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Low-silver photosensitive silver paste for PDP site selection electrodes, and preparation method thereof

A photosensitive and silver paste technology, which is applied in the manufacture of electrode systems, conductive materials, conductive materials, etc., can solve the problems of high price and high electrode cost, achieve huge market application prospects, reduce production costs, and improve The effect of conductivity

Inactive Publication Date: 2010-04-21
南京金视显科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the most widely used is to use photosensitive silver paste to make PDP electrodes, which has good performance, but the price is too high. The main reason is that the main raw material for preparing electrodes is silver, and the silver content is as high as 50-80%. The cost accounts for more than 80% of the total cost, and the current price of silver in the market is very high, so the cost of preparing electrodes is also high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0013] Preparation of ultra-fine low-melting point lead-free glass powder: use chemically pure raw materials to ball mill in an agate jar according to the proportion of components, and mix them evenly. Put this material into a high-alumina crucible, preferably feed at 600°C, keep warm at 1200°C for 2 hours, quickly pour the glass liquid into cold water to quench, dry the glass slag in a constant temperature box, and use a planetary ball mill to grind it After reaching a certain particle size, dry it for later use.

[0014] A certain proportion of low-melting point glass powder and iron-based compound new superconductor powder are evenly mixed, ball milled for a certain period of time, and then dried for use.

[0015] Preparation of photosensitive carrier: Weigh high molecular copolymer and organic solvent in a container according to the proportion, heat in a water bath at 90°C, and keep stirring until the resin dissolves, filter it with a screen after cooling, then add photopo...

Embodiment 1

[0017] Embodiment 1: Preparation of low silver content photosensitive silver paste

[0018] 30 parts of Ag powder (spherical, bulk density is 4.5g / cm 3 , average particle size=1.2μm), 10 parts of nano-Ag powder (average particle size=100nm), 2 parts of superconductor powder (YFe 0.8 mn 0.2 AsO, average particle diameter=2μm), 8 parts of low melting point lead-free glass powder (average particle diameter=1.5μm, D max = 3.0 μm, amorphous, Bi 2 o 3 SiO 2 -B 2 o 3 -aO-ZrO 2 ), 12 parts of acrylic acid copolymer (poly BMA Co-HEMA-CO-MAA, molecular weight 25000g / mol), 3 parts of photoinitiator (1-p-morpholine phenyl-2-dimethylamino-2-benzyl -1-butanone), 8 parts of photosensitive monomer (dipentaerythritol pentaacrylate), 25 parts of solvent (trimethylpentanediol isobutyrate), 1 part of coupling agent (γ-glycidyl ether oxygen Propyltrimethoxysilane), 1 part of leveling agent (BYK-354) were mixed and stirred in a mixer, and then a three-roll mill was used to prepare a photos...

Embodiment 2

[0019] Embodiment 2: Preparation of low silver content photosensitive silver paste

[0020] 20 parts of Ag powder (spherical, bulk density is 4.5g / cm 3 , average particle size=1.2μm), 18 parts of nano-Ag powder (average particle size=100nm), 3 parts of superconductor powder (YFe 0.8 mn 0.2 AsO, average particle diameter=2μm), 9 parts of low melting point lead-free glass powder (average particle diameter=1.5μm, D max = 3.0 μm, amorphous, Bi 2 o 3 -SiO 2 -B 2 o 3 -BaO-ZrO 2 ), 12 parts of acrylic acid copolymer (poly BMA Co-HEMA-CO-MAA, molecular weight 25000g / mol), 3 parts of photoinitiator (1-p-morpholine phenyl-2-dimethylamino-2-benzyl -1-butanone), 8 parts of photosensitive monomer (dipentaerythritol pentaacrylate), 25 parts of solvent (trimethylpentanediol isobutyrate), 1 part of coupling agent (γ-glycidyl ether oxygen Propyltrimethoxysilane), 1 part of leveling agent (BYK-354) were mixed and stirred in a mixer, and then a three-roll mill was used to prepare a phot...

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Abstract

The invention provides low-silver photosensitive silver paste for PDP site selection electrodes, which comprises the following components in part by mass: 15 to 30 parts of ultrafine silver powder, 5 to 20 parts of nano-silver powder, 1 to 10 parts of low-melting-point lead-free glass powder, 0.1 to 5 parts of superconductor material, 5 to 17 parts of acrylic acid copolymers, 3 to 10 parts of photopolymerization monomers, 0.5 to 5 parts of photopolymerization initiator, 5 to 15 parts of organic solvent, 0.5 to 1 part of coupling agent and 1 to 2 parts of leveling agent, wherein the superconductor material is one or more of iron-based compound superconductors, namely Ba0.7K0.3Fe2As2, Ca0.5Li0.5Fe2As2, NdFe0.5Zn0.5AsO or YFe0.8Mn0.2AsO, and the average particle size of the superconductor material is 1.5 mu m. By adding the nano-silver powder and superconductor powder to the paste, the disadvantage that low-silver-content paste is insufficient in conductivity is remedied so as to greatly reduce silver consumption, save a great amount of rare metal and reduce manufacture cost on the premise of ensuring application performance.

Description

technical field [0001] The invention relates to an electrode material used in a plasma display and a preparation method thereof, in particular to a photosensitive silver paste with low silver content used for addressing electrodes of a plasma display and a preparation method thereof. Background technique [0002] The color plasma display has attracted widespread attention because of its large screen, high image quality, and high resolution. The electrode is not only a key component of the plasma display, but its cost is the key to reducing the price of the display. [0003] At present, the most widely used is to use photosensitive silver paste to make PDP electrodes, which has good performance, but the price is too high. The main reason is that the main raw material for preparing electrodes is silver, and the silver content is as high as 50-80%. The cost accounts for more than 80% of the total cost, and the price of silver is very high in the market at present, so the cost ...

Claims

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Application Information

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IPC IPC(8): H01J17/04H01J9/02H01B1/00H01B1/02H01B13/00G03F7/075
Inventor 万剑王玲徐建立林保平
Owner 南京金视显科技有限公司
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