Multilayer film for low load working condition of micro electro mechanical system and preparation method thereof

Abstract

The invention provides a multilayer film for a low load working condition of a micro electro mechanical system and a preparation method thereof. The multilayer film comprises a coupling agent layer, an elastomer layer and a hard film layer sequentially from bottom to top, wherein, the coupling agent layer and the elastomer layer are combined by chemical reaction, and the hard film layer is deposited on the surface of the elastomer layer. The preparation method comprises the following steps: cleaning an Si chip to remove organic impurities and surface oxide; carrying out hydroxylation on the cleaned silicon chip; allowing a commercially available silane coupling agent containing ethoxy to react with the hydroxylated silicon surface by a self-assembly technique so as to link the coupling agent with the silicon surface through chemical bonds; then allowing maleic anhydride on thermoelastic plastics to react with amido on the coupling agent by the self-assembly technique again to complete the chemical bond linkage of the coupling agent and the elastomer; and depositing an DLC film on the surface of the elastomer. The film prepared by the invention can improve the friction and wear resistance of silicon devices, reduce energy dissipation generated in the friction process of materials, and improve the tribological performance of the materials.

Description

technical field [0001] The invention relates to a thin-film preparation method for micro-electro-mechanical systems, in particular to a multilayer thin-film for low-load working conditions of micro-electro-mechanical systems and a preparation method thereof. Background technique [0002] As a mature semiconductor material, silicon material has been widely used in micro-electromechanical systems. With the maturity of IC technology and the integration of mechatronics products, there are more and more moving parts in micro-devices, such as micro-motors, Electrode brushes, etc. There must be friction and wear if there is sliding, but previous studies have shown that silicon has a relatively large friction coefficient and is not suitable as a friction pair material. Based on this problem, researchers have started to study the surface modification of silicon materials. Typically, polymer films such as OTS films, FDTS films, and LB films are prepared on the silicon surface by self...

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Problems solved by technology

However, the pressure resistance of the self-assembled film is not enough. When the load between the friction pairs is large, the self-assembled film will be scratched, thereby damaging the silicon material under the self-assembled film, and the diamond-like carbon (DLC) is prepared on the silicon surface. Although the hard thin film represented by the thin film can bear a large load, it is easy to break under the action of the impact load, and the energy generated by the impact cannot be effectively absorbed, and is directly transmitted to the silicon material device, resulting in device failure.

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