Heat radiation structure of surface mounting high-power element

Abstract

The invention provides a heat radiation structure of a surface mounting high-power element for conducting heat energy radiated by the high-power element, comprising a heat-conducting copper block, an aluminum base heat radiation panel, a heat radiation shell. The heat-conducting copper block is embedded in a circuit board and has thickness the same as that of the circuit board; the aluminum base heat radiation panel is plated with a copper welding pan at one surface, while the other surface thereof is connected with the heat radiation shell; and the heat radiation shell radiates heat energy to air in a way of natural convection. The high-power element is enveloped in a way of surface mounting. The installation of the high-power element is characterized in that the high-power element is connected with the front surface of the heat-conducting copper block embedded on the circuit board by welding. The installation of the aluminum base heat radiation panel is characterized in that the aluminum base heat radiation panel is connected with the reverse surface of the heat-conducting copper block embedded on the circuit board by welding. The invention adopts a following heat radiation access: the high-power element-the heat-conducting copper block-the aluminum base heat radiation panel-the air, effectively reduces the work temperature of the high-power element, remains the work temperature of the high-power element at a rated range, and meets the technical requirement of on-vehicle electronic equipment. The heat radiation structure has the advantages of good heat radiation effect, simple structure, low cost, and the like.

Description

technical field [0001] The invention relates to a heat dissipation structure for mounting a patch type high-power element on a circuit board, in particular to a heat dissipation device for the patch type high-power element. Background technique [0002] With the continuous development of automotive electronic products, high-power, miniaturized and light-weight motor control units are the development direction. Since many existing motor drive chips use high-power transistors to amplify the current to drive the motor, and the heat sink area and capacity of a single high-power transistor chip are limited, a heat dissipation structure must be supplemented to eliminate excessive heat on the chip and quickly Dissipates heat to extend the life of high-power transistor chips. Therefore, in the mass-produced automotive electronic control products, more high-power transistor products use the SMD package, and how the SMD-packaged high-power components are welded to the circuit board o...

AI Technical Summary

Problems solved by technology

Generally, the heat dissipation method using SMD high-power components is installed in this way, see figure 1 : Design and process a lot of metallized through-holes 2 on the position where the circuit board 3 is welded to the patch type high-power component 1 that needs heat dissipation. When soldering, these metallized through-holes are filled with solder, and the external heat dissipation is installed. When the board 5 is installed, a layer of thermally conductive insulating material 4 should be added between the circuit board 3 and the heat sink 5 to ensure the insulation between the circuit board and the heat sink. 3 and heat dissipation plate 5 are clamped with screws, or other methods are used to compress circuit board 3 and heat dissipation plate 5 to achieve heat dissipation effect, but the heat conduction area of ​​these metallized through holes is much smaller than the heat dissipation area that can be soldered by high-power components. It does not have the ability to quickly extract the high heat generated inside the high-power components, because the cross-sectional area of ​​the metallized holes 2 densely distributed on the circuit board is small and the thermal insulation between the reverse side of the circuit board and the heat sink is added. The thermal conductivity of material 4 is not very high, so the heat dissipation structure of directly soldering high-power patch components on the circuit board is limited in practical applications

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