Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c

A technology of surface treatment and manufacturing method, applied in thin material treatment, superimposed layer plating, printed circuit manufacturing, etc., can solve the problems of improper analysis method and misjudgment, and achieve the effect of good fit and good adhesion

Active Publication Date: 2009-09-09
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Furthermore, even if trivalent chromium is used in response to increased awareness of environmental issues in recent years, it will be converted to hexavalent chromium if the exhaust gas is not treated properly, or it will be misjudged as hexavalent chromium if the analysis method is not correct

Method used

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  • Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c
  • Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c
  • Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated c

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095] (Manufacture of surface-treated copper foil)

[0096] In Example 1, the surface of the rough surface (surface roughness Ra=0.64 μm, Rzjis=3.0 μm) of an untreated electrolytic copper foil (hereinafter referred to simply as “untreated foil”) with a thickness of 18 μm was roughened to prevent Rust treatment, silane coupling agent treatment, made of surface treated copper foil. It should be noted that the antirust treatment layer is composed of a nickel-molybdenum alloy layer and a tin layer. The steps will be described in detail below.

[0097] Cleaning treatment: First, the untreated foil is pickled to remove grease and surface oxide film to make it clean. As the pickling solution at this time, a dilute sulfuric acid solution having a sulfuric acid concentration of 100 g / L and a liquid temperature of 30° C. was used, dipped in the dilute sulfuric acid solution for 30 seconds, and then washed with water.

[0098] Roughening treatment: cathodically polarize the untreated...

Embodiment 2

[0114] (Manufacture of surface-treated copper foil)

[0115] In Example 2, roughening treatment, antirust treatment, and silane coupling agent Treatment to make surface treated copper foil. It should be noted that the antirust treatment layer is composed of a nickel-zinc alloy layer and a tin layer. The steps will be described below, but since the cleaning treatment and the roughening treatment are the same as those in Example 1, their descriptions will be omitted.

[0116] Antirust treatment: In Example 2, a nickel-zinc alloy layer was formed on the surface of the above-mentioned rough surface using the nickel-zinc electrolyte solution and the tin electrolyte solution shown below, and then a tin layer was formed. Table 1 summarizes the production conditions for forming the nickel-zinc alloy layer and the tin layer at this time. Then, the nickel weight thickness, the zinc weight thickness, and the tin weight thickness of the rough surface of the produced surface-treated cop...

Embodiment 3

[0123] (Manufacture of surface-treated copper foil)

[0124] In Example 3, roughening treatment, antirust treatment, and silane coupling agent treatment were performed on the rough surface (surface roughness Ra = 0.64 μm, Rzjis = 3.0 μm) of the same 18 μm thick untreated foil as in Example 1 , made of surface-treated copper foil. It should be noted that the antirust treatment layer is composed of a nickel-molybdenum-cobalt alloy layer and a tin layer. The steps will be described in detail below, but since the cleaning treatment and the roughening treatment are the same as those in Example 1, their descriptions will be omitted.

[0125] Antirust treatment: Using the nickel-molybdenum-cobalt alloy electrolyte solution and the tin electrolyte solution shown below, a nickel-molybdenum-cobalt alloy layer was formed on the surface of the rough surface, and then a tin layer was formed. Table 1 summarizes the detailed manufacturing conditions for forming the nickel-molybdenum-cobalt...

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Abstract

This invention provides a surface treated copper foil which, without use of chromium in an antirust treated layer in an electrolytic copper foil, is excellent in good properties after fabrication into a printed wiring board, for example, in peel strength of a circuit and the percentage deterioration in chemical resistance regarding the peel strength. In the surface treated copper foil, an antirust treated layer and a silane coupling agent layer are provided on a face of lamination of an electrolytic copper foil onto an insulating resin base material. The surface treated copper foil is characterized in that the antirust treated layer comprises a nickel alloy layer having a weight thickness of 5 mg / m to 50 mg / m and a tin layer having a weight thickness of 5 mg / m to 40 mg / m stacked in that order and a silane coupling agent layer is provided on the surface of the antirust treated layer. Further, the present invention further provides, for example, a surface treated copper foil with a very thin primer resin layer, characterized in that a very thin primer resin layer having an equivalent thickness of 1 [mu]m to 5 [mu]m is provided on a face of lamination of the surface treated copper foil (not subjected to roughening treatment) on the insulating resin base material.

Description

technical field [0001] The present invention relates to a surface-treated copper foil and a method for producing the same, and a surface-treated copper foil with an extremely thin primer resin layer and a method for producing the same. In particular, there is provided a surface-treated copper foil capable of exhibiting good performance as a copper foil for printed circuit boards even when no chromium element is contained as a surface treatment element such as rust prevention. Background technique [0002] Conventionally, chromium components have been widely used in chrome plating or chromate treatment as antirust elements and surface modifying elements of copper foil for printed circuit boards. In particular, almost all copper foils on the market in recent years have been treated with acid salts. When the chromium component exists as a chromium compound, its oxidation value is trivalent or hexavalent. Among them, hexavalent chromium is far more toxic to organisms than triv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00B32B15/08C25D5/10C25D7/06H05K1/09
CPCC25D5/50C25D5/56H05K2201/0358H05K2201/0355H05K2203/0723C25D5/12C25D5/48C25D5/34H05K3/384H05K2203/072H05K3/389C25D7/12H05K3/386Y10T428/265Y10T428/27C25D7/00
Inventor 松永哲广松岛敏文佐藤哲朗
Owner MITSUI MINING & SMELTING CO LTD
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