Electromagnetic micro-torsional pendulum resonant vibration type sensor based on micro-electronic mechanical skill

A resonant sensor and torsional pendulum resonator technology, applied in the field of micromechanical sensing, can solve the problems of system error, energy loss, sensor quality factor decline, etc., and achieve the effect of simple manufacturing process and improved quality factor

Active Publication Date: 2008-10-29
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, when the micro-torsion pendulum vibrates in the liquid phase, the damping will easily cause energy loss, which will reduce the quality factor of the sensor; due to the effects of external factors such as temperature and film internal stress, it will easily cause system errors; in order to solve the problems of the prior art, the present invention A resonant sensor with micro-twist structure based on micro-electro-mechanical technology (MEMS) is proposed

Method used

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  • Electromagnetic micro-torsional pendulum resonant vibration type sensor based on micro-electronic mechanical skill
  • Electromagnetic micro-torsional pendulum resonant vibration type sensor based on micro-electronic mechanical skill
  • Electromagnetic micro-torsional pendulum resonant vibration type sensor based on micro-electronic mechanical skill

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Embodiment approach 1

[0051] Embodiment 1: The dielectric layer is used as the torsion material, and four photolithography is required in the production process. The biggest feature is that the process is simple. The production process is briefly described as follows:

[0052] 1) The dielectric layer (silicon dioxide and low-stress silicon nitride) on the surface of the silicon wafer grows to 2-3 μm;

[0053] 2) Evaporation or sputtering growth and patterning of excitation and vibration pickup metal electrodes (Cr+Au, 0.2 μm);

[0054] 3) PECVD growth of passivation dielectric protection layer (0.5-1μm);

[0055] 4) Sensitive layer growth and patterning;

[0056] 5) The silicon on the back is deeply etched to the silicon dioxide dielectric layer;

[0057] 6) Reactive plasma etching (RIE) of the front dielectric layer to release the micro-twist structure.

Embodiment approach 2

[0058] Embodiment 2: use SOI (Silicon On Insulator) substrate, and use SOI device layer (2-3 μm) as micro-kink material. Similar to Embodiment 1:

[0059] 1) SOI (Silicon On Insulator) substrate oxidation;

[0060] 2) Evaporation or sputtering growth and patterning of excitation and vibration pickup metal electrodes (Cr+Au, 0.2 μm);

[0061] 3) PECVD growth of passivation dielectric protection layer (0.5-1μm);

[0062] 4) Sensitive layer growth and patterning;

[0063] 5) The silicon on the back is deeply etched to the silicon dioxide dielectric layer;

[0064] 6) Reactive plasma etching (RIE) and deep etching of the front dielectric layer and the device layer of SOI to release the micro-twist structure.

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Abstract

The invention discloses a microstructural resonant sensor based on micro-electro-machinery, which is characterized in that two micro torsional pendulum resonators are arranged side by side; a sensitive layer film for detection is arranged on one micro torsional pendulum resonator; a non-sensitive layer film for difference detection is arranged on the other micro torsional pendulum resonator; each micro torsional pendulum resonator consists of a pendulum shaft and pendulum plates distributed on the two sides of the pendulum shaft; an electromagnetic drive coil and a vibration pickup coil are arranged on the pendulum plates. When being electrified, the drive coil under the action of lorentz force of an external magnetic field generates a torque around the pendulum shaft to drive the torsional pendulum resonators to vibrate; vibrating signals are picked up by an induced electromotive force generated by the vibration pickup coil by cutting the lines of magnetic force, and fed back to the drive coil to form closed-loop self-excitation and output a resonant frequency. The microstructural resonant sensor operates under a torsion mode and increases the merit factor; the difference output inhibits errors caused by the effect of external elements such as temperature; the microstructural resonant sensor has simple process and high detection sensitivity, and can be used as a biochemical sensor for detecting micro biochemical molecules, particularly for biochemical detection and sensing under liquidoid conditions.

Description

technical field [0001] The invention belongs to the technical field of micro-mechanical sensing, and relates to an electromagnetic micro-twisting structure resonant sensor based on micro-electro-mechanical technology (MEMS). Background technique [0002] The natural resonant frequency of the micromechanical cantilever depends on the two parameters of the equivalent stiffness and the equivalent mass of the cantilever. Any measurement that can cause changes in these two parameters can be detected by measuring the change in the natural resonant frequency of the micro-cantilever. Purpose. The typical application of resonant micro-cantilever in biochemical sensors is as a mass sensor. After the biochemical sensitive layer made on the cantilever specifically adsorbs biochemical molecules, the change in the equivalent mass of the cantilever causes the resonant frequency of the cantilever to change. Measure the resonant frequency Quantitative analysis of the analyte can be realized...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D5/12
Inventor 陈德勇王军波毋正伟
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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