added, mixed well to obtain a chromium salt solution.

[0074] The above two aqueous solutions are mixed and fully stirred to obtain a mixed aqueous solution.

[0075] Preparation of aqueous solution of sodium hypophosphite: mix 30.4 g of sodium hypophosphite with 216 ml of deionized water, and stir thoroughly to obtain an aqueous solution of sodium hypophosphite.

[0076] (2) Preparation of submicron nickel-chromium mixed metal powder

[0077] The mixed aqueous solution was heated and stirred in a water bath at 83° C., and ...

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PUM

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Abstract

The invention provides a method for preparing a nickel-based conductive paste. Mixed solution of sodium monophosphate reduced nickel salt water solution and chromium salt water solution is used to prepare submicron nickel-chromium mixed metal powder, and the surface of the submicron nickel-chromium mixed metal powder is clad with nano silver to prepare nickel-based metal powder. The nickel-based metal powder is taken as a conductive phase to prepare the conductive paste, antioxidant boron is added into the paste, and the oxidation-resistant temperature of the conductive paste can reach 900 DEG C; the prepared nickel-based metal powder is used for inner electrodes of multi-layer ceramics MLPTCR, and can also replace electrodes of precious metal such as silver, palladium and so on, to be used for multi-layer ceramic capacitors, special microwave ceramics and piezoelectric ceramics. The application of the nickel-based conductive paste can greatly reduce the cost of electronic elements and has better economic benefit.

Description

technical field [0001] The invention relates to a method for preparing conductive paste for multilayer ceramic internal electrodes, in particular to a method for preparing conductive paste by using base metal nickel as the conductive phase. Background technique [0002] Conductive paste is an important part of electronic ceramic components. Precious metals such as silver, palladium, and gold have been used as the conductive phase of conductive paste. However, due to the high price of precious metal materials, the cost reduction of ceramic components is limited, and the positive temperature For the coefficient n-type semiconductor ceramics, an interface barrier will be formed when they are in contact with silver, palladium, gold and other noble metals, making the contact resistance between PTCR semiconductor ceramics and noble metals as high as 10 3 , and has rectification characteristics, and cannot form a good ohmic contact, so it has become an inevitable development trend ...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B1/22
Inventor 周东祥龚树萍郑志平胡云香傅邱云刘欢赵俊
Owner 上海正银电子材料有限公司
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