Polyamideimide obtained by end group exchange and its preparation method

A polyamide-imide and end-group technology, applied in the field of polyamide-imide and its preparation, can solve the problems of low-molecular-weight end-group-blocked PAI, influence the growth of PAI molecular chain, limit the application of PAI, etc. The effect of range, storage stability, and simple polymerization process
CN101434701BInactive Publication Date: 2012-02-08SICHUAN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SICHUAN UNIV
Publication Date
2012-02-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The polyamide-imide obtained by end group exchange disclosed by the present invention has a general structural formula as follows: In the formula, X is the remaining part of the diisocyanate after removing the diisocyanate group, and R' is the active hydrogen-containing The remaining structure of the compound after removing hydrogen has an intrinsic viscosity of 0.1 to 0.4 dL / g. The invention also discloses a method for preparing the polyamide-imide. Because the polyamide-imide obtained by end group exchange provided by the present invention not only has a wide variety of end groups, but also can obtain polyamide-imide that is difficult to prepare by direct end-capping method, and has higher molecular weight, stable storage, and convenient preparation. The cost is low, thus greatly expanding the scope of use of polyamide-imide.
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Description

technical field

[0001] The invention belongs to the technical field of polyamide-imide and its preparation method, and in particular relates to a polyamide-imide obtained by terminal group exchange and its preparation method. Background technique

[0002] Polyimide (PI) is a class of high-performance polymers containing imide rings in the main chain, among which the research on fully aromatic polyimide has attracted much attention. Due to its excellent thermal stability, mechanical properties, chemical inertness, dielectric properties, and radiation resistance, PI has been widely used in aerospace, electronics industries, etc. in commercial forms such as films, coatings, fibers, plastics, adhesives, and resin-based composites. High-tech fields have been widely used. However, due to its rigid molecular structure and strong intermolecular forces, traditional aromatic polyimides are usually insoluble and infusible, which brings great difficulties to the processing of materials...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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