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Bismaleimide-triazine resin and preparation method thereof

A bismaleimide and triazine technology, applied in the direction of silicon organic compounds, can solve the problems of unfavorable large-scale application and low yield of POSS-Vi, and achieve easy large-scale production, excellent processability, and preparation process simple effect

Inactive Publication Date: 2012-09-19
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the yield of POSS-Vi synthesized by existing methods is low (18.2%), which is not conducive to large-scale application

Method used

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  • Bismaleimide-triazine resin and preparation method thereof
  • Bismaleimide-triazine resin and preparation method thereof
  • Bismaleimide-triazine resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Weigh 100 parts of N, N'-4,4'-diphenylmethanebismaleimide (BDM) and 43 parts of O, O'-diallyl bisphenol A respectively, and mix 100 parts of Slowly add BDM into O, O'-diallyl bisphenol A; after the BDM is completely dissolved, continue to stir for 10 minutes. A prepolymer of DBA / BDM is obtained.

[0028] Dissolve 49 parts of vinyltrimethoxysilane in 129 parts of methanol, after fully stirring, add 20 parts of deionized water; use hydrochloric acid with a mass concentration of 36.5% to adjust its pH value to 3, in N 2 React under protection for 10 hours. After removing the solvent by distillation under reduced pressure at room temperature, recrystallize in acetone to obtain needle-shaped white crystals, and dry them in vacuum at 60°C to obtain octavinyl cage silsesquioxane (POSS-Vi) white solid powder. Its structural formula for:

[0029]

[0030] Weigh 18 parts of POSS-Vi, and slowly add it into the DBA / BDM prepolymer at a temperature of 120°C under the condition ...

Embodiment 2

[0033] Weigh 100 parts of N,N'-4,4'-diphenylmethane bismaleimide (BDM) and 86 parts of diallyl bisphenol A, slowly add 100 parts of BDM to the bisphenol Allyl bisphenol A; after the BDM is completely dissolved, continue to stir for 30 minutes. A prepolymer of DBA / BDM is obtained.

[0034] Dissolve 55 parts of vinyltrimethoxysilane in 140 parts of methanol, and after fully stirring, add 20 parts of deionized water; use acetic acid to adjust the pH value to 3, in N 2 React under protection for 10 hours. After removing the solvent by distillation under reduced pressure at room temperature, recrystallize in acetone to obtain needle-shaped white crystals, and dry them in vacuum at 60°C to obtain octavinyl cage silsesquioxane white solid powder.

[0035] Weigh 18 parts of POSS-Vi, and slowly add it into the DBA / BDM prepolymer at 140°C under the condition of stirring. After the POSS-Vi was added, the stirring was continued for 15 minutes to obtain a prepolymer of POSS-Vi / DBA / BDM. ...

Embodiment 3

[0038]Weigh 100 parts of N,N'-4,4'-diphenylmethane bismaleimide (BDM) and 86 parts of diallyl bisphenol A, slowly add 100 parts of BDM to the bisphenol Allyl bisphenol A; after the BDM is completely dissolved, continue to stir for 25 minutes. A prepolymer of DBA / BDM is obtained.

[0039] Dissolve 63 parts of vinyltriethoxysilane in 150 parts of ethanol, stir well, add 20 parts of deionized water; use acetic acid to adjust the pH value to 3, in N 2 React under protection for 10 hours. After removing the solvent by distillation under reduced pressure at room temperature, recrystallize in acetone to obtain needle-shaped white crystals, and dry them in vacuum at 60°C to obtain octavinyl cage silsesquioxane white solid powder.

[0040] Weigh 18 parts of POSS-Vi, and slowly add it into the DBA / BDM prepolymer at a temperature of 140°C under the condition of stirring. After the POSS-Vi was added, the stirring was continued for 15 minutes to obtain a prepolymer of POSS-Vi / DBA / BDM. ...

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Abstract

The invention relates to a bismaleimide-triazine resin containing octavinyl polyhedral oligomeric silsesquioxane and a preparation method thereof. By weight, 100 parts of bismaleimide is slowly added into O,O'-diallylbisphenol A under 120 DEG C to 140 DEG C, so that prepolymer I is obtained; 1894 parts of octavinyl polyhedral oligomeric silsesquioxane is slowly added into the prepolymer I with the temperature of 120 DEG C to 140 DEG C, so that prepolymer II is obtained; 215 to 280 parts of cyanate ester is weighed and slowly added into the prepolymer II, the temperature is increased to 140 DEG C to 160 DEG C, stirring is carried out for 1 to 2 hours while the temperature is kept, and thereby the bismaleimide-triazine resin containing the octavinyl polyhedral oligomeric silsesquioxane is obtained. The preparation technique is simple and easy to operate, and has wide applicability; and the produced resin can be used as base material for the preparation of high-performance copper-clad plates and the like in the field of electronic information, as well as the preparation of advanced resin-based composite material, adhesive, insulating paint and the like, so the resin has a wide application prospect.

Description

technical field [0001] The invention relates to a high-performance resin and a preparation method thereof, in particular to a bismaleimide-triazine resin containing octavinyl cage silsesquioxane and a preparation method thereof, belonging to the technical field of polymer materials . Background technique [0002] Bismaleimide triazine (BT) resin is a resin system composed of bismaleimide (BMI) and cyanate ester (CE), which has outstanding heat resistance, dielectric properties, and heat and humidity resistance , as well as excellent mechanical properties, chemical resistance, radiation resistance, wear resistance and dimensional stability, is considered to be one of the most potential resin varieties for the preparation of high-frequency and high-speed printed circuit boards (PCBs). The production of BT resin in my country is still blank. The development of BT resin-based PCB boards abroad is mainly carried out in the United States and Japan, and the overall level is still...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C07F7/21
Inventor 顾嫒娟胡江涛梁国正卓东贤袁莉
Owner SUZHOU UNIV