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Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board

A photosensitive composition and photosensitivity technology, applied in printed circuit, printed circuit manufacturing, circuit, etc., can solve problems such as broken lines of exposed patterns, insufficient curing of exposed parts, insufficient sensitivity and storage stability, etc.

Inactive Publication Date: 2009-04-08
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, even in these photosensitive compositions, there are still problems such as insufficient sensitivity and storage stability, especially in the formation of patterned latent images by laser scanning exposure, insufficient curing of exposed parts, and insufficient curing in the alkali developing process. When the image part is removed, or when the photosensitive composition is thinned into a long roll form, fusion of the end faces occurs over time, and the fusion part falls on the exposure surface of the laminate during lamination, and occurs during exposure Faults such as disconnection of the exposure pattern
In addition, in the case of using an alkali-soluble epoxy resin, there are problems such as poor adhesion to the substrate during the gold plating process, floating of the photosensitive composition, and occurrence of plating penetration.
[0005] Therefore, there has not been provided a specific high molecular compound to provide a sensitivity, resolution, electroless gold plating resistance, and storage stability, which can effectively form high-definition permanent patterns (protective films, interlayer insulating films, and resistive films). Solder patterns, etc.), a photosensitive film, a permanent pattern forming method using the photosensitive film, and a printed circuit board using the permanent pattern forming method to form a permanent pattern are to be further improved and developed

Method used

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  • Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board
  • Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board
  • Photosensitive composition, photosensitive film, permanent pattern forming method, and printed board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0639] Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited by these examples.

Synthetic example 1

[0641] 159 g of 1-methoxy-2-propanol was added to a 1,000 mL three-necked flask, and heated to 85° C. under nitrogen flow. A solution of 159 g of 1-methoxy-2-propanol of 63.4 g of benzyl methacrylate, 72.3 g of methacrylic acid, and 4.15 g of V-601 (manufactured by Wako Pure Chemical Industries) was dripped there over 2 hours. After completion of instillation, it was further heated for 5 hours to cause a reaction. Next, heating was stopped, and the copolymer of benzyl methacrylate / methacrylic acid (30 / 70 mol% ratio) was obtained.

[0642] Next, 120.0 g of the copolymer solution was transferred to a 300 mL three-neck flask, 16.6 g of glycidyl methacrylate and 0.16 g of p-methoxyphenol were added, and stirred to dissolve. After dissolution, 2.4 g of tetraethylammonium chloride was added, heated to 100° C., and an addition reaction was performed. After confirming the disappearance of glycidyl methacrylate by gas chromatography (gas chromatography), heating was stopped. 1-Metho...

Synthetic example 2～27

[0647] In order to obtain the target polymer compound, except that benzyl methacrylate, methacrylic acid, and glycidyl methacrylate in Synthesis Example 1 were appropriately changed into arbitrary monomers, the same procedure as Synthesis Example 1 was carried out, Polymer compounds 2 to 27 shown in Tables 1 to 5 were prepared, respectively.

[0648] [Table 1]

[0649]

[0650] [Table 2]

[0651]

[0652] [table 3]

[0653]

[0654] [Table 4]

[0655]

[0656] [table 5]

[0657]

[0658] In Table 1 to Table 5, * 1 represents a mixture of a structure represented by the following structural formula (a) and a structure represented by (b) (the mixing ratio is unknown), * 2 represents a mixture of a structure represented by the following structural formula (c) and (d) (the mixing ratio is unknown).

[0659] Structural formula (a)

[0660] Structural formula (b)

[0661] Structural formula (c)

[0662] Structural formula (d)

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Abstract

Disclosed is a photosensitive composition which is excellent in sensitivity, resolution, electroless gold plating resistance and storage stability by containing a certain polymer compound. This photosensitive composition enables to efficiently form a high-precision permanent pattern (such as a protective film, an interlayer insulating film and a solder resist pattern). Also disclosed are a photosensitive film, a permanent pattern forming method using such a photosensitive film, and a printed board having a permanent pattern formed by such a permanent pattern forming method. Specifically disclosed is a photosensitive composition containing a binder, a polymerizable compound, a photopolymerization initiator, and an alkali-insoluble thermal crosslinking agent. The binder contains a polymer compound which has an aromatic group optionally containing a heterocycle and an ethylenically unsaturated bond in a side chain.

Description

technical field [0001] The present invention relates to a photosensitive composition, photosensitive film, permanent A pattern forming method and a printed circuit board with a permanent pattern formed by the permanent pattern forming method. Background technique [0002] Conventionally, when forming a permanent pattern such as a solder resist pattern, a photosensitive film in which a photosensitive layer is formed by applying and drying a photosensitive resin composition on a support has been used. As a method for producing the permanent pattern, for example, on a substrate such as a copper-clad laminate on which the permanent pattern is formed, the photosensitive thin film is laminated to form a laminate, and the photosensitive layer in the laminate is exposed, After this exposure, the photosensitive layer is developed to form a pattern, and then the permanent pattern is formed by performing curing treatment or the like. [0003] As the photosensitive composition, in ord...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/004H01L21/027H05K3/00
CPCG03F7/033H05K3/287G03F7/038
Inventor 藤牧一广神川弘
Owner FUJIFILM CORP