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Halogen-free lead-free soldering paste for radiator and preparation method thereof

A lead-free solder and heat sink technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve problems affecting the expansion rate and oxidation resistance of solder paste, hidden dangers of product reliability, and insulation resistance reduction, etc., and achieve high strength Oxidation resistance, good viscosity, low corrosion effect

Inactive Publication Date: 2010-04-21
东莞市特尔佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the residual halogen after soldering will undergo electron migration, which will cause a decrease in insulation resistance, affect the expansion rate and oxidation resistance of the solder paste, and in severe cases will corrode the substrate, and even lead to product failure, bringing inevitable hidden dangers to the reliability of the product

Method used

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  • Halogen-free lead-free soldering paste for radiator and preparation method thereof

Examples

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Embodiment 1

[0032] Flux raw materials: polymerized rosin 50g, hydrogenated rosin 5g, suberic acid 2g, glutaric acid 2g, triethanolamine 2g, hydrogenated castor oil 3g, benzotriazole 1g, nonyl polyoxyethylene ether 1g, ethylene glycol benzene Ether 34g.

[0033] Preparation method: mix 2g of suberic acid, 2g of glutaric acid, 2g of triethanolamine and 10g of ethylene glycol phenyl ether, and heat until completely dissolved to prepare an organic acid and organic amine composition, and cool to room temperature for later use. Mix 50g of polymerized rosin, 5g of hydrogenated rosin and 24g of ethylene glycol phenyl ether, heat and dissolve completely, add 3g of hydrogenated castor oil and 1g of benzotriazole, completely dissolve and cool to room temperature, then add nonyl poly 1g of oxyethylene ether and 16g of the composition of organic acid and organic amine, stir evenly to make flux, and place it in an environment with a temperature of 5-12°C. After 24 hours, take 15g of flux and 85g of Sn4...

Embodiment 2

[0035] Flux raw materials: polymerized rosin 45g, hydrogenated rosin 5g, suberic acid 6g, triethanolamine 2g, salicylamide 1g, ethylene bis stearic acid amide 1g, hydrogenated castor oil 4g, benzotriazole 1g, nonyl Polyoxyethylene ether 1.5g, ethylene glycol monobutyl ether 33.5g.

[0036] Preparation method: mix 6 g of suberic acid, 2 g of triethanolamine, 1 g of salicylic amide and 10 g of ethylene glycol monobutyl ether, and heat until completely dissolved to prepare an organic acid and organic amine composition, and cool to room temperature for later use. Mix 45g of polymerized rosin, 5g of hydrogenated rosin and 23.5g of ethylene glycol monobutyl ether, heat and dissolve completely, add 4g of hydrogenated castor oil, 1g of ethylene bis-stearamide, 6g of suberic acid, and 2g of triethanolamine , 1g of benzotriazole, completely dissolved and cooled to room temperature, then added 1.5g of nonyl polyoxyethylene ether, 19g of organic acid and organic amine composition, stirred...

Embodiment 3

[0038] Flux raw materials: polymerized rosin 35g, hydrogenated rosin 10g, suberic acid 4g, glutaric acid 2g, succinic anhydride 2g, triethanolamine 1g, salicylamide 3g, ethylene bis-stearamide 4g, hydrogenated castor oil 2g , 1.5 g of benzotriazole, 1.5 g of nonyl polyoxyethylene ether, 15 g of ethylene glycol phenyl ether, and 19 g of ethylene glycol monobutyl ether.

[0039] Preparation method: mix 4g of suberic acid, 2g of glutaric acid, 2g of succinic anhydride, 3g of triethanolamine, 3g of salicylamide and 10g of ethylene glycol phenyl ether, and heat until completely dissolved to make organic acid and organic Amine composition, cooled to room temperature for later use. Mix 35g of polymerized rosin, 10g of hydrogenated rosin, 5g of ethylene glycol phenyl ether, and 9g of ethylene glycol monobutyl ether, heat and dissolve completely, add 2g of hydrogenated castor oil, 4g of ethylene bis stearic acid amide, benzo After 1.5g of triazole is completely dissolved and cooled to...

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Abstract

The invention relates to the technical field of soldering paste, in particular to halogen-free lead-free soldering paste for a radiator and a preparation method thereof. The soldering paste consists of a soldering flux and soldering tin, wherein the soldering flux consists of the following substances in percentage by weight: 30 to 55 percent of resin, 4 to 8 percent of organic acid, 2 to 5 percent of organic amine, 3 to 10 percent of thixotropic agent, 1 to 2 percent of corrosion inhibitor, 1 to 2 percent of surfactant and a solvent. The soldering paste has no halogen, is environmentally-friendly, and has the advantages of small corrosion, good welding performance, plump welding spots, high expansion rate and insulating resistance of more than 1.0*10<12>ohm.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a halogen-free lead-free solder paste for a radiator and a preparation method thereof. Background technique [0002] At present, all lead-free solder pastes for heat sinks contain halogens. Halogens are the active components in the solder paste components. It has the function of surface purification, protects the solder from oxidation during soldering, and removes the oxide film on the metal surface. However, the residual halogen after soldering will undergo electron migration, which will cause a decrease in insulation resistance, affect the expansion rate and oxidation resistance of the solder paste, and in severe cases will corrode the substrate, and even lead to product failure, bringing inevitable hidden dangers to the reliability of the product . Halogen-free is the development trend of lead-free solder paste. Contents of the invention [0003] One of the purposes o...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/40
Inventor 陈东明邓小成周华涛
Owner 东莞市特尔佳电子有限公司
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