Method for manufacturing thermosetting positive temperature coefficient thermistor and conductive adhesive therewith

A thermistor and positive temperature coefficient technology, which is applied to resistors with positive temperature coefficients, conductive adhesives, adhesives, etc., can solve the problem that the uniformity of resistance value is not within the scope of investigation, and the ideal low room temperature resistivity cannot be achieved. , affecting the normal operation of electrical equipment, etc., to achieve the effect of controllable cross-linking density, excellent reliability and good uniformity

A thermistor and positive temperature coefficient technology, which is applied to resistors with positive temperature coefficients, conductive adhesives, adhesives, etc., can solve the problem that the uniformity of resistance value is not within the scope of investigation, and the ideal low room temperature resistivity cannot be achieved. , affecting the normal operation of electrical equipment, etc., to achieve the effect of controllable cross-linking density, excellent reliability and good uniformity

CN101728038AInactive Publication Date: 2010-06-09SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Method for manufacturing thermosetting positive temperature coefficient thermistor and conductive adhesive therewith
  • Method for manufacturing thermosetting positive temperature coefficient thermistor and conductive adhesive therewith
  • Method for manufacturing thermosetting positive temperature coefficient thermistor and conductive adhesive therewith

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Note:

[0048] Thermosetting resin 1, rubber modified epoxy resin, CVC, grade RM-22, 70g solution (85% solid content, DMF solvent)

[0049] Curing agent 1, silicone modified self-crosslinking polyhydroxyl epoxy resin, Zhonglan Chenguang Chemical Research Institute, brand 670, 30g solution (75% solid content, DMF solvent)

[0050] Curing agent 2, polynonacetic anhydride, commercially available, 17.5g

[0051] Curing accelerator, 2-methylimidazole, commercially available

[0052] Conductive filler, nickel powder, INCO, grade 210

[0053] Inorganic filler, SiO 2 , Hangzhou Wanjing New Material Co., Ltd., brand VK-SP30

[0054] Auxiliary, coupling agent, Dow, 6030

[0055] Solvent, DMF, acetone, commercially available

[0056] Put the thermosetting resin and curing agent in the above formula into a mixer filled with solvent and dissolve for 60 minutes at room temperature. After the dissolution is complete, turn on the agitator and stir at a speed of 200 rpm for...

Embodiment 2

[0058] The preparation of the prepreg is the same as in Example 1, the first period of hot pressing is set to 75 minutes, and the subsequent process is the same as in Example 1.

Embodiment 3

[0060] The preparation of the prepreg is the same as in Example 1, the first period of hot pressing is set to 50 minutes, and the subsequent process is the same as in Example 1.

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Abstract

The invention relates to a method for manufacturing a thermosetting positive temperature coefficient thermistor and conductive adhesive therewith. The method comprises the following steps of: coating conductive adhesive on one side of a metal foil, eliminating solvent by roasting for 120-600 seconds at 120-200 DEG C to obtain a conductive semi-solid sheet, and controlling the gelation time of the semi-solid sheet at 170 DEG C hot plate / 70-110 seconds; oppositely superposing and sticking two semi-solid sheets with the same size at the conductive adhesive coating surfaces and carrying out hot pressing and full solidifying to form a solid sheet; and cutting the solid sheet into chips with proper size, welding conductive pins on the surfaces of the metal foils of the chips to obtain the thermosetting positive temperature coefficient thermistor. The method induces a semi-solid sheet manufacturing procedure, so that the controllability of semi-solid epoxide resin is enhanced, and finished product with low electrical resistivity, good uniformity and excellent reliability can be obtained by combining semi-solidifying degree and the hot press process.

Description

technical field [0001] The invention relates to a thermistor whose main raw material is a polymer composite material, in particular to a method for manufacturing a thermosetting positive temperature coefficient thermistor, as well as a thermosetting conductive adhesive used in the manufacturing process and its preparation. The resistance value of the finished thermistor has the characteristic of increasing with the increase of temperature. Background technique [0002] Positive temperature coefficient (positive temperature coefficient) material means that its resistivity increases with the increase of temperature. Some polymers blended with conductive fillers can be made to have a lower room temperature resistivity, and the resistivity increases as the temperature rises, and the resistivity rises sharply at a certain temperature point. Such materials, which have positive temperature coefficient properties, have been fabricated into thermistors used in overcurrent protection...

Claims

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Application Information

Patent Timeline
09 Jun 2010
Publication
CN101728038A
IPC
H01C7/02; C09J163/00; C09J9/02
Inventors
孙天举; 刘正平