Recovery processing method of silicon slice cut waste mortar

A silicon wafer cutting and recycling technology, applied in the direction of lubricating compositions, etc., can solve the waste mortar recycling process is not very mature and perfect, the waste mortar cannot be processed in a timely and effective manner, and the deep processing technology of silicon carbide micropowder is not mastered. Achieve the effect of being conducive to environmental protection, saving mortar cost, and high recovery rate

Inactive Publication Date: 2010-09-08
HENAN XINDAXIN SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are such problems in the development process of the solar photovoltaic industry: on the one hand, the demand for cutting fluid and silicon wafer cutting blades by crystalline silicon wafer manufacturers has increased; on the other hand, these manufacturers cannot process the waste mortar after use. Timely and effective processing
[0003] At present, although some manufacturers have begun to try to recycle and treat them, due to the lack of in-depth research on the treatment of cutting fluids for chemical products, and the lack of deep processing technology for silicon carbide powder, the waste mortar recycling process adopted by most manufacturers It is not very mature and perfect, so the treatment effect is not very ideal. After the recycled liquid and recycled sand are put ...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Example 1 The applicant was entrusted to recycle waste mortar for a silicon wafer cutting company in Hebei, and the contract was signed with a recovery rate of 40% for the liquid and 35% for the recovered sand. The recycling process is as follows:

[0032] ① Solid-liquid separation The waste mortar is heated to 60°C after being stirred, and a horizontal screw centrifuge (800r / min) is used for solid-liquid separation; ② The residual cutting fluid in the solid is recovered and separated, and the mass concentration of the solid slurry is 40%. Use a scraper centrifuge to separate, and filter the obtained liquid. Use a first-stage vacuum distillation equipment to reduce the water content in the liquid to 20%. After filtering, use a second-stage vacuum distillation equipment to reduce the water content in the cutting fluid to about 5%. Filter Afterwards, the liquid separated from step 1 is treated in the same way; 3. Separation of silicon carbide and silicon powder Add water ...

Embodiment 2

[0034] Example 2 The applicant was entrusted to recycle waste mortar for a silicon chip cutting enterprise in Jiangxi, and the contract was signed with a recovery rate of 40% for the liquid and 35% for the recovered sand. The recycling process is as follows:

[0035] ① Solid-liquid separation The waste mortar is heated to 80°C after being stirred, and a horizontal screw centrifuge (1000r / min) is used for solid-liquid separation; ② The residual cutting fluid in the solid is recovered and separated. Separation by a scraper centrifuge, filtering the obtained liquid, using a first-stage vacuum distillation equipment to reduce the water content in the liquid to 20%, and using a second-stage vacuum distillation equipment to reduce the water content in the liquid to 10% after filtration, and after filtration and step ①The separated liquid is treated in the same way; ③Separation of silicon carbide and silicon powder Add water to the solid material separated in the previous step to mak...

Embodiment 3

[0036] Embodiment 3 A method for recycling waste mortar from cutting silicon wafers, the steps are as follows:

[0037] ① Solid-liquid separation Adjust the temperature of the silicon wafer cutting waste mortar to 30°C, reduce its viscosity, and separate the waste mortar with a sedimentation centrifuge (centrifugal speed 600r / min); ②Recover the residual cutting fluid in the solid Add water to make slurry (concentration: 20%) of the solid obtained in the first step of separation, and then use a scraper centrifuge to separate, filter the liquid, use a first-stage vacuum distillation equipment to concentrate, reduce the moisture content in the liquid to 20%, and use a second-stage vacuum distillation equipment after filtration Moisture content in the liquid is reduced to below 10%; 3. silicon carbide and silicon powder are separated and the solid material separated in the previous step is added with water to make a slurry (concentration is 25), and 0.02% of the solid mass is added...

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PUM

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Abstract

The invention relates to a recovery processing method of silicon slice cut waste mortar, comprising the following steps: (1) separating solid-liquid components in the silicon slice cut waste mortar; (2) further recovering the remained cutting liquid component in a solid; (3) separating silicon powder and silicon carbide through water flow flotation; (4) recovering the silicon powder; (5) recovering the silicon carbide; (6) coarsely filtering, finely filtering, decoloring, vacuum distilling and dehydrating the recovered cutting liquid, and adding component with corresponding amount for secondary filter. The method can get various recovered products, such as silicon carbide micro powder, cutting liquid and silicon powder, has high recovery rate and recovery profit and can save the cost of the mortar by at least 40 percent; meanwhile, the invention effectively solves the problem of possible secondary pollution caused by single recovery; the cutting function of recovered and treated silicon carbide micro powder is recovered again, thereby changing waste into wealth, realizing the resource reutilization in true sense, and promoting the development of recycling economy; and the method basically realizes the zero emission of waste liquid by reutilizing the treated waste water after combining a sewage treatment process, thereby being beneficial to environment protection.

Description

technical field [0001] The invention relates to the field of silicon wafer cutting, in particular to a method for recycling waste mortar from silicon wafer cutting. Background technique [0002] Against the background of continuous rising prices of non-renewable fuels such as coal and oil, and frequent occurrence of extreme weather around the world, the photovoltaic industry has received strong support from governments of various countries. In particular, a large number of internationally influential photovoltaic companies have emerged in China, such as Wuxi Suntech, Baoding Yingli, Zhejiang Yuhui, Jiangxi LDK and so on. At present, there are such problems in the development process of the solar photovoltaic industry: on the one hand, the demand for cutting fluid and silicon wafer cutting blades by crystalline silicon wafer manufacturers has increased; on the other hand, these manufacturers cannot process the waste mortar after use. Timely and effective processing. However...

Claims

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Application Information

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IPC IPC(8): C01B31/36C10M175/06
Inventor 罗小军宋贺臣姜维海
Owner HENAN XINDAXIN SCI & TECH
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