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Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition

A technology of photosensitive resin and manufacturing method, which is applied in the field of photosensitive resin and photosensitive resin composition, can solve problems such as inability to develop with dilute alkali, poor solubility of dilute alkali, and drop in acid value, and achieve thermal stability and The effect of excellent development control latitude and high sensitivity

Inactive Publication Date: 2009-12-23
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although such resins achieve high sensitivity, the thermal stability of the resin is significantly reduced. Therefore, not only the storage stability of the resin itself is poor, but also the stability of the solder resist ink when it is developed with a dilute alkaline solution (the so-called drying control latitude) also bad
For example, when printing on a double-sided substrate, coating is performed first, and the problem that the solvent-dried side cannot be developed with dilute alkali due to the heat of the solvent drying on the opposite side is likely to occur; When development is not performed on weekdays, there is also the problem of poor operability such as dilute alkali development is not possible
In addition, if the addition amount of the compound having one epoxy group and one or more radically polymerizable unsaturated groups is increased in order to further increase the sensitivity, the result is that the acidity of the resin is reduced due to the decrease in the amount of carboxyl groups in the resin. The price drops and the solubility of dilute alkali becomes poor
In this document, there is no record for the above-mentioned problems

Method used

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  • Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition
  • Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition
  • Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition

Examples

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Embodiment

[0067] Hereinafter, the present invention will be described in more detail by way of Examples and Comparative Examples, and "parts" and "%" in each example are based on mass unless otherwise specified. The present invention is not limited to these examples.

Synthetic example 1

[0068] Synthesis Example 1 (Synthesis Example of Resin 1)

[0069] In the flask with stirrer, gas inlet tube, reflux tube, add 92 parts of ethyl carbitol acetate, dissolve 210 parts (1.0 equivalents) of o-cresol novolak type epoxy resin (trade name: エポトトト (registered trademark) YDCN704, manufactured by Tohto Chemical Co., Ltd., epoxy equivalent 210). Further add 69.84 parts (0.97 moles) of acrylic acid, 2.16 parts (0.03 moles) of glycolic acid, 2.17 parts of polymerization inhibitor 2,6-di-tert-butyl-4-methoxyphenol and 0.45 parts of triphenylphosphine, 0.85 parts of cyclo Chromium alkanoate (3% metal content). The reaction was continued for 10 hours while heating to 130° C. while blowing air from the gas inlet pipe at the lower part of the liquid surface to obtain a reactant (reactant I) having an acid value of 0.5 mg KOH / g. 98 parts of ethyl carbitol acetate and 106.4 parts (0.7 mol) of tetrahydrophthalic anhydride were added thereto, and the reaction was further carried ou...

Synthetic example 2

[0070] Synthesis Example 2 (Synthesis Example of Resin 2)

[0071] In the flask with stirrer, gas inlet tube, reflux tube, add 92 parts of ethyl carbitol acetate, dissolve 210 parts (1.0 equivalents) of o-cresol novolak type epoxy resin (trade name: エポトトト (registered trademark) YDCN704, manufactured by Tohto Chemical Co., Ltd., epoxy equivalent 210). Further add 69.84 parts (0.97 moles) of acrylic acid, 2.16 parts (0.03 moles) of glycolic acid, 2.17 parts of polymerization inhibitor 2,6-di-tert-butyl-4-methoxyphenol and 0.45 parts of triphenylphosphine, 0.85 parts of cyclo Zirconium alkanoate (metal content 6%) is heated to 130 ℃ and continued to react for 10 hours while blowing into air from the gas inlet pipe at the lower part of the liquid surface, to obtain the reactant (reactant I) that the acid value is 0.5mg KOH / g ). 98 parts of ethyl carbitol acetate and 106.4 parts (0.7 mol) of tetrahydrophthalic anhydride were added thereto, and the reaction was further carried out ...

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Abstract

A process for producing a photosensitive resin which is capable of exposure to ultraviolet and development with a dilute aqueous alkali solution, has high sensitivity, is satisfactory in thermal stability and development control tolerance, and is suitable for use as a solder resist ink giving a coating film having excellent performances; a photoresist resin obtained by the production process; and a composition containing the photosensitive resin. The process for photosensitive resin production comprises reacting a novolak type polyfunctional epoxy resin with an unsaturated monobasic acid and a saturated monobasic acid having a primary alcoholic hydroxy group in the presence of an organic compound of trivalent phosphorus and a specific metal salt catalyst to obtain a resin (reaction product I), reacting the resin with a polybasic acid anhydride, and reacting the resultant resin (reaction product II) with a compound having a radical-polymerizable unsaturated group and an epoxy group and a water-soluble monoepoxy compound.

Description

technical field [0001] The present invention relates to a method for producing a photosensitive resin, a photosensitive resin obtained by the method, and a photosensitive resin composition. More specifically, it relates to photosensitivity that is soluble in dilute alkali, has high sensitivity and excellent thermal stability, and is used in the field of electronic materials such as solder resist for printed wiring boards, interphase insulating films for high-density multilayer boards, and solder resist for semiconductor component substrates. Resins and photosensitive resin compositions. Background technique [0002] In recent years, dilute-alkali-developable liquid photo-solder resist inks have been widely used as solder resist inks for various printed wiring boards from the viewpoint of productivity. For example, a resin composition containing a novolak-type epoxy (meth)acrylate having a carboxyl group in a side chain has been proposed, and it is currently becoming mainstr...

Claims

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Application Information

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IPC IPC(8): C08G59/14G03F7/027
CPCC08G59/1461G03F7/038C08G59/08C08G59/4215
Inventor 上井浩志小林将行
Owner SHOWA DENKO KK
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