Electric insulation heat-conducting resin composite material and preparation method thereof

A technology of composite materials and thermally conductive resins, applied in chemical instruments and methods, fibrous fillers, inorganic pigments, etc., can solve problems such as low thermal conductivity and no electrical insulation, and achieve improved interface interaction and excellent thermal conductivity , the effect of high thermal conductivity

Active Publication Date: 2009-12-09
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a silicon dioxide-coated carbon nanotube with strong electrical insulation and thermal conductivity for the existing carbon nanotube-filled composite materials with low thermal conductivity and no electrical insulation. Epoxy resin composite material and preparation method thereof

Method used

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  • Electric insulation heat-conducting resin composite material and preparation method thereof
  • Electric insulation heat-conducting resin composite material and preparation method thereof
  • Electric insulation heat-conducting resin composite material and preparation method thereof

Examples

Experimental program
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Effect test

example 1

[0027] 2 g of carbon nanotubes were placed in a mixed acid of 225 ml of nitric acid and 75 ml of sulfuric acid, refluxed and oxidized at 120° C. for 6 h, then filtered, washed with deionized water and dried. The treated carbon nanotubes were ultrasonically dispersed in a mixture of 200ml of absolute ethanol, 8ml of ammonia water and 90ml of deionized water, ultrasonically oscillated for 10 minutes, and then mechanically stirred for 30 minutes to obtain liquid A. Quickly add 12ml of ethyl orthosilicate to solution A, and mechanically stir at room temperature for 6 hours. After the reaction is finished, filter through a microporous membrane, wash, and dry to obtain silicon dioxide-coated carbon nanotubes.

[0028] Add 0.8 g of silicon dioxide surface-coated carbon nanotubes into 40 ml of acetone, ultrasonically disperse at room temperature for 30 minutes, and then add into 800 g of preheated bisphenol A type E-51 epoxy resin. Raise the temperature of the ultrasonic water bath t...

example 2

[0030] 1 g of carbon nanotubes was placed in a mixed acid of 25 ml of nitric acid and 75 ml of sulfuric acid, refluxed and oxidized at 90° C. for 12 h, then filtered, washed with deionized water and dried. The treated carbon nanotubes were ultrasonically dispersed in a mixed solution of 1000 ml of absolute ethanol and 11 ml of ammonia water, ultrasonically oscillated for 30 minutes, and then mechanically stirred for 20 minutes to obtain liquid A. Add 60ml of tetraethyl orthosilicate rapidly to liquid A, and mechanically stir at room temperature for 24 hours. After the reaction is finished, filter through a microporous membrane, wash, and dry to obtain silicon dioxide-coated carbon nanotubes.

[0031] Add 0.5 g of silicon dioxide surface-coated carbon nanotubes into 70 ml of ethanol, ultrasonically disperse at room temperature for 60 minutes, and then add 25 g of preheated bisphenol A type E-44 epoxy resin. Raise the temperature of the ultrasonic water bath to 90°C, continue u...

example 3

[0033] 1 g of carbon nanotubes was placed in a mixed acid of 60 ml of nitric acid and 60 ml of sulfuric acid, refluxed and oxidized at 100° C. for 8 h, then filtered, washed with deionized water and dried. The treated carbon nanotubes were ultrasonically dispersed in a mixture of 600ml of absolute ethanol, 22ml of ammonia water and 180ml of deionized water, ultrasonically oscillated for 15 minutes, and then mechanically stirred for 20 minutes to obtain liquid A. Add 35ml of tetraethyl orthosilicate rapidly to liquid A, and mechanically stir at room temperature for 12 hours. After the reaction is finished, filter through a microporous membrane, wash, and dry to obtain silicon dioxide-coated carbon nanotubes.

[0034] Add 1 g of silica-coated carbon nanotubes into 100 ml of tetrahydrofuran, ultrasonically disperse at room temperature for 40 minutes, and then add 100 g of preheated bisphenol A type E-51 epoxy resin. Raise the temperature of the ultrasonic water bath to 80°C, con...

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Abstract

The invention provides a silicon dioxide-coated carbon nano tube-epoxide resin composite material with electric insulation property and high heat-conducting effect and a preparation method thereof, aiming at solving the defects of low coefficient of heat conductivity and the lack of electric insulation property of the existing carbon nano tube-filled composite materials. The steps are as follows: the sol-gel method is used for preparing SiO2-coated carbon nano tubes, and the tubes are dispersed in epoxide resin and then are solidified and molded. The material of the invention has the advantages that the use level of the silicon dioxide-coated carbon nano tube is low, the material can be favorably dispersed in the epoxide resin, the heat-conducting property of the carbon nano tube is played, and the surface of the carbon nano tube is enabled to be insulating, thereby improving the heat-conducting property of a polymer and meeting the requirement on electrical insulation property.

Description

technical field [0001] The invention relates to an electrically insulating and thermally conductive resin composite material and a preparation method thereof, in particular to a silicon dioxide-coated carbon nanotube-epoxy resin composite material with electrical insulation and thermal conductivity enhancing effects and a preparation method thereof. Background technique [0002] With the continuous miniaturization of integrated circuit devices and the increase in quantity, a large amount of heat generated by electronic components during operation seriously affects the performance and reliability of components, and brings a series of thermal management problems. Therefore, electronic packaging materials have become the main bottleneck restricting the further improvement of integrated circuit performance. Plastic packaging materials are used in the largest amount among electronic packaging materials and are developing fastest, and among them, epoxy resin is the most widely use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/10C09C1/44C09C3/06C08L63/02C08K5/3445C08K5/09
Inventor 解孝林崔伟周兴平
Owner HUAZHONG UNIV OF SCI & TECH
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