Method of recycling electroless nickel waste

一种化学镀镍、镍离子的技术，应用在化学仪器和方法、液态化学镀覆、卤化镍等方向，能够解决阻止大规模应用等问题

Inactive Publication Date: 2010-01-27
MACDERMID ACUMEN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the presence of sodium and sulfate ions in electroless nickel waste prevents its large-scale application as a fertilizer intermediate

Method used

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  • Method of recycling electroless nickel waste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The electroless nickel plating solution was composed according to the following formula:

[0037] Nickel metal 6g / l (added as nickel carbonate)

[0038] Hypophosphorous acid 27g / l

[0039] Acetic acid 18g / l

[0040] Lactic acid 26g / l

[0041] Lead 2ppm

[0042] Ammonium iodate 200ppm

[0043] Ammonia solution Sufficient to adjust pH to 4.8

[0044]Run the plating bath at 88-90°C. Nickel is plated from the bath, and the concentrations of hypophosphite and nickel are maintained by adding ammonium hypophosphite and nickel hypophosphite to the bath. The pH of the plating bath was maintained by adding an aqueous ammonia solution. The lead and iodate concentrations were maintained by adding lead in the form of lead acetate and ammonium iodate.

[0045] Run the plating bath in this manner until 4 metal "renewals" have been completed. At this point, analysis of the bath demonstrated that the bath contained the following composition:

[0046] Nickel metal 6g / l

[0047...

Embodiment 2

[0063] The plating bath described in Example 1 was run at 88-90°C. Nickel is plated from the plating bath, and the concentrations of hypophosphite and nickel are maintained by adding ammonium hypophosphite and nickel hypophosphite. The pH of the plating bath was maintained by adding potassium carbonate solution. The lead and iodate concentrations were maintained by adding lead in the form of lead acetate and ammonium iodate.

[0064] Run the plating bath in this manner until 4 metal "renewals" have been completed. At this point, analysis of the plating bath gave the following composition:

[0065] Nickel metal 6g / l

[0066] Hypophosphite ion 25g / l

[0067] Acetic acid 20g / l

[0068] Lactic acid 28g / l

[0069] Phosphite ion 125g / l

[0070] Potassium ions 120g / l

[0071] Ammonium ion 25g / l

[0072] The nickel ions were then removed from the plating bath using the method described in Example 1, but instead of using the acid form of the resin, treatment of the acid form o...

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Abstract

An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.

Description

technical field [0001] The present invention relates to an electroless nickel plating solution utilizing hypophosphite ion as a reducing agent, and a recycling method for using the solution indefinitely without releasing hazardous waste. Background technique [0002] Electroless nickel deposits a nickel alloy on a substrate in a method that facilitates the deposition of the alloy from a treatment solution containing nickel ions and utilizes an appropriate chemical reducing agent that reduces the nickel ions in solution to nickel metal. These reducing agents typically include borohydride and hypophosphite ions. Typically, electroless nickel plating is performed using hypophosphite ions as a reducing agent. When hypophosphite reduces nickel on the catalytic surface, some phosphorus co-deposits with the nickel, resulting in a nickel / phosphorus alloy containing about 6-12% phosphorus. The alloy has unique properties in terms of corrosion resistance and (after heat treatment) h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01G53/09C01G53/00
CPCC01P2006/88C01G53/003C23C18/1617C22B7/006C23C18/36C22B3/42C22B23/0461C22B23/00Y02P10/20
Inventor 特雷弗尔·皮尔森保罗·布雷
Owner MACDERMID ACUMEN INC
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