Method for improving dispersion of nano silica granules in polyimide resin

A technology of nano-silica and polyimide resin, which is applied in the field of improving nano-silica particles to achieve the effect of improving dispersibility

Inactive Publication Date: 2009-03-11
DONGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with the development of science and technology, higher requirements are put forward for materials. The composite of polyimide and inorganic nanometers has shown great promise in improving the heat resistance, mechanical properties and dimensional stability of materials. Advantages, it is an effective means to further improve the heat resistance of polyimide

Method used

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  • Method for improving dispersion of nano silica granules in polyimide resin
  • Method for improving dispersion of nano silica granules in polyimide resin

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Embodiment 1

[0032] At 80°C, dry the nano-silica particles for 4 hours, and adjust the normal pressure plasma treatment parameters: helium gas flow rate 20L / min, radio frequency power 13.56MHz, power 30W, nozzle-to-substrate distance 2-3mm, make the nozzle and the loaded The distance between the nano-silica substrates (glass vessels) is 2-3 mm, and the nano-silica is treated for 30 seconds. Ultrasonic dispersion of 0.41836 g of treated nano-silica particles and 40 ml of dimethylacetamide solvent, stirring for 1 h, adding pyromellitic dianhydride and 4,4'-diaminodiphenyl ether in a molar ratio of 1:1, Among them, 4.3624g of pyromellitic dianhydride and 4.0048g of 4,4'-diaminodiphenyl ether. Ultrasonic dispersion and continuous reaction at room temperature for 24 hours. In this embodiment, the mass percentage of nano-silica particles in the nanocomposite material is 5%. After desolvation at 80°C, thermal cyclization (100°C, 200°C and 300°C for one hour each), to obtain a nanocomposite mater...

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Abstract

The invention relates to a method for improving the dispersity of nanometer silicon dioxide particles in polyimide resin. The method comprises the following steps: firstly, the nanometer silicon dioxide particles are dried for 3 to 5 hours at a temperature between 75 and 85 DEG C; secondly, atmospheric-pressure plasma treatment parameters are adjusted to ensure the distance between a nozzle and a matrix loaded with nanometer silicon dioxide is 2 to 3 mm, and the time for treating the nanometer silicon dioxide is 20 to 40 seconds; thirdly, the treated nanometer silicon dioxide particles are mixed with dimethyl acetamide solvent, and then pyromellitic dianhydride and 4, 4'-diaminodiphenyl ether are added in, well stirred and mixed; and fourthly, a nanometer composite material with the high dispersity of the nanometer silicon dioxide particles in the polyimide resin is obtained through thermal cyclization. The method is friendly to environment and effective to treat the nanometer silicon dioxide particles.

Description

technical field [0001] The invention belongs to the field of improving nano silicon dioxide particles, in particular to a method for improving the dispersion of nano silicon dioxide particles in polyimide resin. Background technique [0002] Polyimide is a polymer material with high temperature resistance, low temperature resistance, radiation resistance, beneficial chemical stability and good mechanical strength. It has been widely used in aerospace, electrical and electronic high-tech fields. However, it has disadvantages such as high melting point, insoluble in most organic solvents, difficult processing, easy hydrolysis, large coefficient of thermal expansion, high cost and the like. As a functional material, polyimide has been widely used in aerospace and microelectronics fields. However, with the development of science and technology, higher requirements are put forward for materials. The composite of polyimide and inorganic nanometers has shown great promise in impro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K9/00C08G73/10C08J5/18
Inventor 吴瑶谢剑飞邱夷平
Owner DONGHUA UNIV
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