Recovery processing method of silicon slice cut waste mortar

Abstract

The invention relates to a recovery processing method of silicon slice cut waste mortar, comprising the following steps: (1) separating solid-liquid components in the silicon slice cut waste mortar; (2) further recovering the remained cutting liquid component in a solid; (3) separating silicon powder and silicon carbide through water flow flotation; (4) recovering the silicon powder; (5) recovering the silicon carbide; (6) coarsely filtering, finely filtering, decoloring, vacuum distilling and dehydrating the recovered cutting liquid, and adding component with corresponding amount for secondary filter. The method can get various recovered products, such as silicon carbide micro powder, cutting liquid and silicon powder, has high recovery rate and recovery profit and can save the cost of the mortar by at least 40 percent; meanwhile, the invention effectively solves the problem of possible secondary pollution caused by single recovery; the cutting function of recovered and treated silicon carbide micro powder is recovered again, thereby changing waste into wealth, realizing the resource reutilization in true sense, and promoting the development of recycling economy; and the method basically realizes the zero emission of waste liquid by reutilizing the treated waste water after combining a sewage treatment process, thereby being beneficial to environment protection.

Description

technical field [0001] The invention relates to the field of silicon wafer cutting, in particular to a method for recycling waste mortar from silicon wafer cutting. Background technique [0002] Against the background of continuous rising prices of non-renewable fuels such as coal and oil, and frequent occurrence of extreme weather around the world, the photovoltaic industry has received strong support from governments of various countries. In particular, a large number of internationally influential photovoltaic companies have emerged in China, such as Wuxi Suntech, Baoding Yingli, Zhejiang Yuhui, Jiangxi LDK and so on. At present, there are such problems in the development process of the solar photovoltaic industry: on the one hand, the demand for cutting fluid and silicon wafer cutting blades by crystalline silicon wafer manufacturers has increased; on the other hand, these manufacturers cannot process the waste mortar after use. Timely and effective processing. However...

AI Technical Summary

Problems solved by technology

At present, there are such problems in the development process of the solar photovoltaic industry: on the one hand, the demand for cutting fluid and silicon wafer cutting blades by crystalline silicon wafer manufacturers has increased; on the other hand, these manufacturers cannot process the waste mortar after use. Timely and effective processing

[0003] At present, although some manufacturers have begun to try to recycle and treat them, due to the lack of in-depth research on the treatment of cutting fluids for chemical products, and the lack of deep processing technology for silicon carbide powder, the waste mortar recycling process adopted by most manufacturers It is not very mature and perfect, so the treatment effect is not very ideal. After the recycled liquid and recycled sand are put into use again, the quality problems of recycled materials often cause dirty chips, line marks, and poor mortar cutting ability. Some of the components are recovered, and the comprehensive recovery of various components is not yet possible

[0004] At present, there is no mature technology that can fully recycle sand and cutting fluid is known to the public. For example, Chinese patent document CN101032806A only discloses the recovery of a cutting suspension; CN101474511A discloses a silicon round wire The recovery method of polyethylene glycol and silicon carbide in waste cutting mortar; the recovery method of propylene glycol in waste cutting mortar is disclosed in CN101580458A; the method for recovering silicon powder and silicon carbide powder from cutting waste mortar is disclosed in CN100528488C