Tin slag reducer

A reducing agent and tin slag technology, applied in the field of tin slag reducing agent, can solve the problems of liquid solder fluidity, low reduction ratio, environmental pollution, etc., to improve welding quality and product quality, reduce the formation of tin oxide slag, The effect of improving the quality of tin liquid

Inactive Publication Date: 2009-12-30
黄俊凯
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  • Abstract
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  • Claims
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Problems solved by technology

Solder oxide slag is mainly a mixture of alloy solder oxide and a large amount of alloy solder. It is continuously produced and accumulated on the surface of molten alloy solder, which not only affects the fluidity of liquid solder, but also may pollute the PCBA board surface and directly affect the product. Excellent welding quality and reliability, and cause a huge waste of alloy solder
In the electronics manufacturing industry, with the gradual introduction of lead-free soldering technology, lead-free solder alloys with high tin content gradually replace traditional Sn63/37 alloy solders; the content of Sn in lead-free solders is much higher than that of traditional leaded solders , so it is easier to oxidize and produce more oxide slag (SnO2); with the wide application of lead-free s

Method used

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Embodiment Construction

[0008] Specific embodiments of the present invention will be further described in detail below.

[0009] A kind of tin slag reducing agent provided by the present invention, described reducing agent comprises fatty alcohol polyoxyethylene ether phosphate, alkoxylated alcohol, polyethylene glycol, triethanolamine, diethylene glycol monobutyl ether, cyclic Hexylamine carbonate, phytic acid, ammonium succinate and phosphorus pentoxide.

[0010] The percentage contents of the tin slag reducing agent prepared by each component of the present invention are respectively: 20-30% of fatty alcohol polyoxyethylene ether phosphate, 30-50% of alkoxylated alcohol, 30-50% of polyethylene glycol, Triethanolamine 3~5%, diethylene glycol monobutyl ether 1~2%, cyclohexylamine carbonate 3~5%, phytic acid 1~2%, ammonium succinate 1~2% and phosphorus pentoxide 1~3%.

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Abstract

The invention discloses a tin slag reducer. The reducer comprises fatty alcohol polyethenoxy ether phosphate, alkoxy alcohol, silicone oil, ammonium dihydrogen phosphate, diethylene glycol monobutyl ether, cyclohexylamine carbonate, phytic acid, ammonium succinate and phosphorus pentoxide. The tin slag reducer can reduce and reuse the tin slag produced in the electronic processing industry, and improves the welding quality and the product quality.

Description

technical field [0001] The invention relates to a tin slag reducing agent. Background technique [0002] In the electronic manufacturing process, the wave soldering process is essential and plays a key role in the soldering quality of electronic products. The characteristics of the wave soldering process determine that the surface of new liquid solder is continuously exposed to the air during the soldering process, and the molten solder contacts with oxygen in the air in a flowing state and continuously oxidizes to form oxide slag. Solder oxide slag is mainly a mixture of alloy solder oxide and a large amount of alloy solder. It is continuously produced and accumulated on the surface of molten alloy solder, which not only affects the fluidity of liquid solder, but also may pollute the PCBA board surface and directly affect the product. Excellent welding quality and reliability, and cause a huge waste of alloy solder. In the electronics manufacturing industry, with the grad...

Claims

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Application Information

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IPC IPC(8): C22B25/06C22B7/04
CPCY02P10/20
Inventor 黄俊凯
Owner 黄俊凯
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