Adhesive resin composition and dicing die bonding film using the same

A technology of adhesive resin and composition, which is applied in the direction of adhesive type, adhesive, epoxy glue, etc., and can solve problems such as voids, falling off, and reliability problems of semiconductor packaging

Inactive Publication Date: 2010-03-17
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the step of laminating the adhesive to the backside of the semiconductor wafer, the pressure-sensitive adhesive bonds at room temperature, unlike conventional methods that add a heating step, which also creates considerable voids.
In addition, there are problems at the time of heating, the wafer is bent due to high temperature, the subsequent steps are not easy to perform, and chips are peeled off due to the weak bond strength of the adhesive in the slicing step
Therefore, there is a problem with the reliability of the semiconductor package

Method used

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  • Adhesive resin composition and dicing die bonding film using the same
  • Adhesive resin composition and dicing die bonding film using the same
  • Adhesive resin composition and dicing die bonding film using the same

Examples

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preparation example Construction

[0039] The preparation method procedure for the thermoplastic resin can be appropriately selected by those skilled in the art to which the present invention pertains. Without particular limitation, methods such as solution polymerization, emulsion polymerization, or suspension polymerization, for example, can be used.

[0040] In the adhesive resin composition according to the present invention, a coupling agent may be further included. The coupling agent may be contained in an amount of 0.01 to 10 parts by weight, preferably 0.1 to 10 parts by weight, relative to 100 parts by weight of all resin components. The closed bonding of the semiconductor wafer or silica filler herein to the interface can be improved by including the coupling agent. In addition, cohesion and sealing adhesion can be improved by the reaction of the organic functional group in the coupling agent with the resin composition during the curing reaction, without affecting the heat resistance of the hardener,...

Embodiment 1

[0103] Acrylic resin preparation

[0104] 150 g of butyl acrylate, 200 g of ethyl acrylate, 140 g of acrylonitrile, 16 g of glycidyl methacrylate, and 1,500 g of deionized distilled water were added to a 4-neck 3L reactor with a stirrer, a nitrogen replacement device, and a thermometer. Thereto was added 4 g of a water dilution of 4% polyvinyl alcohol (trade name: NH-17, manufactured by Nippon Ghosei) as a suspending agent, and 0.3 g of dodecyl mercaptan as a molecular weight regulator to prepare a mixture. Nitrogen substitution was performed in the mixture for about 1 hour, and the temperature was raised to 55°C. When the set temperature was reached, 4 g of diethylhexyl peroxydicarbonate (trade name: Trigonox EHP, manufactured by Akzo Nobel) diluted to 2% in ethyl acetate was added as an initiator to initiate polymerization. The reaction was complete after 4 hours of initiation. The reactants were washed several times with deionized distilled water, and then dried with a ...

Embodiment 2

[0109] Except using 100 parts by weight of dicyclopentadiene-modified epoxy resin (XD-1000L, produced by NipponKayaku Co., Ltd.; epoxy equivalent: 253, softening point: 74°C) as epoxy resin and 70 parts by weight DPP-6115 was used as the phenolic resin, and the film was prepared in the same manner as in Example 1.

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Abstract

The present invention relates to an adhesive resin composition applied to prepare a semiconductor package, an adhesive film and its preparation process, a dicing die bonding film, and a semiconductordevice, using the same. The adhesive resin composition according to the present invention is characterized by comprising a) a multi-functional epoxy resin; b) a phenol resin, of which the moisture absorptivity is 2.0 % by weight or less, as treated in a condition of the temperature of 121 DEG C, 2 atms and 100% RH for 48 hours; and c) a thermoplastic resin. It has excellent bond strength with a wafer and filling property in a semi-curing state, so that the process fraction defective may be reduced. It has excellent heat resistance, hygroscopic resistance or reflow crack resistance, and the like in the cured state, so that semiconductor devices having excellent reliability may be prepared.

Description

technical field [0001] The present invention relates to an adhesive resin composition for preparing semiconductor encapsulation, an adhesive film, a dicing die bonding film, and a semiconductor device prepared using the composition, and the preparation of the adhesive film method. The adhesive resin composition according to the present invention is characterized in that it comprises a) a multifunctional epoxy resin; b) a phenolic resin whose moisture absorption rate is 2.0% by weight or less; and c) a thermoplastic resin. Background technique [0002] Currently, with the high integration and high functionality of semiconductor memory, flash memory has begun to be incorporated into mobile phones or mobile terminals, and the method of MCP (Multi-Chip Package) in which multiple semiconductor chips are laminated on a semiconductor substrate is widely used. In the MCP method, a film-like adhesive is used instead of a conventional liquid-phase epoxy glue (Japanese Unexamined Pat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00
CPCC09J163/00C08G59/686C08G59/3209C08G59/08C08G59/621
Inventor 朴孝淳洪宗完柳贤智金章淳朱孝叔张锡基
Owner LG CHEM LTD
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