Thermosetting resin composition and use

Abstract

The invention discloses a thermoset resin composition, comprising the following ingredients of: bifunctional groups or polyfunctional group epoxy resin, phenylethylene-maleic anhydride copolymer (SMA) as a curing agent, diallyl bisphenol A-like allylphenol as a co-curing agent and a toughening agent, low-bromine or high-bromine BPA-type epoxy resin or tetrabromobisphenol A (TBBPA or TBBA) as a fire retardant, a proper accelerator and a solvent. The inventive resin composition has, after being cured, relatively low dielectric property and superior thermal reliability and toughness, includes, in contrast to a cooper clad laminate manufactured by reinforcing materials such as glass fiber cloth, relatively low dielectric constant (called Dk for short) and electric loss tangent (called Df for short), high Tg, high thermal cracking temperature (called Td for short), excellent toughness and favorable PCB processibility, is quite suitable for manufacturing the cooper clad laminate for PCB and prepreg, and can also applied to general uses of the epoxy resin, such as molding plastics and the like, and to composite materials for construction, automobile and aviation.

Description

Technical field [0001] The invention relates to a thermosetting resin composition, which is suitable for making copper clad laminates and prepregs for PCB, and is applied to common uses of epoxy resins such as molding resins and composite materials for construction, automobiles and aviation. Background technique [0002] Epoxy resin has been widely used in various electronic insulating materials, mainly because it has better heat resistance, chemical resistance, and good insulation and dielectric properties. Commonly used curing agents include amines, acid anhydrides and Phenols or phenolic resins, especially in the application of copper clad laminates, dicyandiamide (amines) and phenolic resins (phenolic resins) are commonly used as curing agents for epoxy resins, which have good processability, heat resistance and resistance Chemical and insulating properties, but its dielectric properties cannot meet the requirements of high-frequency signal transmission integrity because of i...

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Problems solved by technology

[0002] Epoxy resin has been widely used in various electronic insulating materials, mainly because it has good heat resistance, chemical resistance and good insulation and dielectric properties. Commonly used curing agents include amines, acid anhydrides and Phenolic or phenolic, especially in the application of copper clad laminates, dicyandiamide (amine) and phenolic resin (phenolic) are commonly used as curing agents for epoxy resins, which have good processability, heat resistance, and Chemical and insulating properties, but its dielectric properties cannot meet the requirements of high-frequency signal transmission integrity because of its high dielectric constant (Dielectric constant) and dielectric loss (Dissipation factor)

[0003] In the BE627887 patent, the application of styrene-maleic anhydride copolymer (SMA for short) as epoxy resin curing agent is described, but this epoxy resin composition has the following disadvantages after curing and crosslinking: glass transition temperature (Tg) Low, poor thermal stability and poor processability

However, since the allyl compound in this patent is an allyl ester such as triallyl cyanurate (abbreviated as TAC) or triallyl isocyanurate (abbreviated as TAIC), the water absorption rate of its molecular structure Higher, and there are more C-N groups in its molecular structure, which leads to the disadvantages of high water absorption, dielectric properties and thermal cracking temperature after the composition is cured.

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