Unlock instant, AI-driven research and patent intelligence for your innovation.

Polyimide resin composition and metal polyimide laminate

A technology of polyimide resin and polyimide layer, which is applied in the direction of metal layered products, aldehyde/ketone condensation polymer adhesives, layered products, etc., which can solve the problem of high copper foil peel strength and difficult to obtain adhesion , can not be obtained and other problems, to achieve the effect of excellent flame retardancy, excellent peel strength of metal foil

Inactive Publication Date: 2009-02-18
ASAHI KASEI KK
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the other hand, in the method of using thermoplastic polyimide for lamination of polyimide film and metal foil, since thermoplastic polyimide and polyimide film become polyimide-polyimine interface, Therefore, compared with the three-layer flexible substrate whose interface is epoxy resin-polyimide, it is difficult to obtain adhesion
Therefore, if the copper foil formed on the thermoplastic polyimide is to be peeled off, there is a problem that peeling occurs at the polyimide-polyimide interface, and a high copper foil peel strength cannot be obtained.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide resin composition and metal polyimide laminate
  • Polyimide resin composition and metal polyimide laminate
  • Polyimide resin composition and metal polyimide laminate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0086] A reflux condenser with a stainless steel anchor stirrer, a nitrogen inlet pipe, and a collector with a closed-circuit cock with a spherical condenser is installed in a three-necked separable (Separable) flask with a capacity of 2 liters. The following reactions were carried out in a gas stream.

[0087] Dissolve 58.46g (200mmol) of 1,3-bis(3-aminophenoxy)benzene (hereinafter APB) in 400g of γ-butyrolactone, and add 64.4g (200mmol) of benzophenone tetra Carboxylic dianhydride was reacted at room temperature for 2 hours. Then 3.0 g (30 mmol) of γ-valerolactone, 4.1 g (46 mmol) of pyridine, 344 g of γ-butyrolactone, and 100 g of toluene were added. The reaction was carried out at 180° C. (bath temperature) for 3 hours while blowing nitrogen gas, while removing the azeotrope of toluene and water, to obtain a solvent-soluble polyimide varnish 1 .

Synthetic example 2

[0089] The following reactions were carried out in the same vessel as above. Add 44.9g (200mmol) bicyclo (2,2,2) oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (below BTA), 15.2g (100mmol) 3,5-diamino Benzoic acid (hereinafter DABZ), 3.0g (30mmol) γ-valerolactone, 4.1g (46mmol) pyridine, 172g γ-butyrolactone, 60g toluene. The reaction was carried out at 180° C. (bath temperature) for 1 hour while blowing nitrogen gas. The azeotrope of toluene and water was removed. Add 29.4g (100mmol) 3 in this reaction solution, 4,3 ', 4'-diphenyltetracarboxylic dianhydride (hereinafter BPDA), 58.46g (200mmol) APB, 172g gamma-butyrolactone, 40g toluene, side The reaction was carried out at room temperature for 1 hour while blowing nitrogen gas. Then, removing the azeotrope of toluene and water, it was made to react at 180 degreeC (bath temperature) for 3 hours, and the solvent-soluble polyimide varnish 2 was obtained.

Synthetic example 3

[0091] The following reactions were carried out in the same vessel as above. 44.9 g (200 mmol) of BTA, 20.0 g (100 mmol) of 3,4-diaminodiphenyl ether, 3.0 g (30 mmol) of γ-valerolactone, 4.1 g (46 mmol) of pyridine, 172 g of γ-butyrolactone, and 60 g of toluene were added. The reaction was carried out at 180° C. (bath temperature) for 1 hour while blowing nitrogen gas. The azeotrope of toluene and water was removed. 29.4 g (100 mmol) of BPDA, 58.46 g (200 mmol) of APB, 172 g of γ-butyrolactone, and 40 g of toluene were added to the reaction liquid, and the mixture was reacted at room temperature for 1 hour while blowing nitrogen gas. Then, removing the azeotrope of toluene and water, it was made to react at 180 degreeC (bath temperature) for 3 hours, and the solvent-soluble polyimide varnish 3 was obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

Disclosed is a polyimide resin adhesive containing (a) a solvent-soluble polyimide and (b) at least one of alkylated melamine resins and alkylated urea resins. Also disclosed is a metal polyimide laminate obtained by using such a polyimide resin adhesive. The polyimide resin adhesive enables to form a laminate which exhibits high metal foil peel strength, while having adequate heat resistance and flame retardance. Also disclosed are a metal polyimide laminate using such a polyimide resin adhesive and a printed wiring board using such a metal polyimide laminate.

Description

technical field [0001] The present invention relates to a polyimide resin adhesive having excellent adhesive strength with a non-thermoplastic polyimide film, and a metal polyimide laminate for flexible printed wiring boards using the polyimide resin adhesive. Background technique [0002] Conventionally, printed wiring boards having circuits on their surfaces are widely used for mounting electronic components, semiconductor chips, and the like. Along with the miniaturization and higher functionality of electronic devices in recent years, there has been a strong demand for thinner printed wiring boards and higher densities of circuits. Conventionally, a copper foil laminate in which a metal foil and a heat-resistant film (such as a polyimide film) are laminated via a thermosetting adhesive such as an epoxy resin has been generally used. Materials for copper foil laminates used for such purposes are generally referred to as three-layer flexible substrates. [0003] However,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08B32B15/08B32B15/088C09J161/24C09J161/28H05K1/03
CPCH05K1/0346C08L61/24C08L61/28H05K2201/0154C09J179/08H05K3/386C08L2666/16
Inventor 松浦航也
Owner ASAHI KASEI KK