Low-silver photosensitive silver paste for PDP site selection electrodes, and preparation method thereof
A photosensitive and silver paste technology, which is applied in the manufacture of electrode systems, conductive materials, conductive materials, etc., can solve the problems of high price and high electrode cost, achieve huge market application prospects, reduce production costs, and improve The effect of conductivity
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[0013] Preparation of ultra-fine low-melting lead-free glass powder: use chemically pure raw materials to ball-mill in an agate jar according to the proportion of components, and mix evenly. Put this material into a high-alumina crucible, preferably at 600 °C, and keep it at 1200 °C for 2 hours, then quickly pour the glass liquid into cold water for quenching, dry the glass slag in a constant temperature box, and grind it with a planetary ball mill. After reaching a certain particle size, dry it for later use.
[0014] Mix a certain proportion of low melting point glass powder and iron-based compound new superconductor powder evenly, ball mill for a certain period of time, and then dry for use.
[0015] Preparation of photosensitive carrier: Weigh the polymer copolymer and organic solvent in a container according to the ratio, heat in a water bath at 90°C, stir continuously until the resin dissolves, filter with a wire mesh after cooling, then add photopolymerization monomers,...
Example Embodiment
[0017] Example 1: Preparation of low silver content photosensitive silver paste
[0018] 30 parts of Ag powder (spherical, with a bulk density of 4.5 g / cm 3 , average particle size = 1.2 μm), 10 parts of nano-Ag powder (average particle size = 100 nm), 2 parts of superconductor powder (YFe 0.8 Mn 0.2 AsO, average particle size=2μm), 8 parts of low melting point lead-free glass powder (average particle size=1.5μm, D max = 3.0 μm, amorphous, Bi 2 O 3 SiO 2 -B 2 O 3 -aO-ZrO 2 ), 12 parts of acrylic copolymer (polyBMA Co-HEMA-CO-MAA, molecular weight 25000g / mol), 3 parts of photoinitiator (1-p-morpholine phenyl-2-dimethylamino-2-benzyl -1-Butanone), 8 parts of photosensitive monomer (dipentaerythritol pentaacrylate), 25 parts of solvent (trimethylpentanediol isobutyrate), 1 part of coupling agent (γ-glycidyl ether oxygen propyltrimethoxysilane), 1 part of leveling agent (BYK-354) were mixed and stirred in a stirrer, and then a three-roll mill was used to prepare photosens...
Example Embodiment
[0019] Example 2: Preparation of low silver content photosensitive silver paste
[0020] 20 parts of Ag powder (spherical, bulk density 4.5g / cm 3 , average particle size = 1.2 μm), 18 parts of nano-Ag powder (average particle size = 100 nm), 3 parts of superconductor powder (YFe 0.8 Mn 0.2 AsO, average particle size=2μm), 9 parts of low melting point lead-free glass powder (average particle size=1.5μm, D max = 3.0 μm, amorphous, Bi 2 O 3 -SiO 2 -B 2 O 3 -BaO-ZrO 2 ), 12 parts of acrylic copolymer (polyBMA Co-HEMA-CO-MAA, molecular weight 25000g / mol), 3 parts of photoinitiator (1-p-morpholine phenyl-2-dimethylamino-2-benzyl -1-Butanone), 8 parts of photosensitive monomer (dipentaerythritol pentaacrylate), 25 parts of solvent (trimethylpentanediol isobutyrate), 1 part of coupling agent (γ-glycidyl ether oxygen propyltrimethoxysilane), 1 part of leveling agent (BYK-354) were mixed and stirred in a stirrer, and then a three-roll mill was used to prepare photosensitive sil...
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