Dicing die-bonding film and process for producing semiconductor device
A technology for bonding film and cutting film, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., and can solve the problems of large semiconductor chip size, difficulty in picking up semiconductor chips, and difficulty in preparing retention force cutting die bonding film. , to achieve the effect of low pollution performance improvement and excellent balance
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Embodiment 1
[0162]
[0163] Acrylic polymer X was obtained by mixing 95 parts of 2-ethylhexyl acrylate (hereinafter sometimes referred to as "2EHA"), 5 parts of 2-hydroxyethyl acrylate (hereinafter sometimes referred to as "HEA"), and 65 parts of toluene It was charged into a reactor equipped with a cooling pipe, a nitrogen gas introduction pipe, a thermometer and a stirring device, followed by polymerization treatment at 61° C. for 6 hours in a nitrogen stream.
[0164] Next, the pressure-sensitive adhesive solution of the heat-expandable pressure-sensitive adhesive was prepared by mixing 3 parts of polyisocyanate compound (trade name "COLONATEL", produced by Nippon Polyurethane Industry Co. Ltd.) and 35 parts of heat-expandable microspheres (trade name " Microsphere F-50D", manufactured by Matsumoto Yushi-Seiyaku Co., Ltd.; foaming initiation temperature: 120°C) was added to 100 parts of acrylic polymer X to prepare.
[0165] A heat-expandable pressure-sensitive adhesive sheet as a dici...
Embodiment 2
[0170]
[0171] Based on 100 parts of acrylate-based polymer having ethyl acrylate-methyl methacrylate as the main component (trade name "PARACRONW-197CM", produced by Negami Chemical Industrial Co., Ltd.), 102 parts of epoxy resin 1 (trade name "EPICOAT 1004", produced by Japan Epoxy Resins (JER) Co., Ltd.), 13 parts of epoxy resin 2 (trade name "EPICOAT 827", produced by Japan Epoxy Resins (JER) Co., Ltd. ), 119 parts of phenolic resin (trade name "MILEXXLC-4L", produced by Mitsui Chemicals, Inc.), 222 parts of spherical silica (trade name "SO-25R", produced by Admatechs Co., Ltd.) were dissolved in methyl ethyl ketone, thereby preparing a binder composition solution having a solid concentration of 23.6% by weight.
[0172] The adhesive composition solution was applied on a release-treated film consisting of a PET film having a thickness of 38 μm on which silicone release treatment had been performed as a release liner (separator), and then at 130 °C for 2 minutes. Thus,...
Embodiment 3 to 4
[0175] A dicing die-bonding film was produced in each of Examples 3 to 4 in the same manner as in Example 1 except that the dicing film was changed to the corresponding dicing film having the composition and content shown in Table 1.
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