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Electrochemically deposited indium composites

An electrochemical and composite technology, applied in the direction of chemical instruments and methods, circuits, electrolytic coatings, etc., can solve the problems that solder paste cannot provide thermal conductivity and deteriorate the thermal performance of solder-based TIM, so as to avoid the formation of bubbles and trachoma, Effective heat transfer, increase the effect of effective heat transfer

Active Publication Date: 2012-04-18
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, solder pastes often contain high levels of contaminants that can degrade the thermal performance of solder-based TIMs
In general, solder pastes do not provide uniform thermal conductivity, so there is still a need for indium TIMs with substantially uniform high thermal conductivity and ideal interfacial properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment I

[0063] The following aqueous indium electrochemical composition was prepared:

[0064] Table 1

[0065] components

content

Indium ion (3 + ) (from indium sulfate)

30g / L

Ammonia

170g / L

boric acid

80g / L

tartaric acid

300g / L

Silicon carbide particles

50g / L

Blend of polyether-modified polysiloxanes

10g / l

Phenyl ammonium salt

5g / L

pH

3

[0066] The average particle diameter of the silicon carbide particles was 1 μm. The polyether modified polysiloxane is included in the composition to help maintain a uniform dispersion of the silicon carbide particles in the aqueous composition.

[0067] Five nickel-clad copper ingots (10 cm x 20 cm) were plated with indium complex. An apparatus for the electrochemical deposition of indium composites is that disclosed in EP0339464A1. The indium electrochemical composition was maintained at pH 3 and temperature 60°C. The composition ...

Embodiment II

[0071] Prepare the following aqueous indium electrochemical composition:

[0072] Table 2

[0073] components

content

Indium ion (3 + ) (from indium sulfate)

60g / L

Methanesulfonic acid

30g / L

Imidazole-epichlorohydrin copolymer

100g / L

Silicon carbide particles

10g / L

Mixture of epoxy-modified polysiloxanes

12g / L

pH

1-1.2

[0074] The average particle size of silicon carbide particles is 5 μm. A mixture of epoxy-modified polysiloxanes is included in the composition to help maintain a uniform dispersion of silicon carbide particles in the aqueous composition.

[0075] Five nickel-clad copper blanks 10 cm x 20 cm were plated with indium complex. The indium electrochemical composition maintains a pH of 1-1.2 and a temperature of 60°C. The composition was continuously stirred during electroplating. The cathode current density is maintained at 10A / dm 2 . Electrochemical deposition was conti...

Embodiment III

[0078] Prepare the following aqueous indium electrochemical composition:

[0079] table 3

[0080] components

content

Indium ion (3 + ) (from indium sulfate)

60g / L

Methanesulfonic acid

30g / L

Imidazole-epichlorohydrin copolymer

100g / L

diamond particles

15g / L

Blend of vinyl-modified polysiloxanes

12g / L

Propylene Glycol Phenyl Ether

5g / L

pH

1

[0081] The average particle size of the diamond particles is 10 μm. A mixture of vinyl modified polysiloxane and propylene glycol phenyl ether was added to the composition to help maintain a uniform dispersion of diamond particles during plating.

[0082] Five aluminum blanks 10 cm x 20 cm were plated with indium composite. The indium electrochemical composition maintains a pH of 1 and a temperature of 50°C. The composition was continuously stirred during electroplating. The cathode current density is maintained at 20A / dm 2 . Electroc...

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Abstract

Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Description

technical field [0001] The present invention relates to electrochemically deposited indium composites having high thermal conductivity, and more particularly, the present invention relates to electrochemically deposited indium composites having high thermal conductivity for use in thermal interface materials. Background technique [0002] Thermal interface materials (TIMs) are critical to preventing electronic devices such as integrated circuits (ICs) and active semiconductor devices such as microprocessors from exceeding their operating temperature limits. They allow heat-generating devices (such as silicon semiconductors) to be bonded to heat sinks or heat sinks (such as copper and aluminum components) without creating excessive thermal barriers. The TIM can also be used in the assembly of other components in a heat sink or heat sink stack that makes up the total thermal impedance path. [0003] Forming an effective thermal path is an important property of a TIM. The the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/54C25D5/54C25D7/12C04B41/88H01L23/42H01L23/373C09D7/61
CPCC25D3/56C25D15/02C25D3/54H01L2924/0002C09D7/61C25D15/00Y10T428/31678H01L2924/00C09K5/14H01L23/3731
Inventor N·E·布雷斯E·佐克斯F·J·施瓦格M·P·托本M·W·贝斯
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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