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4 results about "HYPOPHOSPHITE ION" patented technology

The hypophosphite ion is H 2 PO − 2.The salts are prepared by heating white phosphorus in warm aqueous alkali e.g. Ca(OH) 2: P 4 + 2 Ca(OH) 2 + 4 H 2 O → 2 Ca(H 2 PO 2) 2 + 2 H 2. Hypophosphites are reducing agents:. H 2 PO − 2 + 3OH − → HPO 2− 3 + 2H 2 O + 2e −. Hypophosphites are used in electroless nickel plating as the reducing agent to deposit for example Ni metal from Ni salts.

Bendable nickel plating on flexible substrates

A method of producing a flexible nickel phosphorus coating on a substrate. The substrate includes a dielectric material having a copper layer thereon. The method comprises the steps of: (1) activating the substrate with a palladium activation solution to catalyze the substrate, and 2) contacting the activated substrate with an electroless nickel phosphorus plating bath comprising: (i) a source of nickel ions; (ii) a hypophosphite ion source; (iii) at least one metal complexing agent; and (iv) an organic flexible additive. The nickel-phosphorus plating layer deposited on the substrate shows a columnar grain structure.
Owner:MACDERMID ENTHONE INC

Bendable Nickel Plating on Flexible Substrates

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.
Owner:MACDERMID ENTHONE INC

Bendable nickel plating on flexible substrates

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.
Owner:MACDERMID ENTHONE INC

Treatment method and treatment device for chemical nickel wastewater

The invention particularly relates to a chemical nickel wastewater treatment method and a chemical nickel wastewater treatment device, and belongs to the technical field of water treatment. According to the method, an electrolytic method, electrodialysis, reverse osmosis and electrodeposition combined process is adopted, BBD is used as an electrolytic anode for complex breaking treatment, metal nickel with high additional value is recycled, no pollutant is discharged, and hypophosphite ions in wastewater are converted into phosphate fertilizer for production. The invention further provides a treatment device for the chemical nickel wastewater, the treatment device is efficient, full-automatic operation is achieved, and the labor cost is reduced.
Owner:SHENZHEN QIXIN ENVIRONMENTAL PROTECTION TECH CO LTD