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Method for manufacturing miniature spring mechanical sensor for film performance test

A technology of spring mechanics and manufacturing method, which is applied in the process of producing decorative surface effects, microstructure technology, gaseous chemical plating, etc. Cutting precision limitation and other issues, to achieve the effect of rich structure, good linearity and long service life

Inactive Publication Date: 2009-01-14
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of wire cutting accuracy, the size of the cantilever is difficult to reach the micron level
Therefore, for measurement situations that require high precision, it still cannot meet the requirements, and in the process of mechanical-electrical signal conversion, it is difficult to control its linearity

Method used

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  • Method for manufacturing miniature spring mechanical sensor for film performance test
  • Method for manufacturing miniature spring mechanical sensor for film performance test
  • Method for manufacturing miniature spring mechanical sensor for film performance test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This embodiment 1 is implemented under the following conditions of implementation and technical requirements:

[0030] (1) On a 3-inch glass plate, sputter 1000 Titanium ( Figure 4 a), and at a temperature of 65°C, in 2% NaOH and 1% H 2 o 2 Oxidation treatment in the mixed solution for 3 minutes to form a uniform and dense black titanium oxide film layer ( Figure 4 b), to ensure a good bonding force with the photoresist;

[0031] (2) Then throw SU-8-50 type negative photoresist (supplier: Hong Kong Electronics; SU-8-50 is the model) on the titanium oxide film layer, and then perform pre-baking, slicing, exposure, intermediate Baking and development processing, according to the shape of the micro spring mechanical sensor designed by the mask, realize the patterning of its photoresist structure ( Figure 4 c);

[0032] (3) Using stack electroplating technology, on the treated titanium oxide layer, under the conditions of 50 ° C and pH 4.0, electroformed at a depo...

Embodiment 2

[0037] This embodiment 2 is implemented under the following conditions of implementation and technical requirements:

[0038] (1) Sputter 800 on a 4-inch glass sheet Titanium ( Figure 4 a), then repeat the oxidation treatment as in (1) step in Example 1 ( Figure 4 b);

[0039] (2) according to step (2) in embodiment 1, obtain the patterning ( Figure 4 c);

[0040] (3) according to the method of step (3) in embodiment 1, electroforming out figure 1 , image 3 Medium 1000μm Ni spring layer 4 and fixing hole 5, or figure 2Medium 1000μm Ni spring layer 4, fixing hole 5 and needle-shaped stretching head 6;

[0041] (4) according to the method for step (4) among the embodiment 1, the surface surface of the miniature spring mechanical sensor is carried out grinding, polishing treatment, carry out figure 1 , figure 2 centering mark 2 and displacement mark 3, or image 3 Graphicalization of mid-shift marker 3;

[0042] (5) According to the method of step (5) in embodim...

Embodiment 3

[0045] This embodiment 3 is implemented under the following conditions of implementation and technical requirements:

[0046] (1) On a 6-inch glass sheet, sputter 900 Titanium ( Figure 4 a), then repeat the oxidation treatment of step (1) in Example 1 ( Figure 4 b);

[0047] (2) according to the method of embodiment 1 step (2), obtain the patterning ( Figure 4 c);

[0048] (3) according to the method of step (3) in embodiment 1, electroforming out figure 1 and figure 2 Medium 1500μm Ni spring layer 4 and fixing hole 5, or image 3 Medium 1500μm Ni spring layer 4, fixing hole 5 and rake-shaped stretching head 7;

[0049] (4) according to the method for step (4) among the embodiment 1, the surface surface of the miniature spring mechanical sensor is carried out grinding, polishing treatment, carry out figure 1 , figure 2 centering mark 2 and displacement mark 3, or image 3 Graphicalization of mid-shift marker 3;

[0050] (5) according to the method of step (5) ...

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Abstract

Disclosed is a manufacturing method of a micro spring mechanics sensor used for the film performance test in the testing technology field; the method includes the steps that: the metal Ti layer is sputtered on the glass sheet and processed with oxidation treatment; the whirl coating of negative photoresist, front drying and development are processed on the glass sheet after the sputtering and oxidation treatment; the graphical display of the photoresist structure is realized according to the shape of the micro spring mechanics sensor designed by the mask plate; the Ni spring layer is electroformed on the processed titanium oxides layer; the micro spring mechanics sensor is processed with flatness machining; the sedimentation of the aligning marking and the displacement marking is processed on the Ni electroplated coating through the electrodeposition technology; the micro spring mechanics sensor is finally obtained after negative photoresist, the residual glass and the Ti sputtering layer are removed. The micro spring mechanics sensor prepared by the manufacturing method in the invention has the advantages of good linearity, simple process, high resolution, low cost and being easy to be integrated with the film mechanics performance test system.

Description

technical field [0001] The invention relates to a method for manufacturing a sensing device in the technical field of testing, in particular to a method for manufacturing a micro spring mechanical sensor for thin film performance testing. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS) technology, various thin-film materials are widely used in various micro-devices. The mechanical properties of these thin film materials are very important to the reliability design of MEMS devices, so it is very important to test the mechanical properties of micron-scale thin film materials. One of the difficulties in tensile testing experiments in a micro-scale environment is the application and measurement of tiny forces. Because in the thin film test system, the tensile force is usually at the level of millineww, or even at the level of micronewton. So how to precisely control the pulling force is the key factor to determine whether the ...

Claims

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Application Information

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IPC IPC(8): B81C1/00
Inventor 汪红刘瑞汤俊丁桂甫李雪萍
Owner SHANGHAI JIAO TONG UNIV
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